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LED display device, preparation method thereof and display equipment

A display device and LED chip technology, applied in the direction of electric solid-state devices, semiconductor devices, instruments, etc., can solve the problems of fuzzy, unclear display images, and reduced brightness of the top surface, so as to improve luminous brightness, clear display images, and improve user experience The effect of experience

Pending Publication Date: 2020-09-08
江西兆驰光元科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this structure, because the light emitting angle of the LED chip 200 is too large, part of the light will leak from the side, resulting in a decrease in the brightness of the top surface, resulting in blurred and unclear display images, especially in high-brightness environments used outdoors.

Method used

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  • LED display device, preparation method thereof and display equipment
  • LED display device, preparation method thereof and display equipment
  • LED display device, preparation method thereof and display equipment

Examples

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Embodiment Construction

[0027] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0028] Those skilled in the art can understand that, unless otherwise stated, the word "comprising" used in the description of the present invention refers to the presence of the features, integers, steps, operations, parts / components and / or components, but does not exclude the presence or Add one or more other features, integers, steps, operations, parts / parts, components and / or groups thereof. It should be understood that when we refer to a part / component as being "connected" to another part / component, it may be directly connected to t...

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PUM

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Abstract

The invention provides an LED display device, a preparation method thereof and display equipment. The LED display device comprises a base plate, pixel points arranged on the base plate, and packagingglue covering the pixel points. Each pixel point comprises at least one LED chip. The LED display device further comprises a light reflecting wall which is vertically arranged on the substrate and surrounds the pixel points, and the light reflecting wall and the substrate jointly form a light condensation cavity of the pixel points. According to the LED display device provided by the invention, the light reflecting wall is arranged around the pixel points; the light rays emitted by the pixel points towards the side face can be reflected to the front face of the LED display device through the light reflecting wall, the light rays of the pixel points are condensed, so that the light emitting brightness of the LED display device is improved to ensure that displayed images in the outdoor environment are clear, and the user experience is improved.

Description

technical field [0001] The invention relates to the technical field of LED display, in particular to an LED display device, a preparation method thereof, and a display device using the LED display device. Background technique [0002] At present, due to the advantages of bright colors, wide dynamic range, high brightness, low power consumption, long life, impact resistance, stability and reliability, LED display screens have become the most advantageous new generation display media, and are widely used in large squares, Commercial advertisements, stadiums and other places. [0003] The LED display is mainly composed of multiple LED display devices assembled. like figure 1 As shown, the packaging structure adopted by the existing LED display devices is generally to weld LED chips 200 on the substrate 100 to form pixels, and then directly fabricate the packaging layer 300 covering the LED chips 200 on the substrate 100 . Due to the large light emitting angle of the LED chip...

Claims

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Application Information

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IPC IPC(8): H01L33/60H01L33/58H01L33/56H01L33/48H01L25/075G09F9/33
CPCG09F9/33H01L25/0753H01L33/486H01L33/56H01L33/58H01L33/60H01L2933/0033H01L2933/005H01L2933/0058
Inventor 刘传标周波何至年唐其勇朱弼章
Owner 江西兆驰光元科技股份有限公司
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