Self-assembled monolayers for patterned formation

Abstract

The present disclosure relates to patterned self-assembled monolayers, and more particularly to a process for fabricating semiconductor devices. In some embodiments, a semiconductor device includes a patterned surface. Patterns can be formed from self-assembled monolayers. The disclosed process provides self-assembled monolayers that can be deposited rapidly, thus increasing production throughput and reducing cost, as well as providing patterns that are generally uniform in shape.

Description

technical field [0001] The present invention relates to the field of semiconductors, and more particularly, to self-assembled monolayers for patterned formation. Background technique [0002] The continuing trend in semiconductor technology is to build integrated circuits with more and / or faster semiconductor devices. However, as always, some existing fabrication techniques cannot be used with sufficient precision in fabricating the next generation of integrated circuit devices, as device sizes shrink from generation to generation. For example, spacers are used in conventional semiconductor devices to provide alignment of source and drain regions with gates in transistors. Subtle differences in the uniformity and shape of the spacers are sufficient to alter the operational characteristics of the device. Contents of the invention [0003] In order to solve the above problems, the present invention provides a method for manufacturing a semiconductor device, comprising: pro...

AI Technical Summary

Problems solved by technology

However, as always, some existing fabrication techniques cannot be used with sufficient precision in the fabrication of next-generation integrated circuit devices, as device sizes get smaller from one generation to the next.

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