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BGA package testing socket

A packaging testing and socket technology, which is applied in the direction of single semiconductor device testing, semiconductor/solid-state device testing/measurement, electrical measurement, etc., can solve problems such as unfavorable packaging and testing efficiency, increase staff work, etc., to reduce work intensity and improve the effect. , the effect of high degree of automation

Inactive Publication Date: 2016-05-18
JIANGSU FUTIAN ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the problem with this solution is that the actuation of the pressing device is achieved by the staff adjusting the operating columns one by one, which increases the work of the staff and is not conducive to the improvement of the efficiency of packaging and testing.

Method used

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  • BGA package testing socket
  • BGA package testing socket
  • BGA package testing socket

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] Such as figure 1 , figure 2 Shown, a kind of BGA package test socket, comprises the first support part 10 of fixing BGA package, the second support part 30 of supporting BGA package 60, the third support part 40 of fixing socket pin 50; The first support part 10 Be fixed on the second support member 30; The second support member 30 is fixed on the third support member 40; The first support member 10 and the second support member 30 are square frames; The BGA packaging test socket also includes the socket The pressure between the pin 50 and the BGA package 60 drops to a pressure relief device below the external pressure of the test socket; the pressure relief device includes an air cavity 31 arranged between the socket pin 50 and the BGA package, communicated with the air cavity 31 The pipeline 32 and the power unit 33 communicated with the pipeline 32; the air chamber 31 is distributed in the idle space between the socket needles 50, and an air hole 310 is provided ab...

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PUM

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Abstract

The invention discloses a BGA package testing socket which comprises the components of a first supporting component which fixes the BGA package, a second supporting component which supports the BGA package, and a third supporting component which fixes socket needles. The first supporting component is fixed to the second supporting component. The second supporting component is fixed to the third supporting component. The first supporting component and the third supporting component are square frames. The upper part of the four sidewalls of the first supporting component is provided with a horizontal reversed-T-shaped chamber. The driving device is arranged in the chamber of the first supporting component. The BGA package testing socket has advantages of realizing simple operation, facilitating package placement, reducing working strength of an operator, and improving package test effect.

Description

Technical field: [0001] The invention relates to a chip test tool, in particular to a BGA package test socket. Background technique: [0002] Semiconductor components are processed into semiconductor chip packages through a series of packaging processes. The processed semiconductor chip package must go through an electrical inspection project before being provided to the user; in the above-mentioned electrical inspection project, the electrical characteristics of the semiconductor chip package are checked by using a test socket. Here, the test socket is a device that electrically connects the direct loop of each semiconductor component to the test instrument. [0003] The pressurized packaging test socket in the prior art is composed of an upper cover, a side support, a lower chassis, fixing screws, a fixing plate, a pressure plate, and socket pins. During actual operation, firstly, the fixed disk on which the socket pins are fixed is connected to the lower chassis through...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/26H01L21/66
CPCG01R1/0416G01R31/2601H01L24/00
Inventor 叶伟然
Owner JIANGSU FUTIAN ELECTRIC CO LTD
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