Stimulation system with monolithic-lead component connected to skull mount package

A technology for connecting to, components, applied in the direction of head electrodes, internal electrodes, therapy, etc., capable of solving problems such as disconnection or breakage, device failure, etc.

Pending Publication Date: 2021-04-30
VERILY LIFE SCI LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, each connection has the potential to become discon

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  • Stimulation system with monolithic-lead component connected to skull mount package
  • Stimulation system with monolithic-lead component connected to skull mount package
  • Stimulation system with monolithic-lead component connected to skull mount package

Examples

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Embodiment Construction

[0025] In some embodiments, a deep brain stimulation system is provided that includes a set of electrodes, a set of traces, and a neurostimulator. In some cases, a deep brain stimulation system includes an integral thin film lead assembly (eg, cable) fabricated using the same layer of base material (eg, insulating or dielectric material, such as a polymeric material). The base material and / or the monolithic thin film lead assembly itself may have a thickness, for example, of less than about 100 μm. A monolithic thin film lead assembly may include a set of electrodes disposed on a first portion of a base material and a set of conductive traces extending across a second portion of the base material. Each trace can be connected to one of the set of electrodes. As described in further detail in U.S. Application No. (Attorney Docket No. 104167-1088568-259PV1), filed September 18, 2018, the monolithic nature of the thin film lead assembly can facilitate stabilization between compon...

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Abstract

A stimulation system can include one or more stimulating components, each of which can include one or more electrodes and one or more leads. Each lead can be connected at a first end of the lead to an electrode of the one or more electrodes and can be connected at a second end of the lead to a bonding pad of the one or more bonding pads. The stimulation system can also include a cylindrical substrate. Each stimulating component can be secured to a surface of the cylindrical substrate. The stimulation system can further include a skull-mount package that includes electronics that identify stimulation parameters. The bonding pads can be electrically connected to the electronics. The skull-mount package can further include one or more bonding pads. Each lead can be directly electrically and physically connected to a bonding pad of the one or more bonding pads.

Description

[0001] priority claim [0002] This application claims priority to U.S. Provisional Application No. 62 / 732,671, filed September 18, 2018, which is hereby incorporated by reference in its entirety. technical field [0003] Embodiments relate to implantable stimulation devices. Specifically, the system includes an implantable lead assembly extending integrally to a lead assembly that connects to one or more bond pads of a cranial mount package that includes a stimulation circuit. Background technique [0004] Medical implants are becoming more frequently used. Some medical implants include leads that deliver stimulation. For example, deep brain stimulation involves implanting lead assemblies into specific parts of the brain. The lead assembly may include coated wires to which one or more electrodes are attached. The lead assemblies may comprise conductive material and may take the form of insulated wires. A connector can connect one end of the lead assembly to a flexible ...

Claims

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Application Information

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IPC IPC(8): A61N1/05A61N1/375A61N1/36
CPCA61N1/0534A61N1/0539A61N1/37514A61N1/375A61N1/36082A61B5/6868A61B5/24A61B5/291A61N1/36125
Inventor S.萨贝桑B.卢A.卡里彻拉
Owner VERILY LIFE SCI LLC
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