A kind of preparation method of low-temperature lead-free alloy solder

A technology of lead-free alloys and solders, applied in welding equipment, metal processing equipment, welding/cutting media/materials, etc., can solve the problem of high energy consumption, high-temperature oxidation slag rate and high volatile organic compounds, which cannot be applied to low-temperature lead-free soldering processes , high production costs and other issues, to achieve the effect of bright and full solder joints, good mechanical and electrical properties, and energy saving

Active Publication Date: 2021-06-18
THOUSAND ISLAND METAL FOIL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a preparation method of low-temperature lead-free alloy solder, which overcomes the high melting point of existing lead-free solder, which cannot be applied to low-temperature lead-free soldering process requirements, and high-energy consumption and high-temperature oxidation slag in production and use High rate and volatile organic compounds, high production cost defects

Method used

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  • A kind of preparation method of low-temperature lead-free alloy solder
  • A kind of preparation method of low-temperature lead-free alloy solder
  • A kind of preparation method of low-temperature lead-free alloy solder

Examples

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Effect test

Embodiment 1

[0032] A low-temperature lead-free alloy solder, the raw material ratio is as follows: In 18kg; Bi 5kg; Sb 0.3kg; Cu 0.1kg; Ce0.02kg; Sn 76.58kg.

[0033] Preparation:

[0034] (1) Put 76.58kg of tin ingot into the stainless steel melting pot, heat up to melt the tin ingot and when the temperature rises to 480°C±2°C, then gently add 0.1kg of copper material into the tin liquid, keep the copper material at 480°C It is continuously melted by the tin liquid, and after 30 minutes, slowly stir the tin liquid until the copper material is completely melted evenly, and this is a liquid SnCu alloy.

[0035] (2) Gently put 0.3 kg of antimony material into the SnCu alloy liquid prepared in step (1). The temperature of the alloy liquid is still kept at 480°C±2°C. After 30 minutes, slowly stir the alloy liquid until all the antimony material is melted evenly. It is a liquid SnSbCu alloy.

[0036] (3) When the SnSbCu liquid alloy prepared in step (2) is cooled to 420°C±2°C, then gently pu...

Embodiment 2

[0042] A low-temperature lead-free alloy solder, the raw material ratio is as follows: In 24kg; Bi 2.5kg; Sb 0.5kg; Cu 0.4kg; Ce 0.03kg; Sn 72.57kg.

[0043] Preparation:

[0044] (1) Put 72.57kg of tin ingot into the stainless steel melting pot, heat up to melt the tin ingot and when the temperature rises to 500°C±2°C, then gently add 0.4kg of copper material into the tin liquid, keep the copper material at 500°C It is continuously melted by the tin liquid, and after 30 minutes, slowly stir the tin liquid until the copper material is completely melted evenly, which is a liquid SnCu alloy.

[0045] (2) Gently put 0.5 kg of antimony material into the SnCu alloy liquid prepared in step (1), the temperature of the alloy liquid is still maintained at 500°C±2°C, and after 30 minutes, slowly stir the alloy liquid until all the antimony material is melted evenly, this is Liquid SnSbCu alloy.

[0046] (3) When the SnSbCu liquid alloy prepared in step (2) is cooled to 450°C±2°C, then...

Embodiment 3

[0052] A low-temperature lead-free alloy solder, the raw material ratio is as follows: In 20kg; Bi 4kg; Sb 0.1kg; Cu 0.31kg; Ce 0.04kg; Sn 75.56kg.

[0053] Preparation method: same as Example 1, wherein the temperature of step (1) and step (2) is 480±2°C, the temperature of step (3) and (4) is 400±2°C, and the temperature of step (7) is 280°C ±2°C.

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Abstract

The invention discloses a preparation method of low-temperature lead-free alloy solder, which comprises the following component raw materials in weight percentage: In 18-24%, Bi 2-5%, Sb 0.1-0.4%, Cu 0.1% ‑0.7%, Ce 0.02‑0.06% and the balance Sn. The melting point of the low-temperature lead-free solder of the present invention is 163°C-194°C; the metallographic structure of the alloy solder is uniform and refined, the wetting and spreading are good, the bonding with the substrate pad and the weldment is firm, the solder joints are bright and full, and have good mechanical properties And electrical performance; the low-temperature lead-free alloy solder better solves the process requirements for using low-temperature lead-free alloy solder in the lead-free process of the electronics industry, and practices the relevant regulations on energy conservation, emission reduction and environmental protection.

Description

technical field [0001] The invention relates to the technical field of assembly and welding of electronic products, in particular to a preparation method of low-temperature lead-free alloy solder. Background technique [0002] Since the assembly and welding of electronic products has entered the lead-free process, the electronics industry generally uses SnAg, SnCu, and SnAgCu series lead-free alloy solders, which have replaced SnPb alloy solders in electronic products with specific requirements for more than ten years. The melting point of these lead-free alloy solders is between 217°C and 227°C. Compared with the traditional SnPb eutectic alloy solder, the melting point is much higher. The soldering temperature of the solder should also be increased correspondingly, generally 260°C-265°C, the lead-free alloy solder can have good fluidity and wetting and spreading properties, and the firmness of the soldering point and the integrity of the electronic product can be ensured o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/40
Inventor 黄守友叶桥生黄义荣曹建平丁飞张树谦
Owner THOUSAND ISLAND METAL FOIL
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