2 results about "Scotch tape" patented technology

The invention discloses a preparation method of a thickness-controllable bismuth-strontium-calcium-copper-oxygen high-temperature superconducting single-crystal micron wire, and belongs to the technical field of preparation of superconducting micro-nano electronic devices. According to the method, a BSCCO single crystal is cleaved through a Scotch adhesive tape in a high-vacuum environment to obtain a fresh surface, a gold film is evaporated in situ, after a gold electrode is prepared through photoetching and wet etching, secondary photoetching is combined with argon ion beam etching to a preset depth, and a line channel with a micron-dimension width is defined; the sample and a second substrate are bonded and solidified through Epoxy glue, the substrates are separated to achieve turn-over transfer, finally, residual block BSCCO single crystals are cleaved and removed, and a finished product is obtained. According to the method, the in-situ gold electrode technology, the dry-wet etching technology and the turn-over transfer cleavage technology are combined, good ohmic contact is achieved, the thickness of the micron wire is accurately controlled, the process is stable and repeatable, and a new way is provided for preparation of high-performance high-temperature superconducting devices.

The application discloses a preparation method of a controllable-thickness BiSrCaCuO high-temperature superconducting single-crystal microwire, and belongs to the technical field of superconducting micro-nano electronic device preparation. The application obtains a fresh surface by cleaving a BSCCO single crystal through a Scotch tape under a high-vacuum environment and evaporates a gold film in situ, and after gold electrodes are prepared through photolithography and wet etching, secondary photolithography and argon ion beam etching are combined to define a line channel with a width of micrometer level to a preset depth; then, the sample is bonded and solidified with a second substrate through an Epoxy glue, and the substrate is separated to realize a turn-over transfer, and finally, residual bulk BSCCO single crystals are cleaved and removed to obtain a finished product. The application combines in-situ gold electrode technology, dry and wet etching technology and turn-over transfer and cleaving technology, realizes a good ohmic contact, and is precise in microwire thickness control, stable and repeatable in process, and provides a new way for the preparation of high-performance high-temperature superconducting devices.