Liquid plating device for inner hole of slender pipe fitting

Abstract

The invention belongs to the technical field of electroplating and relates to a liquid plating device for an inner hole of a slender pipe fitting. The liquid plating device is characterized in that an upper cap and a lower cap are respectively in threaded connection with the upper and lower ends of the slender pipe fitting, wherein an upper insulating plate is inserted into a step table at the upper end of the upper cap, and a lower insulating plate is inserted into a step table at the lower end of the lower cap; an anode plate simultaneously penetrates through the upper insulating plate and the lower insulating plate, and a nut is in threaded connection with the lower end of the anode plate; the upper end of the anode plate is connected to the anode of a power supply through a nut lead-out lead; a cathode suspension frame is fixed at the outer wall of the slender pipe fitting, and hangers of the cathode hanging frame are connected with the cathode of the power supply and are used for hanging the slender pipe fitting in a liquid plating box; a rotating shaft of a pump body is driven by a motor, an output port of the pump body is communicated with a plating trough liquid inlet of the lower cap through a plating trough liquid inlet pipeline, and an input port of the pump body is communicated with the part below the liquid surface of the liquid plating box through a liquid return pipeline. According to the liquid plating device, the circulation of the plating liquid in the inner hole of the slender pipe fitting can be accelerated, the deposition velocity of a plating layer can be improved, the liquid plating efficiency can be increased, the liquid plating workload can be reduced, and the production cost can be lowered.

Description

technical field [0001] The invention relates to a plating solution device for an inner hole of a slender pipe fitting, belonging to the technical field of electroplating. Background technique [0002] At present, the chrome plating of the inner hole of traditional pipe fittings does not use any plating solution device, and the bubbles generated by the reaction between the cathode and the anode during the electroplating process drive the convection of the plating solution to supplement the consumption of the plating solution in the inner cavity. When chrome-plating the inner hole of a small-diameter pipe fitting with a large aspect ratio according to the traditional method, due to the small diameter, the fluidity of the inner hole solution is poor, and the chromium ions consumed near the cathode cannot be replenished in time. As a result, the deposition speed of the chromium plating layer is slow, the efficiency is low, and the workload and production cost of the chromium pla...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problems of poor fluidity of the inner cavity solution and low chrome plating e...

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