Low-temperature lead-free alloy flux and preparation method thereof

A lead-free alloy, low-temperature technology, applied in welding equipment, metal processing equipment, welding/cutting media/materials, etc., can solve the problem of high energy consumption, high-temperature oxidation slag rate and high volatile organic compounds, which cannot be applied to low-temperature lead-free welding process Requirements, high production costs, etc., to achieve the effect of protecting the production environment, bright and full solder joints, and saving energy

Active Publication Date: 2019-06-18
THOUSAND ISLAND METAL FOIL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a low-temperature lead-free alloy solder and its preparation method, which overcomes the high melting point of the existing lead-free solder, which cannot be applied to the low-temperature lead-free soldering process requirements, and the high energy consumption and high temperature oxidation in production and use. High slag rate and volatile organic compounds, high production costs

Method used

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  • Low-temperature lead-free alloy flux and preparation method thereof
  • Low-temperature lead-free alloy flux and preparation method thereof
  • Low-temperature lead-free alloy flux and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0032] A low-temperature lead-free alloy solder, the raw material ratio is as follows: In 18kg; Bi 5kg; Sb 0.3kg; Cu 0.1kg; Ce0.02kg; Sn 76.58kg.

[0033] Preparation:

[0034] (1) Put 76.58kg of tin ingot into the stainless steel melting pot, heat up to melt the tin ingot and when the temperature rises to 480°C±2°C, then gently add 0.1kg of copper material into the tin liquid, keep the copper material at 480°C It is continuously melted by the tin liquid, and after 30 minutes, slowly stir the tin liquid until the copper material is completely melted evenly, which is a liquid SnCu alloy.

[0035] (2) Gently put 0.3 kg of antimony material into the SnCu alloy liquid prepared in step (1). The temperature of the alloy liquid is still kept at 480°C±2°C. After 30 minutes, slowly stir the alloy liquid until all the antimony material is melted evenly. It is a liquid SnSbCu alloy.

[0036] (3) When the SnSbCu liquid alloy prepared in step (2) is cooled to 420°C±2°C, then gently put 5...

Embodiment 2

[0042] A low-temperature lead-free alloy solder, the raw material ratio is as follows: In 24kg; Bi 2.5kg; Sb 0.5kg; Cu 0.4kg; Ce 0.03kg; Sn 72.57kg.

[0043] Preparation:

[0044] (1) Put 72.57kg of tin ingot into the stainless steel melting pot, heat up to melt the tin ingot and when the temperature rises to 500°C±2°C, then gently add 0.4kg of copper material into the tin liquid, keep the copper material at 500°C It is continuously melted by the tin liquid, and after 30 minutes, slowly stir the tin liquid until the copper material is completely melted evenly, which is a liquid SnCu alloy.

[0045] (2) Gently put 0.5 kg of antimony material into the SnCu alloy liquid prepared in step (1), the temperature of the alloy liquid is still maintained at 500°C±2°C, and after 30 minutes, slowly stir the alloy liquid until all the antimony material is melted evenly, this is Liquid SnSbCu alloy.

[0046] (3) When the SnSbCu liquid alloy prepared in step (2) is cooled to 450°C±2°C, then...

Embodiment 3

[0052] A low-temperature lead-free alloy solder, the raw material ratio is as follows: In 20kg; Bi 4kg; Sb 0.1kg; Cu 0.31kg; Ce 0.04kg; Sn 75.56kg.

[0053] Preparation method: same as Example 1, wherein the temperature of step (1) and step (2) is 480±2°C, the temperature of step (3) and (4) is 400±2°C, and the temperature of step (7) is 280°C ±2°C.

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Abstract

The invention discloses a low-temperature lead-free alloy flux and a preparation method thereof. The low-temperature lead-free alloy flux comprises the following raw materials in parts by weight: 18-24% of In, 2-5% of Bi, 0.1-0.4% of Sb, 0.1-0.7% of Cu, 0.02-0.06% of Ce and the balance of Sn. The melting point of the low-temperature lead-free flux is within 163-194 DEG C; the alloy flux is uniformand fine in metallographic structure, excellent in wetting spreadability, firm in bonding with a substrate welding disc and welded parts, bright and full in welding spot and excellent in mechanical performance and electric performance; and the low-temperature lead-free alloy flux preferably meets the process requirements of using the low-temperature lead-free alloy flux in the lead-free process of the electronic industry, and meets relevant regulations of energy conservation, emission reduction and environmental protection.

Description

technical field [0001] The invention relates to the technical field of assembly and welding of electronic products, in particular to a low-temperature lead-free alloy solder and a preparation method thereof. Background technique [0002] Since the assembly and welding of electronic products has entered the lead-free process, the electronics industry generally uses SnAg, SnCu, and SnAgCu series lead-free alloy solders, which have replaced SnPb alloy solders in electronic products with specific requirements for more than ten years. The melting point of these lead-free alloy solders is between 217°C and 227°C. Compared with the traditional SnPb eutectic alloy solder, the melting point is much higher. The soldering temperature of the solder should also be increased correspondingly, generally 260°C-265°C, the lead-free alloy solder can have good fluidity and wetting and spreading properties, and the firmness of the soldering point and the integrity of the electronic product can b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40
Inventor 黄守友叶桥生黄义荣曹建平丁飞张树谦
Owner THOUSAND ISLAND METAL FOIL
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