A processing method for a thick non-internal positioning optical mode multimode component connector

A processing method and a technology of positioning light, which is applied in metal processing and other directions, can solve problems affecting the appearance quality, irregular edge cutting, and inner layer circuit damage, etc., to achieve smooth and exquisite board edge quality, improve processing accuracy, and meet mass production and safety production

Active Publication Date: 2021-10-12
HUIZHOU KING BROTHER CIRCUIT TECH +2
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Problems solved by technology

With the continuous increase of product density and functions and the continuous expansion of application fields, more and more products are designed to be composed of thicker multi-layer boards, special materials or composite materials, and customers have stricter quality requirements for products. The use of punching dies not only affects the appearance quality due to the uneven cutting of the edges, but also causes certain damage to the inner layer circuits, especially for products with impedance lines. Requires sinking or sinking process to complete

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  • A processing method for a thick non-internal positioning optical mode multimode component connector

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Embodiment Construction

[0032] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with specific embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, and do not limit the protection scope of the present invention.

[0033] A method for processing a thick optical-mode multi-mode component connector without internal positioning, characterized in that it includes the following steps:

[0034] S1. Design of thick multi-layer non-internal positioning optical module connector sub-motherboard project;

[0035] S2. Thick multi-layer non-internal positioning optical module connector and mother board gong belt design;

[0036] S3. Thick multi-layer non-internal positioning optical module connector sub-motherboard processing;

[0037] S4. Quality inspection of thick multi-layer non-internal positioning optical m...

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Abstract

The invention provides a processing method for a thick multi-mode optical module connector without internal positioning, which includes the following steps: S1, the design of the sub-motherboard project of the thick multi-layer optical mode component connector without internal positioning; S2, Thick multi-layer non-internal positioning optical module connector sub-motherboard design; S3, thick multi-layer non-internal positioning optical module connector sub-motherboard processing; S4, thick multi-layer non-internal positioning light Quality inspection of module connector daughter board. According to the technical characteristics of the forming machine, the present invention designs a special process that uses the machine-driven gong knife and groove knife to replace the punching machine and mold processing to improve the processing accuracy and product quality, which can ensure that the products can be produced in batches, quickly and safely, and improve product quality. , to solve the product quality and safety hazards caused by the die.

Description

technical field [0001] The invention specifically relates to a processing method for a thick type non-internal positioning optical mode multimode component connector. Background technique [0002] More and more equipment such as digital medical systems, intelligent photoelectric modules, and security integrated systems adopt modular three-dimensional installation modes. This kind of board has a mother board with no internal positioning and various small inner slots as the base board. When soldering, insert the daughter board into the inner slot of the mother board and then weld the corresponding pads, and insert the socket connection signal or power line to form a path. . [0003] Because the size of the product is very small, the conventional size is below 50mm, and the inner groove needs to be processed in the mother board to accommodate the insertion of the daughter board, and the metal pad on the inner groove side and the daughter board is connected by welding. If the ...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): B26F1/16B26D1/06
CPCB26D1/06B26F1/16B26F2210/08
Inventor唐宏华武守坤陈春柯涵
OwnerHUIZHOU KING BROTHER CIRCUIT TECH