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Low-melting-point glass powder, preparation method and application thereof and method of utilizing same to prepare composite glass column

A technology of glass powder and low melting point, which is applied in the field of its preparation, low melting point glass powder, and the preparation of composite glass columns. It can solve the problems of poor chemical stability of glass powder, high cost, and failure to ensure good airtight sealing of electronic packages. Achieve the effects of lower temperature, low raw material cost, and appropriate linear expansion coefficient

Active Publication Date: 2017-02-22
허난징타이에어로우스페이스하이테크머터리얼스테크놀로지컴퍼니리미티드
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims to solve the problem that the existing glass powder has poor chemical stability, high cost, and cannot ensure good airtight sealing of electronic packages, and provides a low-melting point glass powder, its preparation method and application, and the use of low-melting point glass powder to prepare Composite glass column method

Method used

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specific Embodiment approach 1

[0019] Specific embodiment 1: In this embodiment, a kind of low melting point glass powder is composed of 30-80 parts by mass of stannous oxide, 20-60 parts of phosphorus pentoxide, 1-5 parts of zinc oxide, 0.1-1 part of sodium oxide, 0.5-1 part of barium oxide, 0.1-1 part of potassium oxide, 0.1-1 part of silicon dioxide, 0.1-1 part of indium oxide, 0.1-1 part of magnesium oxide, 0.04 part of ferric oxide, 0.03 part of aluminum oxide, 0.01 part It is prepared from strontium oxide and 0.5 to 1 part of activated carbon; the melting temperature of the low melting point glass powder is 490°C to 550°C, the transition temperature is 375°C to 385°C, and the softening temperature is 425°C to 435°C. The average coefficient of linear expansion of the low melting point glass powder at a temperature of 20°C to 300°C is 73×10 -7 / ℃~79×10 -7 / °C.

specific Embodiment approach 2

[0020] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the low-melting point glass powder consists of 55.96 parts of stannous oxide, 39.86 parts of phosphorus pentoxide, 1.58 parts of zinc oxide, 0.77 parts of sodium oxide, 0.65 parts of 0.43 parts of barium oxide, 0.43 parts of potassium oxide, 0.32 parts of silicon dioxide, 0.21 parts of indium oxide, 0.14 parts of magnesium oxide, 0.04 parts of ferric oxide, 0.03 parts of aluminum oxide, 0.01 parts of strontium oxide and 0.5 to 1 part of activated carbon . Others are the same as the first embodiment.

specific Embodiment approach 3

[0021] Specific embodiment three: the preparation method of the low melting point glass powder of the present embodiment is specifically carried out according to the following steps:

[0022] 1. Weigh 30-80 parts by weight of stannous oxide, 20-60 parts of phosphorus pentoxide, 1-5 parts of zinc oxide, 0.1-1 part of sodium oxide, 0.5-1 part of barium oxide, 0.1-1 part Potassium oxide, 0.1-1 part of silicon dioxide, 0.1-1 part of indium oxide, 0.1-1 part of magnesium oxide, 0.04 part of ferric oxide, 0.03 part of aluminum oxide, 0.01 part of strontium oxide and 0.5-1 part of activated carbon;

[0023] 2. 30-80 parts of stannous oxide, 20-60 parts of phosphorus pentoxide, 1-5 parts of zinc oxide, 0.1-1 part of sodium oxide, 0.5-1 part of barium oxide, 0.1-1 part of Potassium oxide, 0.1-1 part of silicon dioxide, 0.1-1 part of indium oxide, 0.1-1 part of magnesium oxide, 0.04 part of ferric oxide, 0.03 part of aluminum oxide, 0.01 part of strontium oxide and 0.5-1 part of activat...

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Abstract

The invention relates to the technical field of chemical engineering and electronics, in particular to low-melting-point glass powder, a preparation method and application thereof and a method of utilizing the same to prepare a composite glass column, and aims to solve the problem that existing glass powder is poor in chemical stability, high in cost and incapable of guaranteeing high airtightness in sealing connection of electronic packaging members. The low-melting-point glass powder is composed of, by mass part, stannous oxide, phosphorus pentoxide, zinc oxide, sodium oxide, barium oxide, potassium oxide, silicon dioxide, indium oxide, magnesium oxide, iron oxide, aluminum oxide and strontium oxide. The low-melting-point glass powder is high in chemical stability, proper in linear expansion coefficient, lead-free and environment-friendly, is low in melting point and especially suitable for airtight sealing connection of lead terminals of phased array radar T / R modules and high-precision instruments.

Description

technical field [0001] The invention relates to the technical fields of chemical industry and electronics, in particular to a low-melting-point glass powder, its preparation method and application, and a method for preparing a composite glass column by using the low-melting-point glass powder. Background technique [0002] The sealing of glass and metal has a wide range of uses, especially in the fields of electronics, lasers, aerospace, and automobile manufacturing. With the diversification of types and complex shapes of electronic components, the requirements for the sealing technology of glass and metal are getting higher and higher, and the sealing parts are required to have good mechanical properties and electrical conductivity. In the field of electronic packaging, when the low-temperature sealing technology is applied to the transitional sealing technology, the most critical thing is the preparation process of the composite glass column, which includes the preparation...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C12/00C03C8/24
CPCC03C8/24C03C12/00
Inventor 和平安牛济泰陶星空李绵徐先鹏
Owner 허난징타이에어로우스페이스하이테크머터리얼스테크놀로지컴퍼니리미티드
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