12results about How to "Uniform corrosion" patented technology

The invention provides an electric arc additive manufacturing high-corrosion-resistance magnesium alloy component and a preparation method and application thereof.The preparation method of the electric arc additive manufacturing high-corrosion-resistance magnesium alloy component comprises the following steps that a magnesium alloy base plate is fixed to a workbench provided with a heating plate, and the heating plate is provided with a thermocouple; the thermocouple is connected with the temperature control box to control the temperature of the heating plate so as to realize constant-temperature heating of the magnesium alloy substrate; and the magnesium alloy wire is fixed to wire feeding equipment, single-channel layer-by-layer reciprocating deposition is carried out along the set track according to the set welding machine technological parameters till the target height is reached, and the high-corrosion-resistance magnesium alloy component is obtained. According to the method, the temperature of the magnesium alloy substrate and the interlayer temperature are controlled at a constant temperature through the external temperature field, the manufacturing process parameters are adjusted, the interlayer binding force and the forming quality of the magnesium alloy component are improved, and the prepared high-corrosion-resistance magnesium alloy is small in grain size and uniform in precipitated phase distribution and shows excellent corrosion resistance compared with a traditional cast magnesium alloy.

The invention discloses a zinc bath alloy, a preparation method, a galvanizing method and a metal plated part, and relates to the technical field of hot dip galvanizing. The zinc bath alloy comprises the following components in percentage by weight: 0.005 wt% to 0.015 wt% of aluminum, 0.0006 wt% to 0.0018 wt% of silicon, 0.0002 wt% to 0.005 wt% of titanium and 0.95 wt% to 0.99 wt% of zinc. According to the zinc bath alloy, the types and contents of all the components in the zinc bath alloy are adjusted, specifically, a proper amount of Al, Si and Ti microelements are added into a zinc bath, hot dipping can be further conducted on various base materials through zinc plating operation, the corrosion resistance of a plating layer can be improved, the adhesive force of the plating layer is increased, and the service life of the plating layer is prolonged. The problem that the corrosion resistance of a metal plating piece is insufficient under high-temperature hot dipping is effectively solved, and the corrosion resistance of the plating layer is more than two times that of a pure zinc plating layer with the same thickness.

The high-frequency wafer uniform corrosion device comprises a corrosion inner groove, the corrosion inner groove is located in a corrosion outer groove, and the bottom of the corrosion inner groove is erected on the upper portion of the corrosion outer groove through a supporting rod; a circulating pump is arranged at the bottom of the outer corrosion tank; the input end of the circulating pump is communicated with a water pumping pipe; the input end of the water pumping pipe is communicated with the inside of the bottom of the corrosion outer tank; the output end of the circulating pump is communicated with a water outlet pipe, and the end part of the water outlet pipe penetrates through the corrosion inner tank; the circular frame drives the wafer body to rotate at the rotating speed of 2 + / -1rpm / min by utilizing the surging force of the water outlet pipe to the corrosive liquid, so that the corrosion frequency consistency is improved, the corrosion uniformity is easy to control even if the wafers with different specifications are subjected to corrosion processing, and the wafer body is not easy to deform when being fixed. And the second limiting plates on the left side and the right side can be synchronously adjusted only by adjusting the first limiting plate located on the upper portion, convenience and rapidness are achieved, and the yield is increased.

The invention discloses a vibration simulation assembly type concrete column node earthquake resistance detection device, and relates to the technical field of building structure earthquake resistance detection, and the device comprises a substrate, a center console, a simulation unit and a spraying unit, and the substrate is used for the installation and fixation of the center console, the simulation unit and the spraying unit. The center console is used for controlling opening and closing of the simulation unit and the spraying unit, the simulation unit is used for simulating vibration of different degrees to facilitate anti-seismic detection of a to-be-detected concrete column node, and the spraying unit is used for accelerating the aging state of concrete at the concrete column node to facilitate detection of the anti-seismic performance of the concrete column node in the aging state. The center console starts the simulation unit, the simulation unit generates vibration of different degrees according to needs to simulate ground vibration caused when earthquakes or roadside trucks pass through, the spraying unit sprays concrete column nodes, the anti-seismic performance of concrete of different aging degrees is detected, and prediction in advance and follow-up improvement work can be conveniently carried out.

The invention discloses a single-crystal magnesium alloy wire for acupoint catgut embedding and weight losing and a preparation method of the single-crystal magnesium alloy wire, the chemical composition expression of the single-crystal magnesium alloy wire is Mg-yM-zR, in the formula, y and z represent the mass fraction of M and the mass fraction of R in magnesium alloy respectively, y is larger than or equal to 1.2 and smaller than or equal to 1.7, z is larger than or equal to 0.3 and smaller than or equal to 0.8, and the balance is Mg; m is one of Sr, Ce and Co, and R is one of Ge, Sm and Dy; the wire is prepared through the processes of smelting and casting, homogenizing treatment, hot extrusion, multi-pass cold drawing, intermediate annealing and zone smelting and directional solidification, and has uniform and controllable degradation rate, excellent mechanical property and biocompatibility; after the catgut embedding slimming agent is embedded into the acupuncture point of a human body, fat metabolism is promoted through mild and lasting physical stimulation and chemical ion regulation, intergranular corrosion and premature fracture caused by a polycrystalline structure are avoided, and the safety and durability of a catgut embedding slimming therapy are improved.

The utility model provides a damper valve piece corrosion treatment device relates to damper valve piece corrosion treatment technical field, including bottom plate, the upper surface fixed connection treatment box of bottom plate, the upper surface fixed connection treatment box of bottom plate is provided with lifting assembly at both sides, be equipped with a plurality of placement assembly on lifting assembly, placement assembly includes placement board and conical column, placement board includes two branch and fixed ring, the utility model discloses a fixed ring and conical column are set up, and conical column is installed on the branch, and the valve piece enters the treatment box and handles, when the valve piece handles a period of time, and the fixed ring and branch continue to reduce, and the valve piece is covered on the conical column, and the fixed ring and branch are separated from the valve piece, and the area of the lower surface of valve piece loses the shelter, and the film liquid can carry out the corrosion treatment to the sheltered area of valve piece, make to the valve piece surface corrosion more uniform, reduce the shelter.

The invention discloses an ultrathin corrosion-resistant lead belt and a forming method, and relates to the technical field of lead-acid power batteries, and the forming method comprises the following steps: step 1, continuously rolling a blank lead belt to obtain an ultrathin lead belt; secondly, the ultra-thin lead belt is subjected to heating drying tunnel treatment and vibration treatment, grains are refined, and the ultra-thin corrosion-resistant lead belt is obtained; according to the lead belt, the size in the MD direction is refined by treating coarse grains in the MD direction, so that the overall refining of the grains is realized, and the grain sizes in all directions of the lead belt are consistent, so that uniform corrosion in all directions during corrosion is ensured, the phenomenon that corrosion in one direction is faster than corrosion in other directions is avoided, and the corrosion resistance of the material is improved.

The invention discloses a surface buffer chemical polishing process for a whole superconducting cavity, which comprises the following steps: pretreating the superconducting cavity, fixing the superconducting cavity in a tool clamp of a chemical buffer treatment device in a vertical manner, injecting a buffer chemical polishing solution into the superconducting cavity, and starting an external cooling water circulation system at the same time, carrying out primary buffer chemical polishing; then the polishing solution is discharged from the superconducting cavity and recycled, secondary thickness measurement is conducted on the superconducting cavity, the superconducting cavity is turned over and fixed into the tool clamp in the vertical mode again to be subjected to secondary buffer chemical polishing, and the superconducting cavity is cleaned and dried; and then third-time thickness measurement is carried out, the product is placed in a vacuum furnace to be subjected to medium-temperature annealing, quality detection and classification, and through control and cooperation of multiple links and application of improvement of an external cooling water circulation system, the polishing quality and reliability and consistency of cavity performance are remarkably improved. And the buffer chemical polishing quality of the surface of the superconducting cavity 30 is obviously improved.

The application discloses a gradient detection method for uniform corrosion performance of ferritic stainless steel and belongs to the field of stainless steel corrosion performance detection. The method provides a gradient detection method for the problems that the standard method of GB4334.6-2015 cannot measure the uniform corrosion rate of 409, 430 and other ferritic stainless steel and the test time of the prior art is too long. The method comprises sample preparation, preparation of a basic corrosion medium, selection and adjustment of the gradient of the corrosion medium, corrosion test, treatment of the sample after corrosion and calculation of the uniform corrosion rate. By controlling the hydrogen ion concentration [H + ] to be 0.5-2.0 mol / L, the chloride ion concentration [Cl ‑ ] to be 0.5-2.0 mol / L and the molar ratio of [H + ] / [Cl ‑ ] to be 0.3-0.9, the uniform corrosion is ensured; a three-level gradient detection system of 'basic medium-concentration optimization-corrosion inhibitor assistance' is established, and universal detection of ferritic stainless steel with different corrosion resistance is realized. The test time of the method is only 0.5-1 h, which is 6-12 times more efficient than the prior art of 6 h, the technical blank of the uniform corrosion detection of ferritic stainless steel is filled, and the method has good reproducibility and stability.

The invention belongs to the technical field of metal etching, and particularly discloses a thick copper etching solution which comprises the following components in percentage by weight: 10-20wt% of hydrogen peroxide, 5-16wt% of inorganic acid, 2-7wt% of organic acid, 0.05-1wt% of hydrogen peroxide stabilizer, 1-5wt% of inorganic salt, 0.1-4wt% of micromolecular surfactant with hydroxyl, 1-6wt% of corrosion inhibitor and the balance of deionized water. According to the thick copper etching solution, anisotropic etching is achieved in the transverse direction and the longitudinal direction, the transverse etching speed is reduced, the longitudinal etching speed is not affected, all parts on a thick copper plate can be fully and effectively etched, the etching morphology meeting the requirement can be obtained, and the etching effect is good. And moreover, the etching rate and the key size loss of the pattern can be effectively controlled, the etching capacity is large, and the method has a relatively wide application prospect.

The present invention belongs to the field of medical devices, and provides a method for preparing a drug sustained-release coating on the surface of a zinc alloy implant, comprising: cleaning the surface of a zinc-based material, placing it in a salt solution, and oxidizing it; immersing the oxidized zinc-based material in a 3-aminopropyltrimethoxysilane or polyethyleneimine solution to obtain an aminated zinc-based material; alternately immersing the aminated zinc-based material in a solution with positively and negatively charged molecules for multiple times to obtain a zinc-based material with an assembled coating; immersing the zinc-based material with an assembled coating in a silane solution. The present invention is simple to prepare, low in cost, degradable, and can satisfy antibacterial and drug sustained-release functions.

The application relates to a silicon wafer fast transfer device after etching and a use method thereof. The device comprises an etching tank and a water tank located at one side of the etching tank. A power driving mechanism is arranged between the etching tank and the water tank. The power driving mechanism comprises a power output mechanism and a turnover swing box. The power output mechanism is drivingly connected with the turnover swing box through a transmission mechanism. The bottom of the turnover swing box is provided with a silicon wafer to be transferred. The power output mechanism drives the turnover movement of the silicon wafer to be transferred at the bottom of the turnover swing box through the transmission mechanism, and the silicon wafer to be transferred is transferred from the etching tank to the water tank. The device has the advantages of reasonable structure design, reliable and stable operation, etc. The silicon wafer can be fast transferred between tank bodies, the transfer time is within a specified range, and the silicon wafer can be cleaned in all directions.