A glue coating method and device

Abstract

The invention discloses a glue applying method and device. The glue applying method comprises the following steps: arranging a glass substrate onto which glue is to be applied on a pre-arranged lifting glass substrate platform; arranging a steel sheet with a glue applying area above the glass substrate platform; arranging a cup-shaped glue container with a metal ring-shaped cutter edge on the steel sheet to form a closed space; enabling the lifting glass substrate platform to cling to the steel sheet after the platform rises; injecting glue into the cup-shaped glue container; and driving the cup-shaped glue container to move at a constant velocity by a pre-arranged movement mechanism and applying the glue onto the glass substrate through a pre-formed hole in the steel sheet.

Description

technical field [0001] The invention relates to a glue coating method and a device, belonging to the technical field of touch screen and liquid crystal display module lamination. Background technique [0002] In the production process of liquid crystal display touch screen, gluing is a very important process. Glue bonds the liquid crystal screen and the outer tempered glass into one. The glue layer is required to be uniform, flat and free of air bubbles, otherwise it will affect the display effect of the LCD screen. In the production of the existing bonding technology, the dispensing of the dispensing head is mainly controlled by the solenoid valve. In order to ensure the accuracy of the dispensing, the moving speed of the dispensing head is slow and the efficiency is low. The disadvantages of this process are mainly glue Uneven layer, uneven glue edge, low efficiency, low yield and other defects. [0003] In addition, in the patent No. CN103551291A, a method and device fo...

AI Technical Summary

Problems solved by technology

The glue layer is required to be uniform, flat, and free of air bubbles, otherwise it will affect the display effect of the LCD screen

In the production of the existing bonding technology, the dispensing of the dispensing head is mainly controlled by a solenoid valve. In order to ensure the accuracy of the dispensing, the moving speed of the dispensing head is slow and the efficiency is low. The disadvantages of this process are mainly glue Defects such as uneven layers, uneven glue edges, low efficiency, and low yield

[0003] In addition, in the patent No. CN103551291A, a method and device for applying glue by using screen technology are mentioned. Compared with the dispensing process, this process has improved efficiency and improved uniformity of the adhesive layer. However, the problem of uneven glue edges cannot be solved, and because of the inherent thin glue layer and glue drawing of the screen technology, the yield rate is lower than that of the dispensing process.

Images