30 results about "Lead (electronics)" patented technology

The invention discloses lead-free superfine glass powder and a synthetic method thereof. The lead-free superfine glass powder comprises the following components in percentage by weight: 35-55% of Bi2O3, 5-30% of SiO2, 5-25% of B2O3, 2-10% of ZnO and 1-5% of Al2O3 and is synthesized by respectively taking bismuth nitrate, ethyl orthosilicate, boracic acid, zinc acetate or zinc nitrate and aluminum isopropoxide or aluminum nitrate as the precursors of Bi2O3, SiO2, B2O3, ZnO and Al2O3, respectively taking deionized water, anhydrous ethanol, citric acid and nitric acid as a solvent, a complexing agent and a catalyst and adopting a sol-gel method. The lead-free superfine glass powder disclosed by the invention has the advantages of no lead, environment friendliness, high chemical stability, small powder particle size and high sintering activity, can be used as the inorganic binder of various ceramics and glass substrates and also be used as an inorganic binder phase and added to electronic paste, is easy to improve the printing and sintering property of the electronic paste through a screen mesh due to small particle size and has a wide application prospect in the fields of electronics and electrical appliances.

The invention provides a lead-free solder for the microelectronics industry and a preparation method thereof. The lead-free solder is prepared from the following components in percentage by weight: 7.0 to 10.0 percent of Zn, 0.05 to 5.0 percent of In, 0.05 to 2.0 percent of Ga, the balance of Sn, and smaller than 0.2 percent of inevitable impurities. The solder contains few components, is low in melting temperature and excellent in wettability, oxidation resistance and mechanical property, can form a good welding joint with various semiconductor materials with different properties in the microelectronics industry, and is suitable for popularization and application.

The invention discloses a rapid detection method for simultaneous determination of lead and cadmium content in coupernick, and belongs to the field of detection conducted by means of inductively coupled plasma spectrometer. The method is used for rapid detection of the lead and cadmium content in the coupernick in products such as electronics, bags and imitation ornaments. By determining the source of unknown spectral interference in the coupernick, an interference correction coefficient method is adopted for correcting results, so that the requirement of not exceeding the limit is met. Accordingly, the interference is corrected, the accuracy is improved, operation is easy and efficient, and the detection cycle is shortened.

The invention relates to a process for forming a lead-based ceramic oxide dielectric material comprising at least one pyrochlore crystalline phase, which process comprises the following steps: a) a step of depositing at least one amorphous layer of said lead-based ceramic oxide material on a substrate; and b) a crystallization annealing step carried out on said amorphous layer at a temperature not exceeding 550° C., by means of which a lead-based ceramic oxide dielectric material comprising at least one pyrochlore phase is obtained. Application to the fabrication of capacitors on integrated circuits.

The invention relates to the field of special connection, and discloses a method for connecting a thin film and a lead by using a spraying process, a fixed protective thin film is prepared at the joint of the thin film and the lead through the spraying process, non-destructive connection of a thin film electrode and the lead is realized, and a fixed protective coating of 150 microns or more is formed at the joint. The bonding strength between the fixed coating and a matrix is 20-40 MPa, and the matrix can be a metal matrix, a ceramic matrix or a polymer matrix. According to the invention, the ceramic powder is heated to a semi-molten state by adopting a spraying process and is sprayed at the joint of the film and the lead, so that the bonding strength of the formed connecting coating is high, and the damage of high-temperature welding to the film and the lead with smaller thickness scale is overcome. The method is economical, environmentally friendly, high in joint bonding strength, excellent in performance and suitable for continuous operation of a production line, and has wide application prospects in the fields of aerospace, electronics and electrics, ship engineering and the like.

The invention relates to the technical field of intelligent electronics, and discloses a dry reed electromagnetic relay. The relay comprises a tube body, the two acting ends of the tube body are fixedly connected with leads, the other ends of the leads are fixedly connected with a conductive shell, the interior of the conductive shell is slidably connected with a baffle, and the left side of the baffle is fixedly connected with a supporting rod. The other end of the supporting rod is fixedly connected with a sliding block. The reed is arranged in the conductive shell, so that a bent area is located in a pin tube body when deflection occurs, damage to the tube body caused by deflection of a lead and the reed is effectively eliminated, meanwhile, automatic switching of two working modes is achieved through heating expansion of gas on the right side of the conductive shell, and the long-time continuous electrifying effect is achieved; and meanwhile, the effect of disconnecting an external magnetic field and quickly disconnecting the reed switch during long-time continuous work is realized through the matched arrangement of the sliding block, the iron core and the coil, and the problem of slow contact disconnection caused by long-time continuous work of the reed switch in the prior art is solved.

A stimulation system can include one or more stimulating components, each of which can include one or more electrodes and one or more leads. Each lead can be connected at a first end of the lead to an electrode of the one or more electrodes and can be connected at a second end of the lead to a bonding pad of the one or more bonding pads. The stimulation system can also include a cylindrical substrate. Each stimulating component can be secured to a surface of the cylindrical substrate. The stimulation system can further include a skull-mount package that includes electronics that identify stimulation parameters. The bonding pads can be electrically connected to the electronics. The skull-mount package can further include one or more bonding pads. Each lead can be directly electrically and physically connected to a bonding pad of the one or more bonding pads.

A neuromodulation system is provided herein. The system can include a neuromodulation device, an electronics package, which can be part of the neuromodulation device; an external controller; a sensor; and a computing device. The neuromodulation device can include a neuromodulation lead having a lead body configured to be bent to a desired shape and to maintain that shape in order to position the electrodes relative to neural and/or muscular structures when fully deployed. The neuromodulation device can also include an antenna including an upper and a lower coil electrically connected to each other in parallel. The computing device can execute a closed-loop algorithm based on physiological sensed data relating to sleep.

The invention discloses a photoelectric signal switching connector, which belongs to the technical field of electronics and comprises a box body, an electric connector and an optical connector, wherein the box body is made of a metal material and is provided with a conversion cavity and a control cavity, a device mounting position is arranged in the conversion cavity, and a glass-sealed and welded contact pin is arranged between the conversion cavity and the control cavity. A heat conduction block extending to the outer side of the box body is arranged on the bottom face of the device mounting position of the conversion cavity, and a control connector is further arranged on the box body. The shell of the connector is made of copper and is provided with layers, the lead is welded by glass sealing, the connector is high in strength, the appearance of the connector is only 58mm*45mm*13mm, and the connector can be used for conversion of four groups of high-speed signals. The connector is reasonable in design, strong in interference resistance, high in signal quality and good in heat conduction performance; the device has the remarkable advantages of small size, high conversion quality and high applicable power, and can be used in special fields such as spaceflight, aviation or military.

The invention relates to the technical field of microelectronics, in particular to a ferroelectric film capacitor and a preparation method thereof. The ferroelectric film capacitor employs a lead-free and environment-friendly bismuth ferrite (BFO) doped sodium bismuth titanate-barium titanate (NBT-BT) film, thereby facilitating the recovery and reuse of the subsequent electronic devices. By using the film material, the ferroelectric film capacitor obtains high discharge energy density and energy storage efficiency, the energy storage performance of the ferroelectric film capacitor shows high-temperature stability, and the charge and discharge characteristics show that the film capacitor has faster microsecond discharge and larger dielectric strength; the film material is expected to become an environment-friendly lead-free material and can be applied to the energy storage capacitors.

The invention discloses a high-oxidation-resistance lead-free soldering tin material, and the high-oxidation-resistance lead-free soldering tin material comprises the following components in percentage by weight: 0.5-20wt% of Bi, 0.5-20wt% of Ni, 0.5-20wt% of Ni, 0.5-20wt% of Ni, 0.5-20wt% of Ni, 0.5-20wt% of Ni, and the balance of Fe. 3 to 5 wt% of Ag; 0.005 wt% to 0.02 wt% of Ge; 0.0002 to 0.5 wt% of In; 0.03 to 0.04 wt% of an antioxidant alloy P + Ga; according to the lead-free solder disclosed by the invention, through the innovative material composition formed by adding all the elements in a proper proportion, the material strength and hardness of the lead-free solder after aging can be improved and maintained, meanwhile, the oxidation resistance is improved, and the lead-free solder does not deteriorate or become yellow under long-time testing, can be widely applied to welding in the field of photovoltaic electronics, and has a relatively high use value.

The invention relates to the technical field of electronics, and particularly relates to a lead frame type packaging body. The packaging body is internally provided with a chip. The chip is provided with a plurality of pins. Each pin is provided with at least a first part and the first part is used for being in circuit connection with a chip via a metal lead. At a predetermined position, the first part of each pin is connected with a second part and the second part is made of the flexible conductive material. According to the technical scheme of the invention, each pin is provided with the second part made of the flexible conductive material, so that the lead frame type packaging body can be conveniently applied to the wiring layout of an external circuit on a printed circuit board during the practical application process. Therefore, the practical application of the lead frame type packaging body is facilitated.

Embodiments of the present disclosure provide a connection terminal and corresponding electronic equipment. The connection terminal includes a base, which is attached to a portion of the wall of the housing of the electronic device; a first conductor part, which is coupled to the base, and is adapted to be electrically connected with an electronic module of the electronic device; and a second conductor part, which is coupled To the base and electrically connected to the first conductor part, the second conductor part is suitable to be electrically connected to each other with the second conductor part in another terminal of the same specification via a lead wire; wherein the first conductor part and the second conductor part are in a step The form is arranged such that the second conductive part is closer to the portion of the wall than the first conductive part, thereby enabling positioning of the leads between the portion of the wall and the electronic module to provide electromagnetic interference shielding for the electronic component. The advantages brought by this terminal block are wide adaptability, low cost, easy modification and upgrading, good electromagnetic compatibility, easy assembly and more beautiful appearance.

The present disclosure relates to implantable neuromodulation devices and methods of fabrication, and in particular to a separable high density connectors for implantable neuromodulation devices. Particularly, aspects of the present disclosure are directed to a medical device comprising an electronics module and a header for connecting the electronics module to a lead assembly. The header includes: a housing that includes (i) a cavity having a central axis or plane and an internal surface, and (ii) an opening aligned with the central axis or plane of the cavity, an array of retractable contacts extending from the internal surface towards the central axis or plane of the cavity, and an array of connection terminals on the housing, where each connection terminal of the array of connection terminals is: (i) electrically connected to the electronics module, and (ii) electrically connectable to a retractable contact of the array of retractable contacts.