A chemical polishing liquid for precision copper alloy workpieces
A chemical polishing and copper alloy technology, which is applied in the field of chemical polishing liquid, can solve the problems of fast corrosion speed of copper alloy surface and poor polishing brightness, and achieve the effect of reducing corrosion speed, slowing down corrosion and slowing down corrosion speed
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0018] A chemical polishing solution for precision copper alloy workpieces, made of the following raw materials in parts by weight: 1200 parts of 85wt% phosphoric acid, 500 parts of 98wt% sulfuric acid, 10 parts of aluminum phosphate, 30 parts of potassium persulfate, diphenylthiourea 0.5 part, 5 parts of corrosion inhibitor, described corrosion inhibitor is the mixture of 2-ethyl-3,5-dimethylpyrazine, thiourea, sorbitol and sulfosalicylic acid, and the mass ratio of four is 1 :1:3:10. The preparation method of the copper alloy chemical polishing liquid is as follows: uniformly mixing phosphoric acid and sulfuric acid, then adding other raw materials and stirring uniformly.
Embodiment 2
[0020] A chemical polishing solution for precision copper alloy workpieces, made of the following raw materials in parts by weight: 1000 parts of 85wt% phosphoric acid, 350 parts of 98wt% sulfuric acid, 3 parts of aluminum phosphate, 10 parts of potassium persulfate, diphenylthiourea 0.1 part, 3 parts of corrosion inhibitor, described corrosion inhibitor is the mixture of 2-ethyl-3,5-dimethylpyrazine, thiourea, sorbitol and sulfosalicylic acid, the mass ratio of four is 1 :3:5:8. The preparation method of the copper alloy chemical polishing liquid is as follows: uniformly mixing phosphoric acid and sulfuric acid, then adding other raw materials and stirring uniformly.
Embodiment 3
[0022] A chemical polishing solution for precision copper alloy workpieces, made of the following raw materials in parts by weight: 1000 parts of 85wt% phosphoric acid, 400 parts of 98wt% sulfuric acid, 5 parts of aluminum phosphate, 20 parts of potassium persulfate, diphenylthiourea 0.3 part, 4 parts of corrosion inhibitor, described corrosion inhibitor is the mixture of 2-ethyl-3,5-dimethylpyrazine, thiourea, sorbitol and sulfosalicylic acid, and the mass ratio of four is 1 :2:4:7. The preparation method of the copper alloy chemical polishing liquid is as follows: uniformly mixing phosphoric acid and sulfuric acid, then adding other raw materials and stirring uniformly.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com