a cooling element

A technology of heat dissipation components and components, which is applied in the direction of electrical components, electrical equipment structural parts, cooling/ventilation/heating transformation, etc. It can solve the problems of cumbersome dispersion methods of nanoparticles and poor economic benefits, and achieve small contact angles and surface High tension and improved corrosion resistance

Active Publication Date: 2022-03-29
AAC TECH NANJING +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be seen that the current methods for improving the dispersion of nanoparticles are relatively cumbersome and have poor economic benefits.

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0036] Preparation of ionic fluid working medium: adding a certain amount of aluminum sulfate solid into deionized water to prepare an aluminum sulfate solution with a weight content of 0.1 wt%.

[0037] Preparation of the heat dissipation element 100: use the aluminum sulfate solution obtained above as a cooling working medium, sinter the absorbent core to the element body 1 under a nitrogen atmosphere, inject the aluminum sulfate solution obtained above into the closed inner cavity 10, and finally The heat dissipation element 100 is manufactured through steps such as vacuuming and end capping.

Embodiment 2

[0039] Preparation of ionic fluid working medium: adding a certain amount of aluminum sulfate solid into deionized water to prepare a 0.4wt% aluminum sulfate solution.

[0040] Preparation of the heat dissipation element 100: use the aluminum sulfate solution obtained above as a cooling working medium, sinter the absorbent core to the element body 1 under a nitrogen atmosphere, inject the aluminum sulfate solution obtained above into the closed inner cavity 10, and finally The heat dissipation element 100 is manufactured through steps such as vacuuming and end capping.

Embodiment 3

[0042] Preparation of ionic fluid working medium: adding a certain amount of solid aluminum sulfate into deionized water to prepare a 1wt% aluminum sulfate solution.

[0043] Preparation of the heat dissipation element 100: use the aluminum sulfate solution obtained above as a cooling working medium, sinter the absorbent core to the element body 1 under a nitrogen atmosphere, inject the aluminum sulfate solution obtained above into the closed inner cavity 10, and finally The heat dissipation element 100 is manufactured through steps such as vacuuming and end capping.

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Abstract

The invention provides a heat dissipation element, which includes an element body formed with a closed inner cavity, an absorbent core located in the closed inner cavity, and a cooling working medium filled in the closed inner cavity. The cooling working medium is an ionic fluid working medium, and the ionic fluid working medium It is an aqueous solution of acidic salt ionic compounds. The radiating element provided by the invention uses ionic fluid working medium instead of traditional water working medium, and the ionic fluid working medium has better heat transfer effect, thus improving the heat dissipation performance of the radiating element.

Description

【Technical field】 [0001] The invention relates to the technical field of heat dissipation, in particular to a heat dissipation element. 【Background technique】 [0002] With the popularization and promotion of 5G technology, the high-frequency and high-speed development trend of mobile phone electronic components and integrated circuits is becoming more and more obvious, which leads to an increase in the heat flux generated by the processor during operation, a sharp increase in heat generation, and the electronic equipment is working. Reliability is extremely sensitive to temperature, and high heat flow will pose a great threat to the reliability of electronic components. In order to solve this problem, rapid heat dissipation technology for electronic components has received extensive attention. At present, the heat dissipation technology of mobile phone electronic products is usually to place heat pipes or vapor chambers at heat sources such as mobile phone processors and ba...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20218H05K7/20509
Inventor吴高高王和志黄国创
OwnerAAC TECH NANJING