Protection ring for preventing short circuit of test structure, and manufacturing method and package testing method thereof

Abstract

The invention provides a protection ring for preventing short circuit of a test structure, and a manufacturing method and a package testing method thereof. The protection ring comprises a separating structure, three upper medium layers and a plurality of metal pads, wherein the separating structure comprises a plurality of the same interconnection layers which are sequentially connected layer by layer from the bottom up; a metal-strip-like enclosing structure is arranged in each interconnection layer; the metal-strip-like enclosing structure is formed by grooving a low-K medium layer and filling grooves with metal; the three upper medium layers are formed in the separating structure; windows are formed in the three upper medium layers; the metal pads are formed in the low-K medium layers enclosed by the metal-strip-like enclosing structures; each window corresponds to a metal pad, thus preventing the performance worsening problem of the test structure caused by water entering the test structure in the slice packaging process or other operating process, and avoiding the short circuit problem of the test structure caused by contact of a metal ball connecting ball and the protection ring because a part of the metal ball connecting ball is outside the metal pad due to too small metal pads or operating errors.

Description

technical field [0001] The invention belongs to the technical field of semiconductor chip packaging, and in particular relates to a protection ring for preventing short circuit of a test structure, a manufacturing method thereof, and a packaging and testing method. Background technique [0002] When the test structure needs to be tested at the package level, the test structure will punch metal connection balls on the metal pads of the corresponding test structure, and then connect metal wires to the ceramic base pins on the metal connection balls, such as figure 1 As shown in the structure of the ceramic base, ① is the test structure placement area, ② is the pin of the ceramic base, figure 2 It is an enlarged view of the test structure after packaging, ③ is a metal pad, ④ is a metal wire, and ⑤ is a metal connection ball. Wafer dicing needs to be carried out in a water environment. Water will diffuse to all parts of the test structure through the dielectric layer (inorgani...

AI Technical Summary

Problems solved by technology

[0004] When the metal wire is connected to the ceramic base pin on the metal wire ball on the metal pad, the distance between the metal protection ring and the metal pad is limited due to the size of the metal pad being too small relative to the metal wire ball or the wiring error. , and the upper dielectric layer formed on the uppermost interconnection layer of the metal protection ring is one layer, and it is easy for the metal connection ball to hit the metal pad. Layer ⑦, so it will cause the hidden danger of short circuit in the test structure, such as Figure 5 as shown, Image 6 It is a partially enlarged top view, ⑧ is the connection line between the test structure and the metal pad

[0005] For this reason, it is urgent to provide a new protective ring to avoid the contact between the metal connecting ball and the protective ring due to the metal pad being too small or operating errors or the thickness of the upper dielectric layer making the metal connecting ball part reach the metal pad. The short-circuit problem caused by the test structure

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