Electromagnetic shielding structure, manufacturing method of electromagnetic shielding structure, and circuit board

A technology of electromagnetic shielding structure and manufacturing method, applied in the fields of magnetic field/electric field shielding, printed circuit, printed circuit components, etc., can solve the problems of increased energy consumption, the electromagnetic shielding attenuation value cannot meet the requirements, and the production process of flexible circuit boards is increased. , to achieve the effect of reducing the risk of explosion, shortening the production process and reducing energy consumption

Active Publication Date: 2020-08-21
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But with the advent of the 5G era, the electromagnetic shielding attenuation value of 50-70 decibels cannot meet the requirements
In the prior art, the thickness of the electromagnetic shielding structure is increased to increase the electromagnetic shielding attenuation value, but this will increase the risk of the electromagnetic shielding structure bursting
In addition, the substrate needs to be baked before the electromagnetic shielding structure is pressed onto the circuit substrate, which increases the manufacturing process of the flexible circuit board and increases energy consumption.

Method used

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  • Electromagnetic shielding structure, manufacturing method of electromagnetic shielding structure, and circuit board
  • Electromagnetic shielding structure, manufacturing method of electromagnetic shielding structure, and circuit board
  • Electromagnetic shielding structure, manufacturing method of electromagnetic shielding structure, and circuit board

Examples

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Effect test

Embodiment 1

[0069] Provide an electromagnetic shielding structure, in the electromagnetic shielding structure, the thickness of the insulating layer 12 is 6 μm, the thickness of the metal shielding layer 13 is 3 μm, the porosity of the hole 131 of the metal shielding layer 13 is 96 %, the thickness of the conductive adhesive layer 14 is 8 μm. And test its product characteristics, the product characteristics include shielding attenuation value test, hundred grid test, bending test and thermal stress test.

Embodiment 2

[0071] Provide an electromagnetic shielding structure, in the electromagnetic shielding structure, the thickness of the insulating layer 12 is 6 μm, the thickness of the metal shielding layer 13 is 3 μm, and the porosity of the hole 131 of the metal shielding layer 13 is 90 %, the thickness of the conductive adhesive layer 14 is 8 μm. And test its product characteristics, the product characteristics include shielding attenuation value test, hundred grid test, bending test and thermal stress test.

Embodiment 3

[0073] Provide an electromagnetic shielding structure, in the electromagnetic shielding structure, the thickness of the insulating layer 12 is 6 μm, the thickness of the metal shielding layer 13 is 4 μm, the porosity of the hole 131 of the metal shielding layer 13 is 96 %, the thickness of the conductive adhesive layer 14 is 8 μm. And test its product characteristics, the product characteristics include shielding attenuation value test, hundred grid test, bending test and thermal stress test.

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Abstract

The invention relates to a circuit board, which comprises an outer layer conductive circuit layer and a protective layer, wherein a plurality of openings are formed in the protective layer, part of the outer layer conductive circuit layer is exposed out of the openings, the circuit board further comprises an electromagnetic shielding structure, the electromagnetic shielding structure comprises aninsulating layer, a metal shielding layer formed on the insulating layer, and a conductive bonding layer formed on the metal shielding layer and opposite to the insulating layer, the conductive bonding layer of the electromagnetic shielding structure is attached to the protective layer, part of the conductive bonding layer, the metal shielding layer and the insulating layer are attached to the inner walls of the openings, the conductive bonding layer is electrically connected with the outer layer conductive circuit layer, and a recess is formed in the position, corresponding to the opening, ofthe electromagnetic shielding structure. The invention further provides the manufacturing method of the electromagnetic shielding structure, and the electromagnetic shielding structure. According tothe electromagnetic shielding structure, the manufacturing method thereof and the circuit board provided by the invention, the board explosion risk is low, the manufacturing process is short, and theenergy consumption is low.

Description

technical field [0001] The invention relates to the technical field of electromagnetic shielding, in particular to an electromagnetic shielding structure and a manufacturing method thereof. Background technique [0002] With the rapid development of modern electronic industry, wireless communication and digital technology, all kinds of electronic and electrical equipment have gradually evolved from being mainly concentrated in military and special industrial fields to being widely used in various fields closely related to people's daily life, such as Radio and television, communication and navigation, power facilities, scientific research, medical high-frequency equipment, and various household appliances, but these equipment and products will produce electromagnetic radiation to varying degrees. [0003] At present, electromagnetic shielding structures made of highly conductive and magnetically permeable materials are mostly used to shield electromagnetic radiation, and the...

Claims

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Application Information

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IPC IPC(8): H05K9/00H05K1/02
CPCH05K9/0084H05K1/023
Inventor徐筱婷何明展沈芾云
OwnerAVARY HLDG (SHENZHEN) CO LTD