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Laser scribing equipment for silicon-based thin film solar cells

A solar cell and laser scribing technology, which is applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems that laser scribing equipment can not take into account cost and scribe complex graphics at the same time, and affect the electrical performance of solar cells, etc. To achieve the effects of avoiding the influence of the external environment, reducing equipment costs, and reducing the number of uses

Active Publication Date: 2015-09-02
SHEN ZHEN TRONY SCI & TECH DEV CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention solves the technical problem that the existing laser scribing equipment cannot simultaneously take into account the cost and scribing complex graphics, and at the same time overcomes the problems that the traditional laser scribing equipment produces some particles with smaller diameters during operation, which affects the electrical performance of solar cells, etc.

Method used

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  • Laser scribing equipment for silicon-based thin film solar cells
  • Laser scribing equipment for silicon-based thin film solar cells
  • Laser scribing equipment for silicon-based thin film solar cells

Examples

Experimental program
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Effect test

Embodiment 1

[0027] See figure 1 and figure 2 The laser scribing equipment of this embodiment includes a laser 1, a beam expander 2, a beam splitter 3, a Z-axis galvanometer 4, an X-axis galvanometer 5, a focusing mirror 6, and a protective mirror 7. A beam of laser light emitted by the laser 1 passes through After the beam expander 2, the beam splitter 3 divides the refracted light in the X-axis and the reflected light in the Y-axis. The refracted light is polarized by the Z-axis galvanometer 4 and then passes through the X-axis galvanometer 5, so that the laser goes upward and then passes through the focusing mirror 6 Arrive at the surface of the film layer of the substrate for marking, and at the same time another beam of reflected light is polarized by another Z-axis galvanometer 4 and then passes through the X-axis galvanometer 5, so that the laser goes upward and then reaches the surface of the substrate film layer through the focusing mirror 6 , for scribing, and two laser beams a...

Embodiment 2

[0032] See figure 1 and figure 2 , the laser scribing equipment of this embodiment includes a laser 1, a beam expander mirror 2, a beam splitter 3, a Z-axis vibrating mirror 4, an X-axis vibrating mirror 5, a focusing mirror 6, a protective mirror 7, a Z-axis vibrating mirror 4 and a beam splitting mirror There is also a light blocking device 9 between them. A beam of laser light emitted by the laser 1 passes through the beam expander 2 and is divided into the X-axis refracted light and the Y-axis reflected light by the beam splitter 3. The refracted light passes through the Z-axis vibrating mirror 4 After polarization, it passes through the X-axis galvanometer 5, so that the laser light goes upward and then reaches the surface of the substrate film layer through the focusing lens 6 for marking, while another beam of reflected light is polarized by another Z-axis galvanometer 4 and then passes through the X-axis The vibrating mirror 5 makes the laser upward and then reaches ...

Embodiment 3

[0035] See figure 1 and Figure 4 , the laser scribing equipment of this embodiment includes a laser 1, a beam expander 2, a beam splitter 3, a Z-axis galvanometer 4, an X-axis galvanometer 5, a focusing mirror 6, a protective mirror 7 and a reflector 8, and the laser 1 emits A beam of laser light passes through the beam expander 2 and is divided into X-axis refracted light and Y-axis reflected light by the beam splitter 3. The refracted light is polarized by the Z-axis galvanometer 4 and then passes through the X-axis galvanometer 5, so that the laser goes upward and then After the focusing mirror 6 reaches the surface of the substrate film layer, it is scored, and at the same time, another beam of reflected light passes through a reflector 8 to reflect the optical path into the X axis consistent with the refracted light, and the reflected light passes through another Z axis. The mirror 4 is polarized and then passes through the X-axis vibrating mirror 5, so that the laser l...

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Abstract

The invention relates to a silicon-based thin-film solar battery laser scribing equipment, which belongs to the technical field of solar battery equipment. In order to solve the technical problem that the existing laser scribing equipment cannot take into account the cost and scribe complex graphics at the same time, a laser scribing equipment for silicon-based thin film solar cells is designed, including the optical system installed on the support, the substrate table, the optical system It is mainly composed of a laser, a beam expander, and a focusing mirror. The output end of the laser is equipped with a beam expander. The optical system also includes a beam splitter and a vibrating mirror installed between the beam expander and the focusing mirror. The beam expander enters the beam splitter and is divided into reflected light and refracted light. The reflected light and refracted light respectively enter the corresponding vibrating mirror and condenser mirror to form parallel laser beams to scratch the film layer. The invention can not only mark large-sized batteries with complex patterns, but also reduce the number of lasers used, effectively reduce equipment costs, and improve production efficiency.

Description

technical field [0001] The invention relates to a silicon-based thin-film solar battery laser scribing equipment, which belongs to the technical field of solar battery equipment. Background technique [0002] Laser scribing equipment is an indispensable key equipment in the manufacture of silicon-based thin film solar cells. It is used to form a structure of internal multi-junction sub-cell interconnection through laser scribing on the deposited film. The principle is to use specific energy and pulse The frequency laser beam is focused on the film layer that needs to be marked, and the film layer in the radiation area is removed by using physical processes such as thermal effect and thermal stress generated by the interaction between the laser beam and the film layer. The typical manufacturing process of silicon-based thin-film solar cells requires three laser scribing processes, that is, laser scribing of the conductive film layer of the front electrode (called P1 scribing...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/36B23K26/04B23K26/064B23K26/142H01L31/18
CPCB23K26/04B23K26/046B23K26/064B23K26/142B23K26/361B23K26/40B23K26/702B23K2101/40B23K2103/50H01L31/18Y02P70/50
Inventor 李毅雷明初
Owner SHEN ZHEN TRONY SCI & TECH DEV CO LTD
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