Lead-free soldering tin material with high oxidation resistance

A lead-free solder, oxidizing technology, applied in welding/cutting media/materials, welding media, welding equipment, etc., can solve the problems of poor alloy popularity, uneven coating thickness, deterioration and yellowing, etc., to improve material strength, Antioxidant improvement, high use value effect

Pending Publication Date: 2022-03-29
KUNSHAN TIANHE SOLDER MFR
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Although the surface of the SnAgCu solder material used in the existing industry is slightly better than that of SnCu solder, the thickness of the coating is very uneven due to the poor popularity of the alloy during soldering. During the double 85 aging test, it has passed 200-250 hours. Severe deterioration and yellowing, in order to solve this problem, the present invention discloses a lead-free solder material with high oxidation resistance

Method used

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Examples

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Embodiment

[0020] A lead-free solder material with high oxidation resistance, based on the total weight of the lead-free solder material with high oxidation resistance as 100wt%, the lead-free solder material with high oxidation resistance comprises:

[0021] 0.5-20wt% Bi; 3-5wt% Ag; 0.005-0.02wt% Ge; 0.0002-0.5wt% In;

[0022] 0.03-0.04wt% anti-oxidation alloy P+Ga; the balance is Sn.

[0023] In the implementation process, an appropriate silver content can increase the tensile strength and solder hardness of the solder alloy, but the silver content exceeding 5wt% will cause the solder alloy to have a too high melting point and cannot be used. Through testing, the preferred silver content is 3-5 wt%.

[0024] The purpose of adding copper is to lower the melting point of the solder alloy and increase the strength of the solder alloy. However, when the concentration of copper is too high, the melting point of the solder alloy will be increased instead. Therefore, the copper content is pr...

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PUM

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Abstract

The invention discloses a high-oxidation-resistance lead-free soldering tin material, and the high-oxidation-resistance lead-free soldering tin material comprises the following components in percentage by weight: 0.5-20wt% of Bi, 0.5-20wt% of Ni, 0.5-20wt% of Ni, 0.5-20wt% of Ni, 0.5-20wt% of Ni, 0.5-20wt% of Ni, and the balance of Fe. 3 to 5 wt% of Ag; 0.005 wt% to 0.02 wt% of Ge; 0.0002 to 0.5 wt% of In; 0.03 to 0.04 wt% of an antioxidant alloy P + Ga; according to the lead-free solder disclosed by the invention, through the innovative material composition formed by adding all the elements in a proper proportion, the material strength and hardness of the lead-free solder after aging can be improved and maintained, meanwhile, the oxidation resistance is improved, and the lead-free solder does not deteriorate or become yellow under long-time testing, can be widely applied to welding in the field of photovoltaic electronics, and has a relatively high use value.

Description

technical field [0001] The invention relates to the technical field of solder materials, in particular to a lead-free solder material with high oxidation resistance. Background technique [0002] The use of solar energy to generate electricity is the most colorful and environmentally friendly new energy in the world. The main component that converts solar energy into electrical energy is a photovoltaic panel, and the key components of the panel are silicon wafers and photovoltaic ribbons. The base material of the ribbons is copper ribbons. A layer of tin solder is plated, so the quality of tin solder is an important technical indicator of photovoltaic power generation effect. The current photovoltaic ribbon process is 100% hot-dip tin process, and more than 99% of tin solder can be used as tin-lead series solder. About The electronic process uses lead-free solder for several exported products. It has not been adopted in the photovoltaic ribbon process and is in its infancy. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/02B23K35/26
CPCB23K35/0222B23K35/262
Inventor 陆晓明
Owner KUNSHAN TIANHE SOLDER MFR
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