Wafer detection system

Abstract

The invention relates to a wafer detection system comprising the following steps: loading a wafer and positioning the wafer with a map file corresponding to the wafer, wherein, the map file is of a first file format; examining the appearance of the wafer; recording and correcting the data of the map file if the appearance of the wafer is not good; and storing the corrected map file. Thereby, direct correction and marking of the map file can be carried out, and detection time can be effectively saved.

Description

technical field [0001] The invention relates to a wafer detection system, in particular to a wafer detection system which directly modifies map files to improve detection efficiency. Background technique [0002] With the gradual application of electronic concepts such as personal mobile information, e-commerce, global communication, and digital home in modern life, the semiconductor manufacturing industry is growing rapidly in response to the needs of various applications. In contrast, the increase in production capacity and yield rate in the semiconductor manufacturing process also improves the development of the semiconductor industry. [0003] Generally speaking, in order to implement circuit functions on a semiconductor substrate, the semiconductor substrate must go through the following steps, such as deposition of metal layers, patterning on each layer of material by yellow light process, ion implantation and other related processes. In order to ensure that the resul...

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Problems solved by technology

[0005] However, in the existing process, the result of manual inspection cannot be traced back to the result of electrical measurement, so there is a great incompatibility between the two in terms of coordination and connection, which makes the time schedule of manual inspection affect the overall production capacity output, which is more likely to cause inaccurate detection results

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