Machining method of thickness type multi-mode assembly connector without internal positioning optical mode

A processing method and a technology of positioning light, which are applied in metal processing and other directions, can solve problems such as uneven edge cutting, inner layer circuit damage, and affecting appearance quality, so as to improve processing accuracy, meet mass production and safe production, and board edge Quality smooth and exquisite effect

Active Publication Date: 2020-02-11
HUIZHOU KING BROTHER CIRCUIT TECH +2
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Problems solved by technology

With the continuous increase of product density and functions and the continuous expansion of application fields, more and more products are designed to be composed of thicker multi-layer boards, special materials or composite materials, and customers have stricter quality requirements for products. The use of punching dies not only affects the appearance quality due to the uneven cutting of the edges, but also causes certain damage to the inner layer circuits, especially for products with impedance lines. Requires sinking or sinking process to complete

Method used

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  • Machining method of thickness type multi-mode assembly connector without internal positioning optical mode

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Embodiment Construction

[0032] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with specific embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, and do not limit the protection scope of the present invention.

[0033] A method for processing a thick optical-mode multi-mode component connector without internal positioning, characterized in that it includes the following steps:

[0034] S1. Design of thick multi-layer non-internal positioning optical module connector sub-motherboard project;

[0035] S2. Thick multi-layer non-internal positioning optical module connector and mother board gong belt design;

[0036] S3. Thick multi-layer non-internal positioning optical module connector sub-motherboard processing;

[0037] S4. Quality inspection of thick multi-layer non-internal positioning optical m...

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Abstract

The invention provides a machining method of a thickness type multi-mode assembly connector without an internal positioning optical mode. The method includes the following steps of S1, performing engineering designing on thickness type multi-layer assembly connector main and auxiliary plates without the internal positioning optical mode; S2, performing routing program designing on the thickness type multi-layer assembly connector main and auxiliary plates without the internal positioning optical mode; S3, machining the thickness type multi-layer assembly connector main and auxiliary plates without the internal positioning optical mode; and S4, detecting the quality of the thickness type multi-layer assembly connector main and auxiliary plates without the internal positioning optical mode.According to the technical features of a forming machine, the special program for replacing a punching machine and a die with a machine drive routing cutter and a grooving cutter for machining so as to improve the machining precision and product quality is designed, it can be ensured that the product can be produced in batches rapidly and safety and the product quality is improved, and the productquality and safety hidden dangers caused by punching are solved.

Description

technical field [0001] The invention specifically relates to a processing method for a thick type non-internal positioning optical mode multimode component connector. Background technique [0002] More and more equipment such as digital medical systems, intelligent photoelectric modules, and security integrated systems adopt modular three-dimensional installation modes. This kind of board has a mother board with no internal positioning and various small inner slots as the base board. When soldering, insert the daughter board into the inner slot of the mother board and then weld the corresponding pads, and insert the socket connection signal or power line to form a path. . [0003] Because the size of the product is very small, the conventional size is below 50mm, and the inner groove needs to be processed in the mother board to accommodate the insertion of the daughter board, and the metal pad on the inner groove side and the daughter board is connected by welding. If th...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): B26F1/16B26D1/06
CPCB26D1/06B26F1/16B26F2210/08
Inventor唐宏华武守坤陈春柯涵
OwnerHUIZHOU KING BROTHER CIRCUIT TECH