Heat radiation assembly and display card module
A heat dissipation component and display card technology, applied in digital data processing components, cooling/ventilation/heating transformation, instruments, etc., can solve the problems of reduced heat dissipation, stagnation, turbulence, etc., to improve heat exchange and good heat dissipation Efficacy, good heat dissipation effect
Active Publication Date: 2014-10-15
GIGA BYTE TECH CO LTD
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Problems solved by technology
[0006] In view of the above problems, the present invention provides a heat dissipation assembly and a display card module, so as to solve the problem that the axial flow fan of a conventional radiator supplies air vertically downward from the top of the body, and the rotating airflow sent by the fan will vertically hit the body to generate turbulence. The flow makes the air flow unable to flow smoothly, but stays between the fins, resulting in a reduction in the heat dissipation effect, which in turn affects the operating performance of the heating element
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Embodiment Construction
[0032] The heat dissipating assembly 200 of an embodiment of the present invention disclosed below takes the heat dissipating assembly of the display card module as the description of the embodiment, but it is not limited to the type disclosed in this embodiment. The appearance of the heat dissipation assembly 200 of the present invention is changed correspondingly according to actual design requirements or usage requirements.
[0033] Please refer to Figure 1 to Figure 2 Shown is an exploded schematic diagram and an assembled schematic diagram of a display card module disclosed by an embodiment of the present invention. The display card module 10 of this embodiment includes a circuit board 100 and a heat dissipation assembly 200, wherein the circuit board 100 has a connection interface 110 and a heating element 120, the connection interface 110 is arranged on one side of the circuit board 100, which can be However, it is not limited to standard gold finger structures such a...
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The invention relates to a display card module, including a circuit board and a heat radiation assembly. The heat radiation assembly is correspondingly arranged on a heating element of the circuit board, the heat radiation assembly includes a radiator and a plurality of centrifugal fans, the radiator has a plurality of heat radiation fins, and a plurality of heat radiation channels are formed among the heat radiation fins. The plurality of centrifugal fans are arranged at one side of the radiator and are corresponding to the plurality of heat radiation channels, each centrifugal fan has an air inlet and an air outlet, the air inlets are adjacent to the heat radiation channels, the air outlets are arranged at the other sides of the centrifugal fan relative to the radiator, thereby generating negative pressure to drive airflow to quickly flow in an airflow channel, and achieving a good heat exchange effect between airflow and the radiator, and a blowing direction of the centrifugal fans and a position where the radiator is placed are utilized to form a smooth airflow circulating path, thereby achieving good heat radiation efficiency and heat radiation effects.
Description
【Technical field】 [0001] The invention relates to a cooling assembly and a display card module, in particular to a cooling assembly with a fan and a display card module with the cooling assembly. 【Background technique】 [0002] With the vigorous development of the high-tech industry in recent years, the volume of electronic components in electronic products tends to be miniaturized, and the density per unit area is also higher and higher, and the overall performance is continuously enhanced. In these factors In this case, a heat sink that can ensure sufficient cooling capacity in a narrow area is also required. Keep the operating temperature of each component of the electronic device within a reasonable range to promote heat exchange with the environment. [0003] A conventional heat sink mainly includes a body with multiple heat dissipation fins, and in order to improve heat dissipation efficiency, an axial flow fan is usually added, which is fixed on the heat dissipation ...
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IPC IPC(8): H05K7/20G06F1/20
Inventor黄顺治毛黛娟
OwnerGIGA BYTE TECH CO LTD