Charging and discharging device for silicon wafer multi-line cutting machine

Abstract

The invention discloses a charging and discharging device for a silicon wafer multi-line cutting machine, which comprises a body, a sliding block and a positioning assembly, wherein the lower part of the body is provided with a guide slot; the sliding block is positioned in the guide slot to slide along the guide slot; the lower part of the sliding block is provided with a guidance sliding plate; the positioning assembly is positioned above the body and comprises a connecting block, a first positioning block and a second positioning block, wherein the first positioning block is used for positioning a cutting machine door; the second positioning block is used for positioning the bracket of a charging and discharging trolley; and the position of the opened cutting machine door is conveniently positioned by the first positioning block. In the charging and discharging device for a silicon wafer multi-line cutting machine, the sliding mechanism serves as an intermediate to charge and discharge so as to greatly reduce the sliding of a crystal support; after the sliding block slides in advance to finish butt joint, the crystal support only needs to slid along the rail to avoid the defect of difficulty in positioning by adopting the crystal support in the prior art; meanwhile, the design of the positioning block causes positioning in the charging process to be simpler and more convenient; and the working efficiency of charging is improved.

Description

technical field [0001] The invention relates to a multi-wire cutting machine, in particular to a silicon wafer multi-wire cutting machine loading and unloading device suitable for high-level loading and unloading. Background technique [0002] At present, silicon wafers for solar cells are cut from silicon blocks or rods by multi-wire cutting machines. Such as figure 1 As shown, the existing silicon wafer multi-wire cutting machine loading and unloading tooling is composed of two 100mm guide plates. After the crystal rod needs to be installed on the crystal holder, the crystal rod needs to be slid on the guide plate and pushed into the station. When the workpiece is loaded and unloaded, two guide plates need to be aligned, and the adjustment is difficult; secondly, because the guide plate is too short, the distance from the workpiece table is about 200mm, and the ingot is prone to offset during loading and unloading, causing the ingot to collide or get stuck; thirdly , The...

AI Technical Summary

Problems solved by technology

When the workpiece is loaded and unloaded, two guide plates need to be aligned, and the adjustment is difficult; secondly, because the guide plate is too short, the distance from the workpiece table is about 200mm, and the ingot is prone to deflection during loading and unloading, causing the ingot to collide or get stuck; thirdly , the long-term wear of the guide plate will cause the crystal holder to be pushed into the station to shake, and more serious accidents will cause the crystal rod to dislocate

Images