A kind of conductive epoxy resin and preparation method thereof

A technology of conductive epoxy resin and epoxy resin, which is applied in the field of conductive epoxy resin and its preparation, can solve the problems of the silver-plating process, such as the influence of the pattern quality on the surface of the epoxy mandrel, the peeling of the conductive layer, and the problem of the silver layer and the epoxy core. Problems such as poor mold adhesion

Active Publication Date: 2021-08-17
CHANGCHUN INST OF APPLIED CHEMISTRY - CHINESE ACAD OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In the slush molding process of automotive interiors, epoxy resin is often used to reproduce the fine patterns on the slush skin, and the pattern replication rate is extremely high, but due to the insulation of epoxy resin, the epoxy mandrel will It cannot be directly electroformed in the casting tank, but requires a certain conductive treatment process
Chinese patent CN107699875A discloses a chemical silver plating process for slush molds. Although the chemical silver plating process has been optimized to a certain extent, the silver plating process has a greater impact on the surface pattern quality of the epoxy mandrel; at the same time, in During the electroforming process, due to the poor adhesion between the silver layer and the epoxy mandrel, it is very easy for the local conductive layer to fall off.

Method used

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  • A kind of conductive epoxy resin and preparation method thereof
  • A kind of conductive epoxy resin and preparation method thereof
  • A kind of conductive epoxy resin and preparation method thereof

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preparation example Construction

[0039] The raw materials for the preparation of the conductive epoxy resin provided by the invention include bisphenol A type epoxy resin. The parts by weight of the bisphenol A epoxy resin are 50-100 parts. In some embodiments of the present invention, the parts by weight of the bisphenol A epoxy resin is 100 parts.

[0040] In some embodiments of the present invention, the bisphenol A epoxy resin includes E-44 epoxy resin or E-51 epoxy resin.

[0041] The raw materials for the preparation of the conductive epoxy resin provided by the invention also include an amine curing agent. The parts by weight of the amine curing agent are 20-50 parts. In some embodiments of the present invention, the weight part of the amine curing agent is 50 parts.

[0042] In some embodiments of the present invention, the amine curing agent includes one or more of triethylenetetramine, tetraethylenepentamine, isophoronediamine and m-xylylenediamine.

[0043] The raw materials for the preparation...

Embodiment 1

[0099] A kind of conductive epoxy resin, is prepared by the raw material that comprises following component by weight:

[0100]

[0101] The preparation method is as follows:

[0102] The multi-walled carbon nanotubes, flake conductive graphite and KH-550 were stirred and mixed, and ultrasonically treated at 60°C for 60 minutes to obtain a composite slurry;

[0103] Add E-44 epoxy resin to the composite slurry, and stir, the stirring speed is 500rpm, and the stirring time is 10min, to obtain the resin slurry;

[0104] Add tin octyl mercaptide to the resin slurry, and stir, the stirring speed is 300rpm, and the stirring time is 5min;

[0105]Finally, add isophorone diamine, stir and perform defoaming treatment under vacuum conditions, brush the slurry after the defoaming treatment on the silicone mold, and then perform curing molding at 70°C to obtain conductive epoxy resin.

Embodiment 2

[0107] A kind of conductive epoxy resin, is prepared by the raw material that comprises following component by weight:

[0108]

[0109] The preparation method is the same as in Example 1, except that the tin octylmercaptide in Example 1 is replaced by dibutyltin dimaleate.

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Abstract

The invention relates to the technical field of epoxy resin functional materials, in particular to a conductive epoxy resin and a preparation method thereof. The conductive epoxy resin is prepared from raw materials containing the following components in parts by weight: 50-100 parts of bisphenol A epoxy resin; 20-50 parts of amine curing agent; 10-30 parts of the first conductive filler; 10-30 parts of conductive filler; 0.5-2 parts of silane coupling agent; 3-5 parts of heat stabilizer; the first conductive filler includes one or more of carbon nanotubes, vapor-deposited carbon fibers and conductive carbon fibers; The second conductive filler includes one or more of graphene, graphene oxide and conductive graphite; the shape of the second conductive filler is flake or lamellar. Through the compounding of two conductive fillers with different dimensions, a conductive epoxy resin with a double network structure is formed, and at the same time, a conductive epoxy resin with excellent conductivity and thermal stability is obtained by cooperating with other components.

Description

technical field [0001] The invention relates to the technical field of epoxy resin functional materials, in particular to a conductive epoxy resin and a preparation method thereof. Background technique [0002] Epoxy resin is a main thermosetting polymer material, which is widely used in the field of rapid mold manufacturing because of its excellent mechanical properties, excellent dimensional stability and wear resistance. [0003] In the slush molding process of automotive interiors, epoxy resin is often used to reproduce the fine patterns on the slush skin, and the pattern replication rate is extremely high, but due to the insulation of epoxy resin, the epoxy mandrel will It cannot be directly electroformed in the casting tank, but requires a certain conductive treatment process. Chinese patent CN107699875A discloses a chemical silver plating process for slush molds. Although the chemical silver plating process has been optimized to a certain extent, the silver plating p...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): C08L63/00C08K13/04C08K7/00C08K3/04C08K7/06C08G59/50
CPCC08G59/5026C08K3/04C08K7/00C08K7/06C08K13/04C08K2201/011C08L2201/08C08K3/041C08K3/042C08L63/00
Inventor许东华付志磊姚卫国王晓伟李双双潘鸽刘芳石彤非窦艳丽管东波
OwnerCHANGCHUN INST OF APPLIED CHEMISTRY - CHINESE ACAD OF SCI