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Integrated circuit package testing device for continuous testing

A technology of packaging testing and integrated circuits, which is applied in the direction of circuits, semiconductor/solid-state device testing/measurement, electrical components, etc., can solve the problems of low testing efficiency and achieve the effect of high testing efficiency and continuous testing

Active Publication Date: 2020-03-27
深圳市创芯在线检测服务有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the technical problem of low test efficiency in existing equipment, and provides a continuous test integrated circuit packaging and testing device

Method used

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  • Integrated circuit package testing device for continuous testing
  • Integrated circuit package testing device for continuous testing

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Embodiment Construction

[0016] Such as figure 1 , figure 2 As shown, a kind of continuous testing integrated circuit packaging and testing device includes a support 10 and a continuous testing device 20; the support 10 is a rectangular parallelepiped with a rectangular groove-like test groove 100 that penetrates up and down in the middle; the left and right side walls of the test groove 100 are upper ends A pair of front and rear blocking blocks 11 arranged symmetrically before and after are formed respectively; a pair of front and rear blocking blocks 11 on the left side and a pair of front and rear blocking blocks 11 on the right side are connected into one body through a partition plate 12; the continuous testing device 20 includes a rectangular frame Shaped test bracket 21; the front and rear side walls of the test bracket 21 are located at the front and rear sides of a pair of front and rear blocking blocks 11 and the partition plate 12, and the upper and lower side walls are respectively locat...

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Abstract

The invention discloses an integrated circuit package testing device for continuous testing, being characterized in that a pair of front and rear stop blocks which are symmetrically arranged front andback are formed on each of the left and right side walls of a testing groove; the pair of front-back stop blocks on the left side and the pair of front-back stop blocks on the right side are connected into a whole through a partition plate; the continuous testing device comprises a rectangular frame-shaped test bracket; front and rear side walls of the test bracket are positioned on front and rear sides of the pair of front-back stop blocks and the partition plate; upper and lower side walls are respectively positioned on upper and lower sides of the pair of front-back stop blocks and the partition plate; the test bracket is arranged between the front and rear side walls of the testing groove in a left-right reciprocating manner; a test support plate is arranged on the upper end surface of the lower side wall of the test bracket in a lifting manner; a plurality of uniformly distributed probes are formed on the upper end surface of the test support plate; and lower support plates are rotationally arranged between the partition plate and the left and right side walls of the test groove respectively. The integrated circuit package testing device for continuous testing can complete continuous testing of integrated circuit packaging through left-right reciprocating motion of the test support, and is high in the testing efficiency.

Description

technical field [0001] The invention relates to the field of integrated circuit packaging and testing, in particular to an integrated circuit packaging and testing device for continuous testing. Background technique [0002] Semiconductor components are processed into semiconductor chip packages through a series of packaging projects, such as BGA packages. The processed semiconductor chip packages must go through electrical inspection projects before being provided to users; electrical characteristics. [0003] The pressurized packaging test socket in the prior art is composed of an upper cover, a side support, a lower chassis, fixing screws, a fixing plate, a pressure plate, and socket pins (ie, probes). The operator first puts it into the socket from top to bottom, and then manually operates the pressure plate to press down so that the ball pins of the package are in contact with the socket pins (probes). classification; [0004] During this process, the operator puts i...

Claims

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Application Information

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IPC IPC(8): H01L21/66H01L21/67
CPCH01L22/12H01L21/67126
Inventor 徐俊
Owner 深圳市创芯在线检测服务有限公司
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