Integrated circuit total ecological chain intelligent test analysis method

Abstract

The present invention discloses an integrated circuit total ecological chain intelligent test analysis method. A data collection layer, a big data processing analysis layer and an application layer are provided. The method comprises the steps of: integrated circuit test parameter index analysis, wafer test yield analysis, test time analysis, wafer MAP information, an SummaryCheck and analysis, TouchDown, Report and SQLHistory analysis. The integrated circuit total ecological chain intelligent test analysis method achieves timeliness, mobility and intelligence of company office, has remote dataintercommunication and remote data backup, is high in safety, introduces an industrial big data analysis model based on data accumulation for 6 months and 12 months through continuous data accumulation to achieve data retrieval, tracking, analysis, early warning and pre-determination of the total ecological chain test information, is used to guide production and improves the production efficiencyand test yield.

Description

technical field [0001] The invention relates to the technical field of integrated circuit testing, and more particularly, to an intelligent testing and analysis method for the entire ecological chain of integrated circuits. Background technique [0002] At present, my country's integrated circuit industry is facing an important period of strategic opportunities, innovation and tough times for development. On the one hand, the adjustment of the global market structure is accelerating, the scale of investment is rising rapidly, and the market share is accelerating to concentrate on advantageous enterprises; on the other hand, mobile smart terminals and chips are growing explosively, new formats such as the Internet, Internet of Things, and big data are developing rapidly, and new trends are emerging in the evolution of integrated circuit technology. [0003] In recent years, big data has been a very hot topic. When people talk about the opportunities and value brought by massi...

AI Technical Summary

Problems solved by technology

[0011] In the existing technology, the integrated circuit testing environment is in clean workshops such as class 1000, class 100, and class 10. Production operators need to supervise multiple devices. processing, and it may not be possible to quickly locate the problem. The distance between machines, abnormal conditions, personnel, and timeliness of abnormal discovery will all affect the processing efficiency. Rapid processing, the equipment can only stop working, resulting in waste of machine time and low production capacity

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