Planarizing and testing of bga packages

Abstract

The planarity of external terminals or a ball grid array on a device package can be improved through use of test probes that flatten the electrical terminals while forming the electrical contact for package testing. After testing, the package has external terminals with improved planarity that improves the electrical connections formed during assembly of a system containing the package.

Description

Background technique [0001] A ball grid array package (BGA) can provide a packaged integrated circuit device with a high density of terminals. FIG. 1A shows an example of a conventional BGA package 100 including a semiconductor device 110 on an interconnect substrate 140 . Device 110 , which may be any type of semiconductor device, typically has electrical contact pads that are electrically connected to contact pads or traces on interconnect substrate 140 . FIG. 1A shows an example in which wire bonds 120 electrically connect semiconductor device 110 to interconnect substrate 140 , and encapsulant 130 protects and insulates wire bonds 120 . Alternatively, other electrical connection techniques such as flip-chip packaging techniques may provide electrical connections to the interconnect substrate 140 . Interconnect substrate 140 is typically made of an insulator including conductive traces (not shown) that provide electrical signal paths. Contact pads or terminals of device ...

AI Technical Summary

Problems solved by technology

Such warping results in a non-planar array of terminals 150 and a less reliable electrical connection

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