Electronic device and manufacturing thereof

A technology for electronic packaging and electronic components, which is applied in the manufacturing of electrical components, electrical solid-state devices, semiconductor/solid-state devices, etc., can solve the problem of abnormal electrical operation function of the semiconductor package 1, affecting the electrical performance of the semiconductor package 1, etc. question

Inactive Publication Date: 2017-06-27
SILICONWARE PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] However, when the existing semiconductor package 1 is in operation, because it does not have an electromagnetic interference (EMI) shielding structure, it is easy to suffer from external electromagnetic interference (EMI), resulting in electrical failure of the semiconductor package 1. Sexual function is not normal, thus affecting the overall electrical performance of the semiconductor package 1

Method used

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  • Electronic device and manufacturing thereof
  • Electronic device and manufacturing thereof
  • Electronic device and manufacturing thereof

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Embodiment Construction

[0053] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0054] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the implementation of the present invention. Conditions, so it has no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size shall still fall within the scope of the present invention without affecting the effect and purpose of the present invention. The disclosed technical content must be within the scope covered. At the same time, terms such as "above", "first", "second", and "a" quoted in thi...

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Abstract

The invention provides an electronic device and the manufacturing thereof. The electronic device comprises: an insulating layer, an electronic component embedded in the insulating layer and exposed to the surface of the insulating layer, a wiring structure formed on the insulating layer and the electronic component, An electric conductor embedded in the insulating layer, and a conductive layer formed on the insulating layer and contacting the electric conductor, and the conductive body and the conductive layer are shielded so that the periphery of the electronic component is covered with a shield structure, When the electronic package is operated, the electronic component does not suffer from electromagnetic interference from the outside.

Description

technical field [0001] The invention relates to a method for manufacturing an electronic package, in particular to an electronic package with a shielding structure and a method for making the same. Background technique [0002] With the vigorous development of the electronic industry, electronic products are gradually moving towards the trend of multi-function and high performance. In order to meet the packaging requirements of miniaturization of electronic packages, a technology of wafer level packaging (WLP for short) has been developed. [0003] Figure 1A to Figure 1E It is a schematic cross-sectional view of the manufacturing method of the conventional wafer-level semiconductor package 1 . [0004] Such as Figure 1A As shown, a thermal release tape 11 is formed on a carrier 10 . [0005] Next, place a plurality of semiconductor elements 12 on the thermal release adhesive layer 11, these semiconductor elements 12 have opposite active surfaces 12a and inactive surface...

Claims

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Application Information

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IPC IPC(8): H01L23/552H01L21/60
CPCH01L23/552H01L24/80H01L2224/96H01L2924/18162H01L2924/3025H01L2224/04105H01L2224/12105
Inventor 陈彦亨江政嘉王隆源黄富堂
Owner SILICONWARE PRECISION IND CO LTD
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