Anti-rebound hardware punching die

A technology for stamping dies and hardware, applied in the field of anti-bounce metal stamping dies, can solve the problem of scrap rebound, and achieve the effect of preventing scrap rebound, placing stability, and reducing jitter.

Inactive Publication Date: 2018-10-19
肖涵
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide an anti-bounce metal stamping die to solve the problem that the punched waste material and the punch head stick together when the hardware proposed in the background technology is punched by the punch head, which will cause the waste material to bounce back cause problem

Method used

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  • Anti-rebound hardware punching die
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  • Anti-rebound hardware punching die

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Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0021] see Figure 1~4 , in an embodiment of the present invention, an anti-bounce metal stamping die includes a fixed base plate 1, a support rod 101, a support frame 102, a lower die seat 2, hardware parts 6, a stamping head 7 and an upper die seat 8, and a fixed base plate 1 The top on the left side is fixedly connected with a support rod 101, the top of the support rod 101 is fixedly connected with a support frame 102, the middle part above the fixed botto...

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PUM

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Abstract

The invention discloses an anti-rebound hardware punching die. The punching die comprises a fixed bottom plate, a supporting rod, a supporting frame, a lower die base, a hardware part, a punching headand an upper die base. The supporting rod is fixedly connected to the upper portion of the left side of the fixed bottom plate. The upper portion of the supporting rod is fixedly connected with the supporting frame. The lower die base is fixedly connected to the middle portion of the upper portion of the fixed bottom plate. The hardware part is fixedly connected to the middle portion of the upperportion of the lower die base. The punching head is electrically connected above the fixed bottom plate. The top end of the fixed bottom plate is fixedly connected with the upper die base. The upperdie base is electrically connected with the punching head. Moreover, the fixed bottom plate, the lower die base, the hardware part, the punching head and the upper die base are located on the same perpendicular line. The anti-rebound hardware punching die is stable in structure, has the stable placement effect, can relieve punching jittering, is fast and convenient to clean, capable of reducing waste material rebound and good in cleaning effect and has high promotional value, and the problem that the hardware part is placed unevenly is solved.

Description

technical field [0001] The invention relates to a metal stamping die, in particular to an anti-bounce metal stamping die. Background technique [0002] Metal stamping die is a machine for stamping production of sheet metal parts. For stamping production, the single-station mold has a single structure and low production efficiency, and the sheet metal parts should not be too complicated, otherwise multiple sets of single-station molds are required to achieve , If the progressive die is used for stamping production, the company intends to change these shortcomings. The progressive die is characterized by high production efficiency, short production cycle, and fewer operators, which is very suitable for mass production. [0003] However, the existing hardware parts are tilted due to unstable fixation during stamping, which leads to vibration during stamping, and when the existing hardware parts are punched by the punching head, the punched waste and the punching head stick to e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21D28/34B21D43/00B21D45/08B08B3/02
CPCB21D28/34B08B3/02B21D43/003B21D45/08
Inventor 肖涵
Owner 肖涵
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