A Copper Wire Bundle Kidnapped

Abstract

The invention relates to a copper wire binding frame. The copper wire binding frame mainly comprises a main frame. A large round base is arranged at the lower end of the main frame. Double guide rail sets which coincide with the center of the large round base and are arranged in the radial direction are evenly distributed on the large round base. An arc baffle is arranged above each double guide rail set. The lower ends of the arc baffles are provided with annular siding grooves. The sliding grooves are each in sliding connection with two sliding blocks in sliding connection with the double rail sets. The copper wire binding frame is simple in structure, overflow of a copper wire can be effectively prevented, and no matter what the binding number of copper wires is, the copper wires can be pressed through the arc baffles in a sliding manner, and overflow is prevented.

Description

technical field [0001] The invention is designed in the field of metal product processing, specifically a copper wire binding. Background technique [0002] Generally speaking, after processing the finished copper wire, people wrap it around the bundle for easy carrying and storage. But after this kind of binding, the copper wire tends to overflow in the radial direction under the action of its own elasticity, thus occupying more space. In this regard, someone came up with the method of binding a protective frame on the outer layer to prevent the overflow of copper wires, but because the amount and thickness of copper wires bound each time are different, this method cannot be widely used. Contents of the invention [0003] Aiming at the above technical problems, the present invention proposes a copper wire binding that can effectively prevent copper wires from overflowing. [0004] A bundle of copper wires mainly includes a main body frame, the lower end of which is prov...

AI Technical Summary

Problems solved by technology

In this regard, someone came up with the method of binding a protective frame on the outer layer to prevent the overflow of copper wires, but because the amount and thickness of copper wires bound each time are different, this method cannot be widely used

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