Fingerprint identification module, display device and manufacturing method thereof

A production method and module technology, applied in character and pattern recognition, fingerprint/palmprint acquisition/arrangement, print image acquisition, etc., can solve complex production process, easy depolarization of piezoelectric film layer, irregular patterns, etc. question

Active Publication Date: 2020-02-07
BOE TECH GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention provides a fingerprint identification module, a display device and a manufacturing method thereof, so as to improve the complex manufacturing process existing in the formation of the piezoelectric film layer in the prior art, the piezoelectric film layer is easy to depolarize, the pattern is irregular, and the impact on the subsequent The binding problem

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  • Fingerprint identification module, display device and manufacturing method thereof
  • Fingerprint identification module, display device and manufacturing method thereof
  • Fingerprint identification module, display device and manufacturing method thereof

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Embodiment Construction

[0031] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Apparently, the described embodiments are some of the embodiments of the present disclosure, not all of them. Based on the described embodiments of the present disclosure, all other embodiments obtained by persons of ordinary skill in the art without creative effort fall within the protection scope of the present disclosure.

[0032] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the usual meanings understood by those skilled in the art to which the present disclosure belongs. "First", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are o...

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Abstract

The invention discloses a fingerprint identification module, a display device and a manufacturing method of the fingerprint identification module, and aims to solve the problems of complex manufacturing process, easiness in depolarization of a piezoelectric film layer, irregular patterns and influence on binding of a subsequent binding area when the piezoelectric film layer is formed in the priorart. A grain recognition module comprises a plurality of first electrodes, piezoelectric parts and second electrodes which are sequentially located on one face of a substrate, wherein the first electrodes, the piezoelectric parts and the second electrodes are arranged in an array mode. The edge area between the layer where the first electrode is located and the layer where the second electrode islocated is further provided with a retaining wall surrounding the piezoelectric part.

Description

technical field [0001] The invention relates to the technical field of fingerprint identification, in particular to a fingerprint identification module, a display device and a manufacturing method thereof. Background technique [0002] In recent years, under-screen fingerprint recognition technology has become more and more favored by consumers. At present, the mainstream fingerprint recognition technologies mainly include optical fingerprint recognition technology, capacitive fingerprint recognition technology and ultrasonic fingerprint recognition technology. Compared with optical fingerprint recognition and capacitive fingerprint recognition, ultrasonic fingerprint recognition technology has more advantages due to its good penetration and resistance to oil stains and stains on the surface of fingerprints. [0003] However, the ultrasonic fingerprint identification device in the prior art has complex manufacturing process when there is a piezoelectric film layer, the piezo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00
CPCG06V40/1306G06V40/1365
Inventor 崔钊张锋刘文渠吕志军董立文王利波宋晓欣姚琪孟德天
Owner BOE TECH GRP CO LTD
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