Lead frame type packaging body

A technology of lead frame and package body, which is applied in the electronic field and can solve problems such as inconvenience

Inactive Publication Date: 2016-07-27
SPREADTRUM COMM (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The lead frame packaging structure is a main form of integrated circuit packaging. The common lead frame packaging structure is as follows: figure 1 As shown, including package body 1, pin 4 connected to the outside, pin 4 is connected to the printed...

Method used

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  • Lead frame type packaging body
  • Lead frame type packaging body
  • Lead frame type packaging body

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Embodiment Construction

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0017] It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0018] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

[0019] refer to figure 2 , image 3 , a lead frame type package body, a chip 3 is set in the package body 1, ...

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PUM

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Abstract

The invention relates to the technical field of electronics, and particularly relates to a lead frame type packaging body. The packaging body is internally provided with a chip. The chip is provided with a plurality of pins. Each pin is provided with at least a first part and the first part is used for being in circuit connection with a chip via a metal lead. At a predetermined position, the first part of each pin is connected with a second part and the second part is made of the flexible conductive material. According to the technical scheme of the invention, each pin is provided with the second part made of the flexible conductive material, so that the lead frame type packaging body can be conveniently applied to the wiring layout of an external circuit on a printed circuit board during the practical application process. Therefore, the practical application of the lead frame type packaging body is facilitated.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a lead frame package. Background technique [0002] The lead frame packaging structure is a main form of integrated circuit packaging. The common lead frame packaging structure is as follows: figure 1 As shown, including package body 1, pin 4 connected to the outside, pin 4 is connected to the printed circuit board by plugging or surface mount, with the continuous expansion of peripheral circuit functions, and the number of pins The existing pin structure is often inconvenient when designing the wiring layout in the printed circuit board. Contents of the invention [0003] The object of the present invention is to provide a lead frame type package to solve the above technical problems. [0004] The technical problem solved by the present invention can adopt following technical scheme to realize: [0005] A lead frame type package, a chip is set in the package, and a plur...

Claims

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Application Information

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IPC IPC(8): H01L23/495H01L23/49
CPCH01L2224/48091H01L2224/48247H01L2224/73265H01L2924/00014
Inventor 从勇
Owner SPREADTRUM COMM (SHANGHAI) CO LTD
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