Packaging device applied to coins
A coin and base technology, applied in the direction of coin counting, handling coins or valuable banknotes, instruments, etc., can solve the problem of coins scattering and achieve the effect of convenient packaging
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0018] Example: see Figures 1 to 4 As shown, a packaging device applied to coins includes a rectangular base 1, a backing plate 13 is formed on the side of the lower end of the base 1, a V-shaped placement groove 11 is formed on the upper end of the base 1, and the placement groove The side walls at both ends of 11 are formed with an arc-shaped notch 12 that runs through the outer wall of the base 1, and a top block 3 is inserted into the arc-shaped notch 12 of the base 1; One end of the rod 2 and the connecting rod 2 is hinged on the hinge support 14 through the hinge shaft 5, and the hinge support 14 is formed on the backing plate 13, and a triangular limiting wedge 15 is formed on the outer wall of the hinge support 14 The limit wedge 15 is located on the lower side of the connecting rod 2; the other end of the connecting rod 2 is screwed with a bolt 4, and the end of the bolt 4 is plugged and fixed on the top block 3.
[0019] Preferably, the arc center of the arc-shaped...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More - R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com



