A method for partial plating on the surface of plastic products

A local plating and plastic technology, applied in manufacturing tools, liquid chemical plating, and superimposed layer plating, etc., can solve the problems of affecting radio frequency performance, different dielectric constants, slow laser processing efficiency, etc., to improve quality and Efficiency, cost reduction effect

Active Publication Date: 2022-04-05
东莞市极瑞电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this way, for complex circuits, the structure of the mold cannot be satisfied, and the dielectric constants of the two materials are different, which also affects the RF performance;
[0005] (3) Using pre-plating treatment, after plating copper or nickel, use laser to remove unnecessary coatings, such as the Chinese invention patent, a partial electroplating method on plastic surfaces, the application number is 201210515285.3, the invention patent was modified in the The final plastic surface is plated with a metal conductive layer, laser etching is used to determine the required pattern, and finally the electroplating is activated. This method is very slow for parts that need to be removed from the coating, especially for plastics with complex circuits. Moreover, large-area laser engraving will generate a relatively high temperature, which will cause the underlying plastic to burn and carbonize, and the carbonized plastic may also be plated. The edge of the coating processed in this way will have a hairy edge, which cannot meet the functional requirements.

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  • A method for partial plating on the surface of plastic products
  • A method for partial plating on the surface of plastic products
  • A method for partial plating on the surface of plastic products

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Embodiment Construction

[0045] The implementation of the present invention will be described in detail below in conjunction with the accompanying drawings. The accompanying drawings are only for reference and description, and do not constitute a limitation to the protection scope of the present invention.

[0046] A method for partial plating on the surface of plastic products, comprising the steps of:

[0047] S1. Metallization of the plastic surface: metallize the surface of the pretreated plastic product, and plate a first metal conductive layer with a thickness of 1 um to 2 um on the entire surface of the plastic product, and the first metal conductive layer is a metal nickel layer;

[0048] S2. Laser engraving partition: use laser to engrave the outline of the area to be plated on the surface of the plastic product, and expose the substrate of the plastic product at the outline, so that the area to be plated and the non-plated area on the surface of the plastic product are divided and electricall...

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Abstract

The invention discloses a partial plating method on the surface of a plastic product, comprising the following steps: S1, metallizing the plastic surface: metallizing the surface of the pretreated plastic product, so that the entire surface is plated with a first metal conductive layer; S2, laser engraving Partitioning: use laser to engrave the outline of the area to be plated on the surface of the plastic product, and expose the substrate of the plastic product at the outline, so that the area to be plated and the non-plated area are partitioned and electrically isolated; S3, the area to be plated is plated with a conductive layer and separated Dissolving the conductive layer in the non-plating area: Connect the electrode to the area to be plated on the surface of the plastic product and energize it. The second metal conductive layer is plated on the area to be plated, and the first metal conductive layer in the non-plated area is dissolved in the plating solution. The invention partitions and electrically isolates the surface metallized plastic products by laser engraving, and dissolves the metal layer in the non-plating area while plating the metal layer on the area to be plated, so as to realize partial plating on the surface of the plastic product, which not only meets the needs of precise and complex circuits It can also improve the quality and efficiency of partial plating and reduce the cost of partial plating.

Description

technical field [0001] The invention belongs to the technical field of surface treatment of plastic products, in particular to a partial plating method on the surface of plastic products. Background technique [0002] In the field of communication electronics, some important parts need to be molded with high dielectric constant materials. In order to make the product have special radio frequency performance, it is necessary to plate functional circuits on the surface of the product, such as: plastic parts formed by LCP materials, usually , the methods of partial plating on the surface of the plastic part are as follows: [0003] (1) Cover the non-electroplating area by spraying anti-plating paint, etc., such as the Chinese invention patent, a method for laser engraving and electroplating on plastic surfaces, the application number is 02127135.6, and the patent discloses the following steps: coating the back of the plastic material Covered with light-transmitting anti-platin...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): C25D5/02C25D5/54C23C18/34C25D3/38C23C18/40C23C18/31C23C28/02C23C18/30B23K26/362B23K26/402
CPCC25D5/02C25D5/54C23C18/34C25D3/38C23C18/40C23C18/31C23C28/023C23C18/30B23K26/362B23K26/402
Inventor刘志锋费栋良
Owner东莞市极瑞电子科技有限公司