Electronic package and production method thereof

A technology for electronic packaging and electronic components, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., and can solve the problem of abnormal electrical operation of semiconductor packages, mutual electromagnetic interference between chips and chips, and affecting electrical properties. Efficiency and other issues

Inactive Publication Date: 2017-10-31
SILICONWARE PRECISION IND CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, when the semiconductor package is in operation, because it does not have an Electromagnetic Interference (EMI) shielding structure, each chip is easily subjected to external electromagnetic interference or is prone to mutual electromagnetic interference between the chips, resulting in The electrical operation of the semiconductor package is not functioning properly, thereby affecting the overall electrical performance

Method used

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  • Electronic package and production method thereof
  • Electronic package and production method thereof
  • Electronic package and production method thereof

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Embodiment Construction

[0032] The implementation of the present invention will be described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0033] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the same time, terms such as "above", "first", "s...

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PUM

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Abstract

The invention discloses an electronic package and a manufacturing method thereof, the electronic package comprising: a carrying structure, a first electronic component, a second electronic component disposed on the carrying structure, a shielding structure covering the first electronic component but not covering the second electronic component, and a package covering the shielding structure and the second electronic component; so that the first electronic component will not be exposed to external electromagnetic interference when the electronic package is operated, and the first and second electronic components will not interfere with each other electromagnetically, the electrical operation function of the electronic package can be fulfilled normally and the electrical performance of the electronic package will not be affected.

Description

technical field [0001] The invention relates to an electronic package and its manufacturing method, especially to an electronic package with electromagnetic shielding and its manufacturing method. Background technique [0002] With the vigorous development of the electronic industry, electronic products are gradually moving towards the trend of multi-function and high performance. In order to meet the multi-functional requirements of the electronic package, multiple chips need to be arranged in the semiconductor package. [0003] However, when the semiconductor package is in operation, because it does not have an Electromagnetic Interference (EMI) shielding structure, each chip is easily subjected to external electromagnetic interference or is prone to mutual electromagnetic interference between the chips, resulting in The electrical operation function of the semiconductor package is abnormal, thereby affecting the overall electrical performance. [0004] Therefore, how to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/552H01L21/60
CPCH01L23/552H01L24/97H01L2224/16225H01L2224/48091H01L2224/73204H01L2224/73265H01L2924/181H01L2924/00014H01L2924/00012
Inventor 张翊峰钟兴隆黄荣邦钟匡能林辰翰
Owner SILICONWARE PRECISION IND CO LTD
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