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Post-packaging test equipment for plastic package surface mounted devices diode

A technology for testing equipment and diodes, applied in packaging, packaging protection, transportation and packaging, etc., can solve the problems of low test quality, low test efficiency, and unstable product quality in manual testing, and achieve the goal of improving test efficiency and test quality. Effect

Inactive Publication Date: 2011-05-18
上海骏图电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The last process in the production of plastic-encapsulated SMD diodes is the post-package test. The post-package test of the existing plastic-encapsulated SMD diodes is performed manually, or some simple equipment with a high degree of manual intervention is used. Therefore, the existing plastic-encapsulated SMD diodes The post-packaging test efficiency is low, and its production capacity can only reach about 5K / h, and the test quality of manual testing is not high, making the product quality unstable

Method used

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  • Post-packaging test equipment for plastic package surface mounted devices diode
  • Post-packaging test equipment for plastic package surface mounted devices diode
  • Post-packaging test equipment for plastic package surface mounted devices diode

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Embodiment Construction

[0026] The embodiments of the present invention will be described in further detail below in conjunction with the accompanying drawings, but the present embodiments are not intended to limit the present invention, and any similar structures and similar changes of the present invention should be included in the protection scope of the present invention.

[0027] Such as figure 1 As shown, the post-package testing equipment for plastic-sealed patch diodes provided by the embodiment of the present invention is characterized in that it includes a main base 1, a feeding device, a material suction device and a monitoring system;

[0028] Such as figure 2 As shown, the feeding device includes a storage bin 21, a storage hopper 22, a circular vibration plate 23 and a flat rail 24; the storage bin 21, the storage hopper 22, and the circular vibration plate 23 are fixed on the main base sequentially from top to bottom 1, the opening of the hopper of the circular vibrating plate is upw...

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Abstract

The invention discloses post-packaging test equipment for a plastic package surface mounted devices diode (SMD) diode, which relates to the technical field of semiconductor packaging test, and aims to solve the technical problems in improving the packaging test efficiency and the test quality. The equipment comprises a main base, a feeding device, a suction device and a monitoring system, wherein the suction device comprises a main supporting rotating drum, a main rotating disc, a lifting rod and a lifting disc; the main supporting rotating drum and the main rotating disc form a rotating tower structure; a plurality of suction nozzles are arranged in a circle around the axle center on the main rotating disc; the lifting disc is arranged above the main rotating disc and is fixedly connected with each suction nozzle; the upper end of the lifting rod is connected with the lifting disc through a shaft, the rod body of the lifting rod passes through the main supporting rotating drum and is coaxial with the main supporting rotating drum; and a positioning device, a polar rotating device, a test device, a material lowering device, a marking device and a packaging device are arranged right below each suction nozzle along the rotation direction of the main rotating disc respectively. The equipment provided by the invention can improve the post-packaging test efficiency of the SMD diode.

Description

technical field [0001] The invention relates to semiconductor packaging and testing technology, in particular to a technology of subsequent packaging and testing equipment for plastic-sealed patch diodes. Background technique [0002] At present, with the continuous development of semiconductor technology, the market demand for plastic-encapsulated SMD diodes is gradually increasing. The last process in the production of plastic-encapsulated SMD diodes is the post-package test. The post-package test of the existing plastic-encapsulated SMD diodes is performed manually, or some simple equipment with a high degree of manual intervention is used. Therefore, the existing plastic-encapsulated SMD diodes The efficiency of post-packaging testing is low, and its production capacity usually only reaches about 5K / h, and the test quality of manual testing is not high, making the product quality unstable. Contents of the invention [0003] In view of the above-mentioned defects in th...

Claims

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Application Information

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IPC IPC(8): B65B57/14G01R31/26
Inventor 王戟王惠云
Owner 上海骏图电子科技有限公司
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