13 results about "Lead (electronics)" patented technology

The present application relates to the technical field of lead-free solder alloy component design and preparation, and particularly relates to a high-strength high-thermal-stability lead-free solder alloy and a preparation method and application thereof. The lead-free solder alloy comprises Ag, Cu, Sb, Bi, Ni, Ce, Ti and Sn elements, and the content of each element is 2.0-5.0% of Ag, 0.01-0.7% of Cu, 1.0-4.0% of Sb, 1.0-5.0% of Bi, 0.01-0.5% of Ni, 0.01-1.0% of Ce, 0.005-0.5% of Ti, and the rest is Sn; wherein the Ce or Ti element is one or more than one. The solder alloy belongs to a high-strength high-thermal-stability lead-free soft solder, and is particularly suitable for the connection and packaging of devices with high working temperature, high power and high reliability in high-power semiconductor application scenarios, and can be applied to the fields of automobile electronics, ships, energy, aerospace, etc.

The invention provides a leading-out sheet, a relay, a mutual inductance relay module and a mutual inductance relay module installation method, and relates to the technical field of electronics. The lead-out piece comprises a body part and a pre-bending part, the pre-bending part is connected to the body part, and a first included angle is formed between the pre-bending part and the body part, so that an avoiding space is formed between the body part and the pre-bending part, and the avoiding space is used for avoiding adjacent components. The pre-bending part and the body part are arranged at the first included angle and form the avoiding space, and the mounting gap is reserved in advance, so that the lead-out sheet is prevented from being rigidly collided with an adjacent component during assembly, and deformation and position deviation of the lead-out sheet are avoided. Meanwhile, the avoiding space can be matched with the contours of adjacent parts and completely and effectively avoid the adjacent parts, the body part and the pre-bending part do not need to be bent or transformed again, traditional secondary bending is simplified into one-time bending forming, the assembling time of the leading-out piece is shortened, and the assembling efficiency is improved.

A neuromodulation system is provided herein. The system can include a neuromodulation device, an electronics package, which can be part of the neuromodulation device; an external controller; a sensor; and a computing device. The neuromodulation device can include a neuromodulation lead having a lead body configured to be bent to a desired shape and to maintain that shape in order to position the electrodes relative to neural and / or muscular structures when fully deployed. The neuromodulation device can also include an antenna including an upper and a lower coil electrically connected to each other in parallel. The computing device can execute a closed-loop algorithm based on physiological sensed data relating to sleep.

The invention discloses an anti-seismic electrolytic capacitor and a using method thereof, and relates to the technical field of capacitor elements, the anti-seismic electrolytic capacitor comprises an aluminum shell, a rubber sleeve wraps the aluminum shell, filling cotton and an anti-seismic rubber ring are attached to the interior of the aluminum shell, and a limiting pressing ring is arranged on the edge of the bottom end of the filling cotton; an element is coaxially arranged in the aluminum shell, the top end of the element is embedded in the limiting pressing ring, the edge of the bottom end is matched with the anti-seismic rubber ring annular groove, and the element is sleeved with a rubber ring pad. A lead seat is arranged at the bottom end of the element, a limiting rubber plate is attached below the element, an aluminum lead penetrates through the limiting rubber plate, a terminal lead is connected below the aluminum lead, a supporting angle plate is arranged at the joint, and sealing rubber wraps the periphery of the aluminum lead. Through a three-layer anti-seismic system of external buffering, internal limiting and core reinforcing, the anti-seismic capacity of the capacitor is improved, part abrasion and lead faults are reduced, long-term use stability is guaranteed, the capacitor is adaptive to the fields of automotive electronics, industrial control, new energy and the like, standardized processing is adopted, batch production is facilitated, and the capacitor has high practical value.

The utility model relates to the technical field of semiconductors, in particular to an integrated driving electronic device, which comprises a diode and a resistor chip, the diode is connected with the resistor chip through a lead, and the diode and the resistor chip are sealed in a packaging body. According to the integrated driving electronic device provided by the utility model, the diode and the resistor chip are connected and sealed in the same packaging body, so that the production efficiency is improved, and the development cost of a frame and a mold is saved; meanwhile, when the integrated driving electronic device is used by customers, the assembly efficiency is improved, the PCB space is saved, the production cost is reduced, and the integrated driving electronic device is simple in structure, convenient to manufacture and good in effect.

According to some embodiments, the present technology includes an implantable device including a lead comprising a proximal portion, a distal portion, and a longitudinal axis extending between the proximal and distal portions, and an electronics package coupled to the lead. The electronics package can comprise an antenna comprising one or more coil turns and a central region at least partially surrounded by at least one coil turn, and an enclosure comprising a channel that receives the proximal portion of the lead, the channel having a channel outlet that overlaps with the central region of the antenna, where the lead is bendable relative to the enclosure along the longitudinal axis at the channel outlet.

The utility model provides a magnetic attraction wire, and belongs to the technical field of electronics and electrics. The utility model solves the problems that in the teaching demonstration process, the current connection modes between leads and between leads and binding posts are relatively complex, and when students connect the leads or connect the leads to the binding posts, the outgoing line contact is often poor, and the electrification is not smooth. A magnetic attraction wire comprises a first shell and a second shell, the first shell and the second shell are fixedly attached together, a wire and a wire magnetic attraction head are arranged in the first shell and the second shell, the wire is connected with the wire magnetic attraction head, the wire penetrates into the first shell and the second shell from the bottom, and the wire magnetic attraction head is exposed out of one side of the first shell and one side of the second shell. And the wire magnetic suction head can be inserted into the other shell I and the other shell II. The wire connecting device has the advantages that the wire connecting mode is simpler by endowing the wire head with the magnetic attraction performance, and the examination point of the related binding post can be practiced.

The application provides a high-strength lead-free solder for power electronics and a preparation method thereof, the high-strength lead-free solder for power electronics comprises the following elements in percentage by weight: Bi 2.5-3.5%, Sb 2.5-3.5%, B 0.001-0.05%, and the rest is Sn and inevitable impurities. The lead-free solder in the application belongs to a high-strength lead-free soft solder, the solder structure has no segregation of Bi, and contains the interface stabilizing element B, has excellent matrix structure and interface structure stability, and thus has high mechanical strength and excellent heat cycle resistance and other reliability. Moreover, compared with the traditional Sn-Ag-Cu solder, the alloy material is low in cost and easy to obtain.

A body sensing unit having a pad part which adheres to the skin and a lead or tail part which electrically connects to the pad part. The lead or tail part is formed by a flat substrate, for example carrying printed electronics, and which has a novel shape which forms a coil or loop, or part thereof, around at least part of the pad part. The novel shape changes the distribution of stress if the tail is displaced, e.g. pulled or tugged, during use, lessening the chance that the pad part becomes detached from the skin.

The application relates to the technical field of electronics, in particular to an electrostatic elimination device, an electrostatic elimination method and a manufacturing system. The electrostatic elimination device comprises a containing cavity, a battery pack, a lead connector, a switch piece and an electrical connector. The containing cavity is used for containing a carrier plate carrying the battery pack. The battery pack comprises a first battery and a second battery connected in series. The lead connector comprises a zero potential node between a first electrode of the first battery and a second electrode of the second battery. The switch piece is configured to switch the electrical connection state between the electrical connector and the battery pack. The electrical connector is electrically connected to the zero potential node and coupled with a detection device, so that an electrostatic discharge path is formed between the zero potential node and the detection device.

This invention discloses a method for preparing a lead-free material with a low coefficient of thermal expansion for flexible electronics, belonging to the field of polymer composite materials technology. The material prepared by this method comprises, along its thickness, layers A, B, and C. Layers A and C use aromatic polyimide as a matrix, with surface-modified hafnium tungstate phosphate nanoparticles dispersed thereon. Layer B uses poly(p-phenylene-2,6-benzobisoxazole) nanofibers as a continuous phase framework, loaded with hexagonal boron nitride nanosheets and Ti3C2T… x MXene nanosheets were obtained by hot pressing three layers together under an argon atmosphere. The resulting material exhibits a coefficient of thermal expansion reduced to 1.2–2.9 ppm / K and an in-plane thermal conductivity of 18.7–25.1 W / (m·K), combining excellent flexibility and mechanical properties. It is suitable for flexible copper-clad laminates, chip packaging, and integrated heat dissipation and shielding substrates for high-power electronic devices.

A electrical contact for coupling a contact of a medical lead with electronics of a medical device is described. For example, the electrical contact includes an outer wall defining a contact longitudinal axis and including an inner surface and an outer surface. The electrical contact can include a plurality of deflectable fingers extending radially inward from the outer wall and into a contact opening defined by the inner surface of the outer wall, wherein the outer wall comprises a plurality of protrusions, each respective protrusion of the plurality of protrusions is configured to prevent the medical lead from moving a respective deflectable finger of the plurality of deflectable fingers beyond a radial limit defined by the respective protrusion. The electrical contact can be configured to be disposed within a housing defining a housing longitudinal axis such that the contact longitudinal axis is aligned with the housing longitudinal axis.

The utility model discloses a stable loudspeaker easy to produce, and particularly relates to the technical field of loudspeakers, the stable loudspeaker easy to produce comprises a support, a voice coil, a vibrating diaphragm, a washer, magnetic steel and a U-shaped cup, the voice coil is provided with a lead, the support is provided with a welding table, the lead of the voice coil is fixed on the welding table of the support through soldering tin, the vibrating diaphragm has an inner diameter and an outer diameter, the inner diameter of the vibrating diaphragm is bonded with the voice coil, and the washer is arranged on the U-shaped cup. The outer diameter of the vibrating diaphragm is adhered to the support, the U-shaped cup, the magnetic steel and the washer form a magnetic circuit part, the magnetic circuit part is adhered to the corresponding part of the support through glue after being magnetized to be qualified, the bottom of the magnetic steel is adhered to the bottom of an inner cavity of the U-shaped cup through glue, and the bottom of the washer is adhered to the top of the magnetic steel. According to the utility model, through precise positioning, high-efficiency magnetic circuit driving, cooperative fixation of the vibrating diaphragm and modular assembly of the structural design, the requirements of high tone quality, high reliability, easy productivity and high stability are realized, and the loudspeaker is suitable for consumer electronics, automobile sound equipment and other scenes with strict requirements on performance and volume.