bond wire connection

A bonding wire and lead technology, applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve problems such as low reliability

Active Publication Date: 2021-11-30
NXP BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Additionally, some packages may have to have a minimum reliability to meet consumer requirements

Method used

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Examples

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Embodiment Construction

[0018] figure 1 An example of an integrated circuit package 100 is shown. Integrated circuit package 100 includes an integrated circuit die 101 and a lead frame including leads 102 and lead frame pads 104 on which die 101 may be mounted. Bond wires 105 are provided to couple die 101 to leads 102 . Bond wire 105 may be coupled to lead 102 using wedge bond 106 . Bond wire 105 may form an angle 107 relative to lead 102 at which angle a wedge bond is formed. The package may be formed by encapsulating die 101 , lead frame pad 104 , bond wire 105 and portions of leads 102 on which wedge bonds 106 are formed to provide body 103 .

[0019] figure 1 The wedge bond 106 of the integrated circuit package 101 may be susceptible to wedge bond cracking. Specifically, these cracks may form when the integrated circuit package is subjected to stress (eg, mechanical or thermal stress). It should be appreciated that the presence of wedge bond cracks may adversely affect the reliability of p...

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Abstract

The invention provides an integrated circuit package. The integrated circuit package includes: a die; a lead; and a bond wire including a first end coupled to the die and a second end coupled to the lead via a bond. The bond wire further includes: a first portion positioned between the first bent portion in the bond wire and the bond and forming a first angle with respect to the lead; and a first portion forming a second angle with respect to the lead. two parts. The first curved portion is intermediate the first and second portions and is configured to reduce the angle of the bond wire relative to the lead from the second angle to the first angle.

Description

technical field [0001] The present invention relates to wire bonding in integrated circuit packages, and in particular, but not exclusively, to wedge bonding of bond wires between a die and a lead. Background technique [0002] Integrated circuit packages may be formed by encapsulating the die and portions of the lead frame with a compound (eg, epoxy molding compound). Prior to encapsulation, the die may be coupled to the leads of the lead frame via one or more bond wires that form a loop between the die and the leads. Bond wires may be bonded to leads using wire bonding. One method of wire bonding is wedge bonding. In wedge bonding, ultrasonic waves may be used to apply the bond wire to the leads. [0003] An integrated circuit package may be tested to determine whether it complies with minimum standards. A subset of these tests may include stress tests, such as life tests, which may cause or exacerbate cracks in wedge joints. In some cases, cracks may result from dela...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): H01L23/535H01L21/60
CPCH01L23/535H01L24/43H01L2924/181H01L23/4952H01L24/85H01L2224/48095H01L2224/48247H01L2224/48465H01L2224/85181H01L2224/85205H01L2924/00014H01L2924/3512H01L2924/386H01L2224/32245H01L2224/73265H01L24/48H01L2224/48472H01L2924/00012H01L2224/45099H01L2224/05599H01L2224/85399H01L2924/00H01L21/4825H01L21/565H01L23/3114H01L23/49503H01L23/49541H01L2224/48245H01L2224/85047
Inventor威瓦·坦翁旺比耶拉·素旺那卡查农·素旺卡萨布
OwnerNXP BV