Circuit unit packaging structure

A technology of circuit unit and packaging structure, which is applied in the electronic field, can solve the problems of high cost of packaging structure and cumbersome manufacturing steps, and achieve the effects of mass production, high-efficiency electrical and thermal conductivity, and thin overall thickness
CN110267431AActive Publication Date: 2019-09-20QINGDAO GOERTEK MICROELECTRONICS RES INST CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
QINGDAO GOERTEK MICROELECTRONICS RES INST CO LTD
Publication Date
2019-09-20

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Abstract

An embodiment of the invention provides a circuit unit packaging structure. The circuit unit packaging structure comprises a circuit substrate, an insulator and an electromagnetic shielding layer, wherein circuit units are arranged on the circuit substrate; each circuit unit comprises a silicon dioxide layer and an electronic device arranged on the silicon dioxide layer; the insulators are arranged around the circuit units; the electromagnetic shielding layer is arranged on the circuit units and the insulators in a covering mode. The circuit unit packaging structure has a good electromagnetic shielding effect and is efficient in heat dissipation.
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Description

technical field

[0001] The invention relates to the field of electronic technology, in particular to a circuit unit packaging structure. Background technique

[0002] In the prior art, when the circuit unit of the printed circuit board is packaged, a layer of glue is usually directly molded on the circuit unit, so that the circuit unit is encapsulated between the glue and the printed circuit board, which leads to poor heat dissipation of the circuit unit. At the same time, the circuit unit is easily affected by external radio frequency signals, resulting in poor electromagnetic shielding performance. Contents of the invention

[0003] The main purpose of the present invention is to provide a circuit unit packaging structure, aiming at solving the problems of high cost and cumbersome manufacturing steps of the circuit unit packaging structure.

[0004] In order to achieve the above object, an embodiment of the present invention provides a circuit unit packaging structure, ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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