An interactor that improves heat dissipation and intercommunication
An interactor and interoperability technology, applied in instrumentation, computing, electrical and digital data processing, etc., can solve the problems of inconvenient air flow, large space occupation, and high cost, and achieve the effect of reducing cost, saving space and improving heat dissipation performance.
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[0023] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. In the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the drawings and in combination with the embodiments.
[0024] see Figure 1 to Figure 3 , the present invention provides an interactor with good heat dissipation and good intercommunication, including a cabinet 10, a backplane 20 placed in the cabinet 10, a plug-in card 30 installed on the backplane 20, and a fan module installed in the cabinet 10 40 and power module 50.
[0025] The cabinet 10 includes a cabinet body 11 and a cover body 12 inst...
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