An interactor that improves heat dissipation and intercommunication

An interactor and interoperability technology, applied in instrumentation, computing, electrical and digital data processing, etc., can solve the problems of inconvenient air flow, large space occupation, and high cost, and achieve the effect of reducing cost, saving space and improving heat dissipation performance.

Active Publication Date: 2018-09-25
广州凯媒通讯技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing communication equipment, when the signals of two radio frequency boards are connected, a vertical backplane is set up in the case, and plug connectors are respectively arranged on the two board surfaces of the backplane, and the two radio frequency boards are plugged into the backplane respectively. The plug connectors on both sides are perpendicular to the backplane to realize the connection of the signals of the two RF boards. Due to the backplane blocking of this structure, it is not convenient for the wind to flow in from one end of the chassis and flow out from the other end of the chassis, causing communication equipment The heat dissipation performance of the backplane is not good; secondly, the two RF modules connected on both sides of the backplane are one-to-one docking on the same plane, and one-to-many docking cannot be realized, and the signal intercommunication with other RF boards cannot be effectively achieved. Higher cost and larger footprint

Method used

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  • An interactor that improves heat dissipation and intercommunication
  • An interactor that improves heat dissipation and intercommunication
  • An interactor that improves heat dissipation and intercommunication

Examples

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Embodiment Construction

[0023] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. In the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the drawings and in combination with the embodiments.

[0024] see Figure 1 to Figure 3 , the present invention provides an interactor with good heat dissipation and good intercommunication, including a cabinet 10, a backplane 20 placed in the cabinet 10, a plug-in card 30 installed on the backplane 20, and a fan module installed in the cabinet 10 40 and power module 50.

[0025] The cabinet 10 includes a cabinet body 11 and a cover body 12 inst...

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Abstract

The invention provides an interactive device for improving the heat dissipation performance and the intercommunity. The interactive device comprises an equipment cabinet, a backboard, plug-in cards, a fan module and a power supply module, wherein the backboard is arranged in the equipment cabinet; the plug-in cards are arranged on the backboard; the fan module is arranged in the equipment cabinet; a plurality of plugging interfaces are formed in the backboard for installing the plug-in cards; a plurality of through holes are formed in the backboard; the plug-in cards are inserted into a front board surface and a rear board surface of the backboard; the plug-in cards on the front board surface and the rear board surface are of a quadrature fork structure and are inserted through the through holes; and quadrature of a digital signal and quadrature of a radio-frequency signal are achieved. The interactive device and the backboard are connected via the quadrature fork structure through the plug-in cards; quadrature of the digital signal and quadrature of the radio-frequency signal are achieved; signals among the plug-in cards are switched; signal intercommunication between any two plug-in cards in the multiple plug-in cards is achieved; and the heat dissipation performance of the interactive device is improved. Secondly, by the interactive device, the space is saved and the cost is reduced.

Description

technical field [0001] The invention relates to a communication device, in particular to an interactor with improved heat dissipation and intercommunication. Background technique [0002] Communication equipment is mainly used as a cable TV set-top box and Cable modem to access the communication system of the broadcasting network. During the signal transmission process of the communication equipment, when the line card in the communication equipment is broken, the original signal of this line card needs to be switched to the backup board, and the fan module needs to be used to dissipate heat from each mechanism in the communication equipment to ensure communication. The device is working normally. In the existing communication equipment, when the signals of two radio frequency boards are connected, a vertical backplane is set up in the case, and plug connectors are respectively arranged on the two board surfaces of the backplane, and the two radio frequency boards are plugg...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): G06F1/20
CPCH05K7/1452H05K7/20172
Inventor郭志毅
Owner广州凯媒通讯技术有限公司