30 results about "Package testing" patented technology

The invention discloses an integrated magnetic device packaging forming device and a packaging testing method, and relates to the technical field of integrated magnetic device packaging forming. An integrated magnetic device packaging and forming device comprises a conveying mechanism, an assembling mechanism, a first dispensing mechanism and a second dispensing mechanism. The assembling mechanism is used for placing the chip into the groove, and the first dispensing mechanism comprises a dispensing assembly used for conducting dispensing around the chip in the groove, a position adjusting assembly used for adjusting the position of the chip and a curing assembly used for curing resin. The reliability of the chip mounting position can be ensured as much as possible.

The present application relates to the field of chip package testing, in particular to a chip package testing system and a testing method thereof. The system comprises a testing box, the inside of which is divided into a testing room and a chip in-out room. The testing room is divided into a feeding room with adsorption equipment and detection equipment, a discharging room, and two groups of detection rooms. The rotating plate is divided into four groups of rotatable detection stations, each of which is provided with a positioning assembly. The testing box is also provided with a feeding box, a qualified product discharging box, an unqualified product discharging box, and a controller. Through the rotation of the detection stations, the feeding room, the two groups of detection rooms, and the discharging room are sequentially opposite, and the feeding, detection, and classified discharging are automatically performed. The structure is compact, and the items for simultaneous detection can be installed and replaced according to needs. The detection process is cyclic, continuous, efficient, and intelligent. After the detection is completed, the qualified products and unqualified products are classified and recycled, the detection results are intuitive, the classification and statistics are convenient, and the detection efficiency is improved.

The utility model relates to a packaging test device for chip production, which belongs to the technical field of packaged chip detection and comprises a fixing frame plate, a first fixing frame is fixedly connected to one side of the fixing frame plate, a first driving motor is fixedly mounted on the right side of the first fixing frame, and a second driving motor is fixedly mounted on the right side of the first fixing frame. The output end of the first driving motor is fixedly connected with a third threaded rod, the outer side of the third threaded rod is in threaded connection with a movable frame, a packaging testing device is arranged in the movable frame, and a chip positioning device is arranged in the fixed frame plate. The packaging testing device comprises a second driving motor fixedly installed on one side of the moving frame and a connecting plate fixedly connected to the inner wall of the moving frame. According to the packaging test device for chip production, the three detection blocks on the outer side of the first threaded rod are driven by the second driving motor to transversely move, and the packaging test accuracy can be improved after chips of different sizes are clamped.

This invention discloses a contactless chip testing system. The platform includes a PC, a data parsing / forwarding module, a source signal excitation module, a gating array, and a chip slot under test. The platform allows for simultaneous multi-selection via a PC's visual interface, enabling automated integrated testing of resistance, capacitance, package integrity, voltage, and overall power consumption between any chip pins. Compared to traditional mechanical probe-based contact testing systems, this invention is more compact. Furthermore, it employs an automatically gating physical path switching method, resulting in a higher switching rate and more efficient package testing.

A testing device including a base having a first joint and an arm. The arm has a first branch connected to and pivotable about the first joint, a second joint connected to the first branch, a second branch connected to and pivotable about the second joint, a third joint connected to the second branch, and a third branch connected to and pivotable about the third joint. The third branch can have an attachment mechanism. The first joint is configured to drive movement of the arm through rotation of the first joint.

The application relates to a semiconductor chip packaging test device, which comprises a test table, a chip positioning detection device on the test table, a chip testing device above the chip positioning detection device, a transmission top plate, a current probe, a plurality of negative pressure elastic expansion pipes, a chip pickup mechanism, a pickup driving connecting rod, a pickup transmission gear set and a pickup arm.

To provide an individual packaging box for an inspection kit, etc., for holding a container of a specimen after collection.SOLUTION: An individual packaging box 10 stores an inspection kit including a sample well and a specimen holding container used for dropping a liquid including a specimen into the sample well. The individual packaging box 10 includes an upper surface part 11a and a lower surface part 11b facing the upper surface part 11a. The lower surface part 11b has a perforation 11b2 for holding the container. In a region cut along the perforation 11b2 for holding the container, a lower portion of a specimen holding container main body 33a of the specimen holding container is inserted so as to be used for holding the specimen holding container main body 33a.SELECTED DRAWING: Figure 8

This utility model discloses a vacuum-resistant testing chamber with a quick-change multi-cavity carrier. The vacuum-resistant testing chamber includes: multiple quick-change fixtures, a testing chamber, and a multi-cavity carrier; the quick-change fixtures have horizontally open guide grooves and integrally connected contoured slots at the ends of the horizontal guide grooves, the lower edge of the contoured slots being lower than the lower wall height of the horizontal guide grooves; multiple quick-change fixtures can be detachably connected to both longitudinal and / or transverse sides of the testing chamber, the horizontal guide groove openings of the quick-change fixtures on both longitudinal and transverse sides facing the same direction; the frame of the multi-cavity carrier is divided into multiple product cavities in a rectangular array by horizontal plates, and the lower connecting rod of the frame fits into the contoured slot; the multi-cavity carrier is placed into the chamber, and the lower connecting rod is pushed through the horizontal guide groove into the corresponding contoured slot, thereby quickly changing the multi-cavity carrier. This utility model has the advantages of quick-change multi-cavity carriers and applicability to various product packaging tests.

The invention relates to the technical field of chip packaging test equipment, in particular to integrated circuit chip packaging test equipment and a test method thereof.The integrated circuit chip packaging test equipment comprises a machine body, and the machine body comprises a driving mechanism, an extrusion test mechanism and a placement mechanism. Through arrangement of a disc, a notch block and a first limiting rod, due to operation of a driving motor, a rotating block pushes a through opening frame to integrally move up and down in a reciprocating mode through the notch block and a connecting rod, and meanwhile the rotating block drives the disc to rotate along the inner wall of an annular disc; therefore, the circular disc integrally drives the circular ring disc to synchronously rotate through the first limiting rod, and then the circular ring disc drives the integrated circuit chip on the detection plate to rotate and change the position, so that an operator can place the integrated circuit chip on the detection plate for testing without being below the extrusion testing mechanism. Therefore, the situation that an operator is bruised and pinched when testing the integrated circuit chip is better avoided.

The invention discloses a modularized packaging testing device and method. The modularized packaging testing device comprises a testing support, a function module and a connecting assembly. The test support is of a frame type structure, a main control unit and a power module are arranged in the test support, the main control unit is used for receiving and processing test data, the power module supplies power to the whole device, and a frame of the test support is provided with a module mounting position; the function module is matched with the module installation position of the test support. The connecting assembly comprises a signal interface and a power interface which are arranged in the module mounting position, the signal interface is electrically connected with the main control unit, and the power interface is electrically connected with the power module. According to the invention, the structural design is novel, rapid switching and combination of multiple test functions can be realized, and the test module can be flexibly configured according to different test requirements, so that the test efficiency is remarkably improved, and the marketing cycle of products is shortened.

The utility model relates to the technical field of electrical test jigs, and discloses a detection jig for a package testing machine, which comprises a base, a plurality of connecting rods are fixedly connected to the upper side of the base, the upper ends of the plurality of connecting rods are fixedly connected with a fixed table together, a bearing plate is fixedly connected to the upper side of the fixed table, and a test jig is mounted on the upper side of the bearing plate. A test mechanism is arranged on the fixed table, a feeding mechanism is arranged on one side of the fixed table, a discharging mechanism is arranged on the other side of the fixed table, a limiting groove is formed in the fixed table, and a limiting sliding block mechanism is arranged on the inner side of the limiting groove. The clamping jaw unit is driven to be close to the testing jig located on the upper side of the fixing table, so that the to-be-tested electrical product clamped on the clamping jaw unit and the testing jig form an access, automatic testing is achieved, and the testing device has the advantages of being high in testing speed and high in efficiency.

The present application belongs to the field of integrated circuit package testing, and particularly relates to a TGV defect detection method based on PSO-XGBoost. A defect model is established by taking the cavity, open circuit and composite defects in TGV as the research object, and the S parameters of different defects are extracted based on the established defect model; the TGV cavity defect radius, TGV open circuit defect length and TGV composite defect combination form are taken as the data classification basis, and the labels are set; a PSO-XGBoost classification model is established, the particle swarm optimization (PSO) algorithm is used to optimize the extreme gradient boosting (XGBoost), and the best hyperparameter is found based on the PSO-XGBoost algorithm; the S parameters of different defects are classified and processed by using the PSO-XGBoost model, the defect type is predicted, and the TGV defect detection accuracy is improved. The detection method avoids the secondary damage of TGV in the defect detection process, solves the problems that the traditional TGV detection method is difficult to accurately detect the micro defect and composite defect and has low detection efficiency, and has certain reference value for optimizing the design and manufacturing process of TGV, improving the TGV defect and improving the three-dimensional package yield.

The application discloses a DBC packaging test equipment, which comprises a static test equipment and a plurality of dynamic test equipment connected in series; the static test equipment and the dynamic test equipment both comprise a conveying line one, a three-axis mechanical hand, a conveying line three and a rotary test platform; the static test equipment further has a static test machine and a basket feeding mechanism; the conveying line one and the basket feeding mechanism convey DBC substrates to the conveying line three; the three-axis mechanical hand takes the DBC substrates on the conveying line three to the rotary test platform; the rotary test platform sends the DBC substrates into the static test machine to conduct normal-temperature static test; and after the test is completed. The DBC packaging test equipment combines normal-temperature static test and high-temperature dynamic test, simplifies a test line architecture, reduces test line cost, reduces a test line land area, optimizes a test process, realizes full-automatic test operation, does not need manual assistance, improves test efficiency and product yield.

The invention discloses an adapter device for a chip package test. The adapter device for the chip package test comprises a connecting plate comprising a plurality of package test units. Each packaging test unit comprises a board slot used for accommodating a microchip, a signal transmission sheet coupled with the board slot, a signal connector coupled with the board slot, and a chip substrate. In some embodiments, the adapter apparatus for chip package testing also includes an adapter board coupled with the connection board through an inter-board connection region included in the adapter board. A method for chip package testing includes bonding a plurality of microchips to a chip substrate of a connection board, coupling the connection board with an adapter board, inspecting the plurality of microchips, and identifying a faulty microchip using an identification code.

This invention discloses a calibration structure and method for D-band glass vias, belonging to the field of microwave / millimeter-wave interconnect and packaging testing technology. It includes: independent metal pads corresponding to signal lines and ground lines for RF probe contact; a bottom metal plate; and at least one set of glass vias formed on a glass substrate for D-band signal transmission, enabling signal transmission between the metal pads and the bottom metal plate. The calibration structure is used to calibrate the scattering parameters of the glass vias: by setting differences in the transmission length or termination state of the bottom metal plate, the scattering parameters of the calibration structure are tested, and the bulk scattering parameters of the glass vias are indirectly obtained. This method can be used to design glass vias suitable for D-band signal transmission and to measure the bulk scattering parameters of the glass vias.

The utility model relates to the technical field of medicine packaging testing, in particular to a packaging system sealing performance testing device based on a helium mass spectrum, which comprises a low-temperature device, a sample testing device arranged in the low-temperature device and a helium mass spectrum detector, the sample testing device comprises an upper part and a lower part which is detachably arranged at the bottom of the upper part, wherein a first cavity is formed in the middle of the bottom of the upper part, first positioning holes are formed in the four corners of the top of the upper part respectively and penetrate through the upper part, first through holes are formed in the side wall of the upper part, and the first through holes communicate with the first cavity; according to the utility model, the sealing performance of the packaging system can be effectively detected in a low-temperature state, and powerful support is provided for medicine packaging quality control.

A twinaxial cable splitter is in electrical communication with an IC die package. First and second coaxial electrical cables are configured to route electrical signals to a testing device that is configured to determine certain metrics of an IC chip of the die package. Thus, a method is provided for testing an IC die package assembly by placing an IC package testing device in electrical communication with a first electrical connector mounted to a package substrate of the die package assembly that includes the package substate and an IC die mounted on the package substrate, and determining at least one performance metric of the die package assembly.

The application discloses a kind of for realizing the package test method, equipment and medium of storage chip, it is related to package electrical measurement analysis technical field, comprising: collection package electrical connection parameter, according to package electrical connection parameter establishes electrical measurement position association, extracts electrical stress sensitive area from electrical measurement position association, and sequentially arranges to electrical stress sensitive area, generates electrical measurement drive sequence;Injection hierarchical electrical excitation signal to electrical measurement drive sequence, and synchronous collection electrical response characteristic parameter, decouples analysis is carried out to electrical response characteristic parameter, generates electrical characteristic response data;Around electrical abnormal propagation path implementation reverse compensation electrical excitation and adjacent node contrast verification, obtain verification response data, and the electrical response change trend before and after compensation is carried out to verification response data consistency comparison and convergence analysis, generates electrical performance test scheme.The application improves the abnormal positioning accuracy and enhances electrical performance test scheme reliability.

The utility model discloses a packaging material tensile strength tester, which belongs to the field of packaging testing, and comprises a base, a lifting assembly, a force measuring assembly and two clamping assemblies, the force measuring assembly is connected with the lifting assembly, the two clamping assemblies are respectively connected with the base and the force measuring assembly, the lifting assembly is used for adjusting the distance between the two clamping assemblies, and the lifting assembly is used for adjusting the distance between the two clamping assemblies. The clamping assembly comprises a clamping seat, an adjusting screw rod, a first clamping block, a first damping pad, a second clamping block and a second damping pad, a first threaded hole is formed in the clamping seat, the adjusting screw rod is in threaded connection with the first threaded hole and abuts against the first clamping block, the first clamping block is slidably connected to the clamping seat, and the second clamping block is slidably connected to the second damping pad. The first clamping block and the second clamping block are arranged in a spaced mode, the first damping pad is connected to the first clamping block, and the second damping pad is connected to the second clamping block. According to the embodiment of the invention, the packaging material is not easy to slip between the first damping pad and the second damping pad, so that the risk that the packaging material is broken from a clamping point during testing is reduced.

The utility model discloses encapsulation test machine platform motor mounting structure relates to the field of semiconductor technology, including the main part, the linear motor is installed on the main part, and the bottom of linear motor is provided with motor shaft, the upper portion of main part is installed with support connecting piece, and the junction of support connecting piece and main part is provided with screw joint hole and pin hole, the screw joint hole and pin hole all are provided with the waist hole. The utility model discloses the screw joint hole and pin hole of waist hole design make in the installation process of support connecting piece can carry out the fine adjustment, ensure the mouth bar head and motor shaft center line collinear, thereby improve detection accuracy and yield, compared with the traditional round hole design, the waist hole provides greater adjustment range, reduces the device performance decline due to installation error, and the waist hole design of screw joint hole and pin hole not only enhances the maintainability and adaptability of equipment, thereby prolongs the service life of equipment.

This utility model relates to the field of chip testing technology and discloses a chip packaging testing device, including a working support platform. A bottom support plate is fixedly connected to the inner bottom of the working support platform. A correction testing component is provided on the top surface of the bottom support plate. A lateral moving component is provided on the inner top of the working support platform. A longitudinal moving component is provided on the top surface of the lateral moving component. A pressure driving component is provided at the bottom of the longitudinal moving component. This utility model, through the action of the lateral moving component and the longitudinal moving component, allows the pressure driving component to be adjusted in position according to actual needs, thereby testing the packaged chip. At the same time, the pressure sensor at the bottom detects the pressure resistance of the packaged chip, thereby completing the testing of the packaged chip.

The utility model discloses a packaging test seat and a packaging test machine, and relates to the technical field of semiconductor test equipment. The packaging test seat comprises a base, a clamp and a test circuit board, wherein the base comprises a packaging mounting groove, a fixing part surrounding the packaging mounting groove and a pin placing table between the fixing part and the packaging mounting groove; a supporting plate is arranged in the packaging mounting groove and is movably connected with the base, and the height of the supporting plate in the packaging mounting groove is adjustable; the clamp is fixed on the fixing part and comprises a pressing mechanism and a test pin; the test pin is arranged on one side, facing the base, of the pressing mechanism; one end of the test pin is placed on the pin placing table, and the other end is electrically connected with the test circuit board; the pressing mechanism is used for controlling the contact or separation of the test pin and the pin placing table; the test circuit board is fixed on one side of the base away from the clamp. According to the utility model, the height of the supporting plate in the packaging installation groove in the packaging test seat is adjustable, so that chips with different unpackaging modes can be tested.

The invention relates to the technical field of electronics, in particular to a chip packaging test method, which comprises the step of performing high-precision identification and long-term reliability prediction on a defect area by adopting a deep learning model through combining a chip thermal stress distribution map and electrical characteristic data of the defect area. In the detection process of a packaging defect area, normalization processing is carried out on a chip thermal stress distribution map, principal component analysis and dimension reduction are carried out on electrical characteristic data of the defect area, standardization and dimension reduction processing of input data are ensured, the standardized map and the reconstructed electrical characteristic data are input into a pre-trained convolutional neural network, and the electrical characteristic data of the defect area are detected. And extracting spatial features and carrying out feature fusion to generate a fused feature vector. And outputting predicted values of the thermal cycle life, the electromigration life and the mechanical fatigue life through a neural network regression layer based on the fusion feature vector. According to the invention, efficient and accurate detection of the packaging defect area is realized, and improvement of chip packaging quality and estimation of product reliability are facilitated.

The invention provides an automatic generation production test method for a dust collector, and the method comprises the steps: building a unique mapping relation through scanning a two-dimensional code of an accessory and an SN code of a complete machine, and achieving the binding and source tracing; the automatic chemical station system is adopted to execute locked-rotor, host and packaging tests in sequence, and the result is automatically judged based on the preset standard, so that manual operation and visual judgment are replaced, the test efficiency and accuracy are improved, and missed test and misjudgment are avoided; binding data, test data and results are integrated into a traceable data link and synchronously stored to the local and the server, a unified and coherent data management system is constructed, the situation that data are scattered and difficult to inquire and count in the past is changed, the full-life-cycle data from accessories to the whole machine and from test to maintenance can be traced in real time, and the data management efficiency is improved. Therefore, defective products are effectively prevented from flowing out, and the quality control capability is improved.

The application discloses a kind of driving package test method and related devices.The method includes: obtaining target test task, target test task includes at least one driving package and the first identification of each driving package in at least one driving package, and the first identification of each driving package is used to indicate the PCIe device matched with the driving package;According to the first identification of target driving package, the identification of target server is determined;Execute test instruction is sent to server pool, to indicate that server pool carries out test to target driving package by target server, and execute test instruction includes second identification, server identification and the first identification of target driving package, and second identification is used to indicate the test environment corresponding to target test task;Test result corresponding to target test task fed back by server pool is received.The scheme of the application is used, and the reuse of PCIe device is realized, and the waste of hardware resources is avoided.

The invention relates to the technical field of integrated circuit package testing, and discloses a data management method and system for integrated circuit package testing. The method comprises the following steps: collecting real-time load data and a chip complexity index, and constructing a channel load distribution matrix; carrying out classification and dynamic shunting on the test data by adopting a load balancing algorithm based on the matrix; recording a data distribution path and embedding a timestamp and a source target identifier to form a complete data flow link record; judging a load balancing state according to the record and adjusting parameters; extracting an abnormal signal from the load state, analyzing a test result deviation, and positioning an error correction target channel; carrying out redistribution processing on the problem data subset to obtain corrected data; and summarizing the tracking logs, verifying the integrity, calculating a data reliability index, fusing the data reliability index to a test report after the data reliability index reaches the standard, and generating a final traceable test result set. According to the invention, dynamic distribution, whole-course tracking and rapid error correction of the test data are realized, and the test efficiency and the data reliability are improved.

The invention relates to a yield analysis and process feedback method and system for an integrated magnetic device packaging test, and belongs to the technical field of magnetic device detection, and the method comprises the steps: collecting the multi-modal data of a tested magnetic device, and carrying out the preprocessing of the multi-modal data, and standardizing the input data; wherein the multi-modal data at least comprises electrical performance parameters, heat distribution data and packaging process data; inputting the standardized input data into a pre-trained analysis model, and outputting a performance prediction result and a defect classification result of the tested magnetic device by the analysis model; and according to the defect classification result, determining a packaging process link causing defects, and generating and outputting parameter adjustment feedback information for the packaging process link for detection personnel to know. The method has the effects of accurately predicting the performance of the magnetic device and intelligently diagnosing the process defects.

The present disclosure provides a temperature control system and a packaging test method, comprising: a bottom opening of a cover body is used for sealingly connecting to a test machine; a first bin body is detachably embedded in a first mounting gap and has an openable and closable first entrance and is provided with a first communication part extending to outside of the cover body; a second bin body is detachably embedded in a second mounting gap and has an openable and closable second entrance and is provided with a second communication part extending to outside of the cover body; a first temperature control device is arranged in the first mounting part and is communicated with the accommodation space, and is used for controlling the temperature of the test cavity; a second temperature control device is communicated with the first communication part; a third temperature control device is communicated with the second communication part; a conveying device is arranged in the cover body and has an execution part in the cover body for taking and placing a chip. The feeding and discharging operations are independent and can be performed in parallel, supporting efficient automatic test of small batch and multi-specification chips, and making the replacement efficiency of the chips to be tested higher.

Chip testing device and package testing machine are provided. The chip testing device includes an upper base and a lower base, the upper base being above the lower base and being pressed against the lower base, and a top of the lower base featuring a first mounting part for mounting a test chip and a second mounting part beneath the first mounting part; a first test probe, penetrating the upper base and contacts the test chip to obtain an electrical signal of the test chip; a heat sink base, at the second mounting part and contacting the test chip to transfer a received heat to the test chip; and a first temperature sensor in the heat sink base to measure an actual temperature of the test chip.