Packaging detection equipment suitable for multi-specification semiconductors

Abstract

The invention discloses packaging detection equipment suitable for multiple specifications of semiconductors. The equipment comprises a bracket, a first supporting plate and a pushing device. A firsttooth column is mounted on the inner surface of the left side of the bracket; a rocker is mounted on the surface of a transmission gear; a second toothed column is mounted on the side surface of the transmission gear; a detection table is mounted at the bottom of a touch rod in a deviating manner; a first rotating rod is mounted at the top of a sliding rod; a fixed rod is mounted at the bottom ofthe sliding rod; a first transmission rod is mounted on the surface of the conveying belt; a first push rod is mounted at the top of a bearing plate in a deviating manner; a connecting rod is mountedon the inner side of the material frame; a sponge pad is installed on the side face of the material frame, through the arrangement of the bearing plate and a first spring, when packaged products are transported to the bearing plate, the packaged products can stay in place due to the action of the first spring, then the packaged products are pushed to a material frame under the action of first pushrod, and the orderly transportation of the materials can be achieved.

Description

technical field [0001] The invention relates to the technical field of semiconductor package inspection, in particular to a package inspection device suitable for multi-standard semiconductors. Background technique [0002] Semiconductor refers to a material whose conductivity is between that of a conductor and an insulator at room temperature. It has applications in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion, etc., whether in terms of technology or economic development. From the point of view, the importance of semiconductors is very huge. The core units of most electronic products, such as computers, mobile phones or digital recorders, are closely related to semiconductors. Because semiconductors are so important, so Semiconductors are packaged and inspected before they leave the factory. [0003] The existing semiconductor packaging testing equipment can accurately detect the defe...

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a package testing equipment suitable for multi-standard semiconductors, so as to solve the problem that many semiconductor package testing equipment in the background art can only test semiconductors of the same specification. The detection needs to be replaced by equipment, which brings a lot of trouble

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