Integrated circuit package testing device for continuous testing

Abstract

The invention discloses an integrated circuit package testing device for continuous testing, being characterized in that a pair of front and rear stop blocks which are symmetrically arranged front andback are formed on each of the left and right side walls of a testing groove; the pair of front-back stop blocks on the left side and the pair of front-back stop blocks on the right side are connected into a whole through a partition plate; the continuous testing device comprises a rectangular frame-shaped test bracket; front and rear side walls of the test bracket are positioned on front and rear sides of the pair of front-back stop blocks and the partition plate; upper and lower side walls are respectively positioned on upper and lower sides of the pair of front-back stop blocks and the partition plate; the test bracket is arranged between the front and rear side walls of the testing groove in a left-right reciprocating manner; a test support plate is arranged on the upper end surface of the lower side wall of the test bracket in a lifting manner; a plurality of uniformly distributed probes are formed on the upper end surface of the test support plate; and lower support plates are rotationally arranged between the partition plate and the left and right side walls of the test groove respectively. The integrated circuit package testing device for continuous testing can complete continuous testing of integrated circuit packaging through left-right reciprocating motion of the test support, and is high in the testing efficiency.

Description

technical field [0001] The invention relates to the field of integrated circuit packaging and testing, in particular to an integrated circuit packaging and testing device for continuous testing. Background technique [0002] Semiconductor components are processed into semiconductor chip packages through a series of packaging projects, such as BGA packages. The processed semiconductor chip packages must go through electrical inspection projects before being provided to users; electrical characteristics. [0003] The pressurized packaging test socket in the prior art is composed of an upper cover, a side support, a lower chassis, fixing screws, a fixing plate, a pressure plate, and socket pins (ie, probes). The operator first puts it into the socket from top to bottom, and then manually operates the pressure plate to press down so that the ball pins of the package are in contact with the socket pins (probes). classification; [0004] During this process, the operator puts i...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the technical problem of low test efficiency in existing equipment, and provides a continuous test integrated circuit packaging and testing device

Images