Unlock instant, AI-driven research and patent intelligence for your innovation.

LED Packaging

A technology of light-emitting diodes and packaging layers, applied in semiconductor devices, electrical components, circuits, etc.

Active Publication Date: 2021-06-01
IND TECH RES INST
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The shading layer is located on the circuit layer

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED Packaging
  • LED Packaging
  • LED Packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0053] Figure 1A to Figure 1J is a schematic cross-sectional view of the manufacturing method of the light emitting diode package according to the first embodiment of the present invention. Figure 1K It is a schematic top view of the light emitting diode package of the first embodiment of the present invention. Figure 1L It is a schematic bottom view of the light emitting diode package of the first embodiment of the present invention. Figure 1M is a circuit diagram of the light emitting diode package of the first embodiment of the present invention.

[0054] First, please refer to Figure 1A , providing a temporary carrier board 10 . The material of the temporary carrier 10 can be glass, quartz, wafer, organic polymer or metal and so on. Other suitable materials can also be used as the temporary carrier 10 , as long as the aforesaid materials can carry the film layers or components formed thereon, and can withstand the subsequent manufacturing process, there is no limit...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
refractive indexaaaaaaaaaa
Login to View More

Abstract

The invention discloses a light-emitting diode package, which includes a circuit layer, a light-shielding layer, a plurality of light-emitting diodes and a packaging layer. The thickness of the circuit layer is less than 100 microns. The light-shielding layer is located on the circuit layer. The light shielding layer has a plurality of openings. The light emitting diode is arranged on the circuit layer and located in the opening of the light shielding layer. The light emitting diode is electrically connected with the circuit layer. The encapsulation layer covers the light shielding layer. The refractive index of the encapsulation layer is between 1.4 and 1.7. The Young's modulus of the encapsulation layer is greater than or equal to 1 GPa. The thickness of the encapsulation layer is greater than that of the light emitting diode.

Description

technical field [0001] The invention relates to a photoelectric element structure and its manufacturing method, and in particular to a light emitting diode package and its manufacturing method. Background technique [0002] Light emitting diodes (LEDs) have advantages such as long life, small size, high shock resistance, low heat generation, and low power consumption, so they have been widely used as indicators or light sources in households and various devices. In recent years, light-emitting diodes have developed towards multi-color and high brightness, so their application fields have been extended to large outdoor signage, traffic lights and related fields. In the future, light-emitting diodes may even become the main lighting source with both power saving and environmental protection functions. [0003] Generally, in a display device with light-emitting diodes, the light-emitting diodes can be disposed on the circuit substrate through surface mount devices (surface mou...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/56H01L33/62H01L25/16
Inventor 吴明宪蔡曜骏赵嘉信方彦翔林奕辰叶瀞雅
Owner IND TECH RES INST