50 results about "Package testing" patented technology

The invention discloses an integrated magnetic device packaging forming device and a packaging testing method, and relates to the technical field of integrated magnetic device packaging forming. An integrated magnetic device packaging and forming device comprises a conveying mechanism, an assembling mechanism, a first dispensing mechanism and a second dispensing mechanism. The assembling mechanism is used for placing the chip into the groove, and the first dispensing mechanism comprises a dispensing assembly used for conducting dispensing around the chip in the groove, a position adjusting assembly used for adjusting the position of the chip and a curing assembly used for curing resin. The reliability of the chip mounting position can be ensured as much as possible.

This invention belongs to the field of cigarette packaging testing technology and discloses a bending degree measuring device and method. The bending degree measuring device includes a support structure, an image acquisition structure, and a detection system. The support structure is used to place the label paper, provide illumination to the label paper, and flatten the label paper. The image acquisition structure is located on top of the support structure and is used to acquire original images of the front and back sides of the label paper, as well as an image of the flattened label paper. The detection system is connected to both the support structure and the image acquisition structure. The detection system receives the original images of the front, back, and flattened sides of the label paper acquired by the image acquisition structure and obtains the bending degree of the label paper based on these images. This bending degree measuring device can measure the bending degree of label paper, select label paper with acceptable bending degree for processing, and avoid reduced production efficiency due to poor bending degree.

The present application relates to the field of chip package testing, in particular to a chip package testing system and a testing method thereof. The system comprises a testing box, the inside of which is divided into a testing room and a chip in-out room. The testing room is divided into a feeding room with adsorption equipment and detection equipment, a discharging room, and two groups of detection rooms. The rotating plate is divided into four groups of rotatable detection stations, each of which is provided with a positioning assembly. The testing box is also provided with a feeding box, a qualified product discharging box, an unqualified product discharging box, and a controller. Through the rotation of the detection stations, the feeding room, the two groups of detection rooms, and the discharging room are sequentially opposite, and the feeding, detection, and classified discharging are automatically performed. The structure is compact, and the items for simultaneous detection can be installed and replaced according to needs. The detection process is cyclic, continuous, efficient, and intelligent. After the detection is completed, the qualified products and unqualified products are classified and recycled, the detection results are intuitive, the classification and statistics are convenient, and the detection efficiency is improved.

The utility model relates to a packaging test device for chip production, which belongs to the technical field of packaged chip detection and comprises a fixing frame plate, a first fixing frame is fixedly connected to one side of the fixing frame plate, a first driving motor is fixedly mounted on the right side of the first fixing frame, and a second driving motor is fixedly mounted on the right side of the first fixing frame. The output end of the first driving motor is fixedly connected with a third threaded rod, the outer side of the third threaded rod is in threaded connection with a movable frame, a packaging testing device is arranged in the movable frame, and a chip positioning device is arranged in the fixed frame plate. The packaging testing device comprises a second driving motor fixedly installed on one side of the moving frame and a connecting plate fixedly connected to the inner wall of the moving frame. According to the packaging test device for chip production, the three detection blocks on the outer side of the first threaded rod are driven by the second driving motor to transversely move, and the packaging test accuracy can be improved after chips of different sizes are clamped.

This invention discloses a contactless chip testing system. The platform includes a PC, a data parsing / forwarding module, a source signal excitation module, a gating array, and a chip slot under test. The platform allows for simultaneous multi-selection via a PC's visual interface, enabling automated integrated testing of resistance, capacitance, package integrity, voltage, and overall power consumption between any chip pins. Compared to traditional mechanical probe-based contact testing systems, this invention is more compact. Furthermore, it employs an automatically gating physical path switching method, resulting in a higher switching rate and more efficient package testing.

A testing device including a base having a first joint and an arm. The arm has a first branch connected to and pivotable about the first joint, a second joint connected to the first branch, a second branch connected to and pivotable about the second joint, a third joint connected to the second branch, and a third branch connected to and pivotable about the third joint. The third branch can have an attachment mechanism. The first joint is configured to drive movement of the arm through rotation of the first joint.

The application relates to a semiconductor chip packaging test device, which comprises a test table, a chip positioning detection device on the test table, a chip testing device above the chip positioning detection device, a transmission top plate, a current probe, a plurality of negative pressure elastic expansion pipes, a chip pickup mechanism, a pickup driving connecting rod, a pickup transmission gear set and a pickup arm.

The utility model relates to the technical field of gas permeability testing, and discloses a packaging material testing device and a gas permeability testing device.The packaging material testing device comprises a mounting plate, a sealing cover and a mounting base, the mounting plate and the sealing cover define a first closed space, and the mounting base is arranged on the mounting plate and located in the first closed space; the bottom of the sealing cover is provided with a first gas inlet and a first gas outlet through which test gas enters and exits, the inner side wall of the sealing cover is provided with a second gas inlet and a second gas outlet, a first gas outlet channel is communicated between the second gas inlet and the first gas outlet, and a first gas inlet channel is communicated between the first gas inlet and the second gas outlet; a second gas inlet channel and a second gas outlet channel for detecting gas inlet and outlet are formed in the bottom of the mounting plate; an air inlet pipe and an air outlet pipe are arranged on the mounting base, the air inlet pipe is connected with the second air inlet channel, and the air outlet pipe is connected with the second air outlet channel. According to the utility model, the gas transmission is smooth, the transmission efficiency and the use safety are improved, and the installation difficulty is reduced.

To provide an individual packaging box for an inspection kit, etc., for holding a container of a specimen after collection.SOLUTION: An individual packaging box 10 stores an inspection kit including a sample well and a specimen holding container used for dropping a liquid including a specimen into the sample well. The individual packaging box 10 includes an upper surface part 11a and a lower surface part 11b facing the upper surface part 11a. The lower surface part 11b has a perforation 11b2 for holding the container. In a region cut along the perforation 11b2 for holding the container, a lower portion of a specimen holding container main body 33a of the specimen holding container is inserted so as to be used for holding the specimen holding container main body 33a.SELECTED DRAWING: Figure 8

The invention discloses automatic tin immersion detection equipment which comprises a soldering flux dipping device, a tin immersion device, a coil testing machine, a product clamp tool and a control system, the soldering flux dipping device is used for dipping a product with soldering flux, the tin immersion device is used for tin immersion of the product, and the coil testing machine is used for detecting the product subjected to tin immersion. The automatic tin dipping machine is novel and reasonable in structure, staff only need to press a switch once after discharging is completed, the necessary procedures of soldering flux dipping, tin dipping and detection of three coil production can be automatically completed, the tin dipping efficiency and the yield of products are improved, meanwhile, the machining consistency is guaranteed, labor cost waste caused by repeated feeding and discharging is reduced, and the production efficiency is improved. And a series of problems of missing detection, poor product consistency and the like are avoided. The equipment is compact in overall structure, low in cost and small in occupied space, meanwhile, the three working procedures of soldering flux dipping, tin dipping and detection are combined into one, the labor intensity of workers can be relieved, the working procedures are simplified, and manpower is saved. And the detection process and the tin immersion process are integrated, so that complete detection can be realized, and missing detection of products is avoided.

The application relates to a chip packaging test device and a packaging test method, belonging to the technical field of chips, which comprises a workbench, a feeding mechanism penetrating through the workbench, the feeding mechanism being movably connected to the workbench along a horizontal direction; a plurality of test slots for storing packaging chips are arranged on the feeding mechanism along the moving direction of the feeding mechanism, the bottom of the test slot is provided with two rows of detection plates corresponding to the pins on the two sides of the packaging chip; the chip packaging test device further comprises a lifting mechanism arranged on the workbench, the lifting end of the lifting mechanism is connected with a test mechanism, the lifting mechanism drives the test mechanism to move along a vertical direction, so that the test mechanism is inserted into or withdrawn from the test slot located directly below. The application controls the actions of the lifting mechanism and the test mechanism through a linkage mechanism, reduces manual intervention, thereby improving the safety, accuracy and efficiency of the test process, and also reduces the cost loss and production risk caused by manual operation errors.

This utility model discloses a vacuum-resistant testing chamber with a quick-change multi-cavity carrier. The vacuum-resistant testing chamber includes: multiple quick-change fixtures, a testing chamber, and a multi-cavity carrier; the quick-change fixtures have horizontally open guide grooves and integrally connected contoured slots at the ends of the horizontal guide grooves, the lower edge of the contoured slots being lower than the lower wall height of the horizontal guide grooves; multiple quick-change fixtures can be detachably connected to both longitudinal and / or transverse sides of the testing chamber, the horizontal guide groove openings of the quick-change fixtures on both longitudinal and transverse sides facing the same direction; the frame of the multi-cavity carrier is divided into multiple product cavities in a rectangular array by horizontal plates, and the lower connecting rod of the frame fits into the contoured slot; the multi-cavity carrier is placed into the chamber, and the lower connecting rod is pushed through the horizontal guide groove into the corresponding contoured slot, thereby quickly changing the multi-cavity carrier. This utility model has the advantages of quick-change multi-cavity carriers and applicability to various product packaging tests.

This invention relates to the field of chip testing technology, and discloses a continuity test interface board, a method for automatically generating channel correspondences, and a storage medium. The method includes a test interface board with several square test areas centered on the same point. These square test areas increase proportionally from the inside out along the diagonal of the test interface board. Each square test area has an equal number of pads connected to its outer side, with the pads evenly spaced. The other end of each pad is located outside the test interface board. The pads connected to the inner square test areas pass through the outer square test areas and are positioned between the pads connected to the outer square test areas. By strategically arranging the pads, the test interface board can be compatible with various types and specifications of chips under test. Furthermore, the correspondence between pads and channels improves the overall efficiency of chip testing, ensures the accuracy of complex package testing, and enhances the degree of automated testing.

The invention relates to the technical field of chip packaging test equipment, in particular to integrated circuit chip packaging test equipment and a test method thereof.The integrated circuit chip packaging test equipment comprises a machine body, and the machine body comprises a driving mechanism, an extrusion test mechanism and a placement mechanism. Through arrangement of a disc, a notch block and a first limiting rod, due to operation of a driving motor, a rotating block pushes a through opening frame to integrally move up and down in a reciprocating mode through the notch block and a connecting rod, and meanwhile the rotating block drives the disc to rotate along the inner wall of an annular disc; therefore, the circular disc integrally drives the circular ring disc to synchronously rotate through the first limiting rod, and then the circular ring disc drives the integrated circuit chip on the detection plate to rotate and change the position, so that an operator can place the integrated circuit chip on the detection plate for testing without being below the extrusion testing mechanism. Therefore, the situation that an operator is bruised and pinched when testing the integrated circuit chip is better avoided.

The utility model discloses a separating device of a package testing machine, which comprises a feeding base, a separating needle and a separating needle driving part, the separating needle driving part is arranged below the feeding base, the top of the separating needle is inserted into the feeding base, the separating needle driving part drives the separating needle to move up and down, and the separating needle driving part drives the separating needle to move up and down. The device is characterized in that the separating needle driving part comprises a support, a piezoelectric brake and a limiting elastic piece, the top of the support is connected with the feeding base, the piezoelectric brake is installed on the support, an execution part is arranged on the piezoelectric brake, and the piezoelectric brake drives the execution part to swing; the lower portion of the separating needle is connected with the executing part, the limiting elastic piece is arranged above the executing part, one end of the limiting elastic piece is fixedly connected with the support, and the other end of the limiting elastic piece is connected with the separating needle. According to the utility model, the separating and feeding efficiency is improved, and the movement of the separating needle can be monitored and controlled in real time.

The invention discloses a product yield monitoring system and method applied to a high-speed package testing machine, and relates to the technical field of electronic component packaging monitoring control, and the system comprises the following modules: a pre-packaging detection module, which is used for arranging a conveyor belt on the outer side of a main console to convey unpackaged to-be-detected electronic components, arranging an indoor light source right above the main console, and arranging a light source right above the main console; the electronic components are shot through a high-definition camera on the upper side of the conveying belt to obtain pictures before packaging; the packaged marked products are identified through the reflection judgment module, the indoor lamp source is arranged over the main console, the conveying belt is arranged on the outer side of the main console, and the marked products are conveyed and transported by turning the conveying belt to penetrate through the main console, so that the movement direction of the conveying belt is changed, and then the movement direction of the products is changed; and finally, marking the misjudged electronic component as a to-be-identified product according to a judgment result, so that whether the electronic component covered by the reflective lines has scratches or not can be further determined subsequently.

The application relates to the technical field of integrated circuits, in particular to an integrated circuit packaging test device and a packaging test method, which comprise a seat body; a fixing device for locking an integrated circuit, wherein the fixing device is arranged at the front end of the seat body and penetrates into the interior of the seat body; by arranging a positioning mechanism, when a worker needs to fix the integrated circuit, the worker only needs to rotate a toothed belt in a corresponding direction, the toothed belt drives a threaded rod to move upwards and compresses a coil spring through a belt wheel, the threaded rod drives a piston to move upwards to a limit distance, then the worker places the integrated circuit at the upper end of the seat body and releases the toothed belt, at this moment, the coil spring drives the threaded rod to move downwards through the belt wheel, the threaded rod drives the piston to move downwards, and the integrated circuit is firmly adsorbed at the upper end of the seat body through the piston cylinder and the adsorption disc.

The invention discloses a modularized packaging testing device and method. The modularized packaging testing device comprises a testing support, a function module and a connecting assembly. The test support is of a frame type structure, a main control unit and a power module are arranged in the test support, the main control unit is used for receiving and processing test data, the power module supplies power to the whole device, and a frame of the test support is provided with a module mounting position; the function module is matched with the module installation position of the test support. The connecting assembly comprises a signal interface and a power interface which are arranged in the module mounting position, the signal interface is electrically connected with the main control unit, and the power interface is electrically connected with the power module. According to the invention, the structural design is novel, rapid switching and combination of multiple test functions can be realized, and the test module can be flexibly configured according to different test requirements, so that the test efficiency is remarkably improved, and the marketing cycle of products is shortened.

The invention discloses compression resistance detection equipment for an integrated circuit packaging test, and belongs to the technical field of integrated circuit packaging. The device comprises a body, the body is fixedly connected with a workbench, the body is fixedly provided with a power assembly, the power assembly is fixedly connected with a power plate, the power plate is provided with a mounting plate through a first thread assembly, the mounting plate is fixedly connected with a test pressing plate, and the test pressing plate is provided with a connecting block through a second bolt. The connecting block is slidably connected with a mounting frame, a first spring is fixedly connected between the mounting frame and the connecting block, and the mounting frame is fixedly connected with a bottom plate. According to the integrated circuit package compression resistance testing device, when compression resistance testing operation is carried out on integrated circuit package, a proper number of whole cameras are selected according to actual conditions, the cameras are installed on the testing pressing plate, in the testing process, the cameras are in a fixed state all the time, firmness and reliability are achieved, mounting and dismounting are quite easy, and the practical effect is good.

The utility model relates to the technical field of electrical test jigs, and discloses a detection jig for a package testing machine, which comprises a base, a plurality of connecting rods are fixedly connected to the upper side of the base, the upper ends of the plurality of connecting rods are fixedly connected with a fixed table together, a bearing plate is fixedly connected to the upper side of the fixed table, and a test jig is mounted on the upper side of the bearing plate. A test mechanism is arranged on the fixed table, a feeding mechanism is arranged on one side of the fixed table, a discharging mechanism is arranged on the other side of the fixed table, a limiting groove is formed in the fixed table, and a limiting sliding block mechanism is arranged on the inner side of the limiting groove. The clamping jaw unit is driven to be close to the testing jig located on the upper side of the fixing table, so that the to-be-tested electrical product clamped on the clamping jaw unit and the testing jig form an access, automatic testing is achieved, and the testing device has the advantages of being high in testing speed and high in efficiency.

The invention relates to the field of transport package testing and discloses a transport package testing device and method.The transport package testing device comprises a bottom plate, a detection chamber is arranged on one side of the upper end of the bottom plate, an observation window is arranged on one side of the detection chamber, a connecting frame is fixedly welded to the top of the inner side of the detection chamber, and a barometer is arranged at the lower end of the connecting frame; the bottom of the inner side of the detection chamber is connected with a supporting frame through screws, a vibration motor is arranged at the upper end of the supporting frame, a first vibration transmission plate is arranged at the upper end of the vibration motor, a vibration transmission spring is arranged at the upper end of the first vibration transmission plate, and a second vibration transmission plate is arranged at the upper end of the vibration transmission spring. According to the device, the vacuum pump is started, air exhaust and pressure reduction treatment is conducted on the interior of the detection chamber, the air pressure displayed by the barometer at the lower end of the connecting frame can be seen through the observation window, and the vacuum pump stops running until the air pressure in the detection chamber coincides with the air pressure of a plateau area to which the packaging bag is to be transported; and the low-pressure environment of the target area is accurately reproduced through the vacuum pump.

The invention belongs to the technical field of high-voltage wire coil testing, and particularly relates to high-voltage double-needle testing equipment which comprises a container. The console is arranged on the right side of the container front part; the regulation button is arranged on the front surface of the container; the voltage box is arranged on the upper portion of the container, and an adjusting box is arranged on the back of the voltage box; the front sealing baffle is arranged at the front part of the upper surface of the container; the test platform is arranged at the rear part of the upper surface of the container. The device can carry out power-on detection work on the placed circuit board, the probe can be inserted into a circuit at any part of the circuit board for detection through adjustment of the movable double-head probe part and the probe station, and due to the fact that the current introduced into the circuit is high-voltage current, when an operator carries out operation, the operation efficiency is greatly improved, and the labor intensity of the operator is reduced. And if the circuit board has a breakdown problem, the circuit board has an electric leakage phenomenon, and at the moment, the current introduced into the circuit board flows back to the interior of the probe station under the guiding action of the elastic sliding rod, so that the problem of electric shock of an operator is avoided.

The present application belongs to the field of integrated circuit package testing, and particularly relates to a TGV defect detection method based on PSO-XGBoost. A defect model is established by taking the cavity, open circuit and composite defects in TGV as the research object, and the S parameters of different defects are extracted based on the established defect model; the TGV cavity defect radius, TGV open circuit defect length and TGV composite defect combination form are taken as the data classification basis, and the labels are set; a PSO-XGBoost classification model is established, the particle swarm optimization (PSO) algorithm is used to optimize the extreme gradient boosting (XGBoost), and the best hyperparameter is found based on the PSO-XGBoost algorithm; the S parameters of different defects are classified and processed by using the PSO-XGBoost model, the defect type is predicted, and the TGV defect detection accuracy is improved. The detection method avoids the secondary damage of TGV in the defect detection process, solves the problems that the traditional TGV detection method is difficult to accurately detect the micro defect and composite defect and has low detection efficiency, and has certain reference value for optimizing the design and manufacturing process of TGV, improving the TGV defect and improving the three-dimensional package yield.

The invention relates to the technical field of chip testing, and discloses a chip packaging and testing integrated device and a testing method.The chip packaging and testing integrated device comprises a testing table, stand columns are fixedly installed at the four corners of the two ends of the upper surface of the testing table, and an electric sliding rail is jointly and fixedly installed at the upper ends of the two stand columns arranged at the same end of the testing table; two symmetrically-arranged first mounting frames are slidably mounted between the two sets of electric sliding rails. According to the invention, the scanner, the ultrasonic distance measuring sensor and the detection assembly with the correction function are integrated in the same device, and when the device works, the scanner carries out preliminary screening and judges the coplanarity of the pins; for a slightly deformed pin, a correction program can be immediately started, a first correction block is driven by a movable seat to transversely move, or the first correction block is driven by a third electric telescopic rod to press down or lift up, accurate online micro-correction can be carried out aiming at different defect modes of the pin, and an electrical test is immediately carried out after correction. And an efficient closed-loop flow is formed.

The application is suitable for the technical field of package testing, and provides a switching device and a manufacturing method of the switching device. The switching device comprises a first microwave dielectric substrate and a second microwave dielectric substrate; the first microwave dielectric substrate is provided with a first metallized via, one end of the first metallized via is fixedly provided with a first pad, the other end of the first metallized via is fixedly provided with a second pad, and the second pad is fixedly provided with a conductive ball structure; the second microwave dielectric substrate is provided with a second metallized via, one end of the second metallized via is fixedly provided with a third pad connected with the conductive ball structure, and the other end of the second metallized via is fixedly provided with a fourth pad. The first pad is used for abutting and electrically connecting with one of a test object and a test PCB, and the fourth pad is used for abutting and electrically connecting with the other of the test object and the test PCB. The switching device provided by the application realizes the electrical connection test of the test object and the test PCB, and has low manufacturing cost and long service life.

The application discloses a DBC packaging test equipment, which comprises a static test equipment and a plurality of dynamic test equipment connected in series; the static test equipment and the dynamic test equipment both comprise a conveying line one, a three-axis mechanical hand, a conveying line three and a rotary test platform; the static test equipment further has a static test machine and a basket feeding mechanism; the conveying line one and the basket feeding mechanism convey DBC substrates to the conveying line three; the three-axis mechanical hand takes the DBC substrates on the conveying line three to the rotary test platform; the rotary test platform sends the DBC substrates into the static test machine to conduct normal-temperature static test; and after the test is completed. The DBC packaging test equipment combines normal-temperature static test and high-temperature dynamic test, simplifies a test line architecture, reduces test line cost, reduces a test line land area, optimizes a test process, realizes full-automatic test operation, does not need manual assistance, improves test efficiency and product yield.

The application discloses a kind of seismic source control digital package test device, it is related to marine oil seismic exploration field, wherein, central processing circuit in the device is used to communicate with control circuit, the data of the digital package to be measured that control circuit feedback is analyzed, to detect whether each function of the digital package to be measured is normal;Control circuit is used to control the digital package to be measured, and the data of multiple dimensions corresponding to the digital package to be measured is collected and fed back to central processing circuit;Power supply circuit is used to provide electrical energy for each circuit in the device and the digital package to be measured;Power filter circuit is used to filter the output voltage of power supply circuit;Pre-set capacitor is used to charge test for the digital package to be measured;Pre-set power resistor is used to discharge to pre-set capacitor, to simulate air gun ignition.The application realizes the comprehensive automatic test of digital package function, effectively reduces the omission in test process, and improves test efficiency.

The utility model discloses a film rolling tightness testing device, and relates to the technical field of packaging testing. Comprising an operation table, the operation table is provided with a testing mechanism, the testing mechanism comprises a sliding seat and a label, the top surface of the sliding seat is fixedly connected with the bottom surface of the operation table, the inner wall of the sliding seat is slidably connected with a sliding frame, the sliding frame is L-shaped, and the inner side wall of the sliding frame is fixedly connected with a mounting seat. A tension meter is fixedly mounted on the mounting seat, and a reinforcing rib is fixedly connected to the bottom of the tension meter. In the winding process of the adhesive film, a marked label is placed on the outer side of the adhesive film, it is guaranteed that the marked position of the label is flush with the edge of the adhesive film, after the adhesive film is wound, the adhesive film is rotated to enable the label to be kept right above, then the label is hooked through a tension meter and pulled out through constant force, and the winding tightness of the adhesive film is judged by observing the change of the numerical value of the tension meter. The operation is simple, and the problems of inaccuracy, non-objectivity and the like of manual judgment are solved.

The invention discloses an adapter device for a chip package test. The adapter device for the chip package test comprises a connecting plate comprising a plurality of package test units. Each packaging test unit comprises a board slot used for accommodating a microchip, a signal transmission sheet coupled with the board slot, a signal connector coupled with the board slot, and a chip substrate. In some embodiments, the adapter apparatus for chip package testing also includes an adapter board coupled with the connection board through an inter-board connection region included in the adapter board. A method for chip package testing includes bonding a plurality of microchips to a chip substrate of a connection board, coupling the connection board with an adapter board, inspecting the plurality of microchips, and identifying a faulty microchip using an identification code.