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Circuit unit packaging structure

A technology of circuit unit and packaging structure, which is applied in the electronic field, can solve the problems of high cost of packaging structure and cumbersome manufacturing steps, and achieve the effects of mass production, high-efficiency electrical and thermal conductivity, and thin overall thickness

Active Publication Date: 2019-09-20
QINGDAO GOERTEK MICROELECTRONICS RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main purpose of the present invention is to provide a circuit unit packaging structure, aiming to solve the problems of high cost and cumbersome manufacturing steps of the circuit unit packaging structure

Method used

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0024] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0025] In addition, the ...

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PUM

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Abstract

An embodiment of the invention provides a circuit unit packaging structure. The circuit unit packaging structure comprises a circuit substrate, an insulator and an electromagnetic shielding layer, wherein circuit units are arranged on the circuit substrate; each circuit unit comprises a silicon dioxide layer and an electronic device arranged on the silicon dioxide layer; the insulators are arranged around the circuit units; the electromagnetic shielding layer is arranged on the circuit units and the insulators in a covering mode. The circuit unit packaging structure has a good electromagnetic shielding effect and is efficient in heat dissipation.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a circuit unit packaging structure. Background technique [0002] In the prior art, when the circuit unit of the printed circuit board is packaged, a layer of glue is usually directly molded on the circuit unit, so that the circuit unit is encapsulated between the glue and the printed circuit board, which leads to poor heat dissipation of the circuit unit. At the same time, the circuit unit is easily affected by external radio frequency signals, resulting in poor electromagnetic shielding performance. Contents of the invention [0003] The main purpose of the present invention is to provide a circuit unit packaging structure, aiming at solving the problems of high cost and cumbersome manufacturing steps of the circuit unit packaging structure. [0004] In order to achieve the above object, an embodiment of the present invention provides a circuit unit packaging structure, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/22
CPCH05K1/0209H05K1/0224H05K3/22H05K1/181H05K1/0216H05K3/284H05K2201/10098H01L23/552H01L2224/16227H01L2224/95H01L2924/18161H01L2924/1815H01L23/3135H01L2223/6677H01L24/16H01L21/56H01L23/3121H01L21/561H01L2224/81H05K1/0231H05K2201/0175H05K2201/10121H05K2201/10151
Inventor 王海升田德文宋青林
Owner QINGDAO GOERTEK MICROELECTRONICS RES INST CO LTD
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