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Nanometer Ag3Sn particle reinforced composite lead-free soldering paste and preparation method thereof

A technology of lead-free solder paste and particle reinforcement, applied in welding equipment, welding medium, manufacturing tools, etc., can solve the problems of poor mechanical properties of solder joints, reduced reliability of solder joints, poor wetting performance, etc., and reduce process costs , good matching, strong wetting effect

Inactive Publication Date: 2014-09-03
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the most commonly used lead-free solder paste alloy composition is Sn-3.0Ag-0.5Cu. Because its Ag content is as high as 3.0%, there is a problem of high cost in the actual application process; at the same time, the addition of too much Ag element will lead to A large amount of coarse Ag appears in the solder joint 3 Sn intermetallic compounds (IMCs), resulting in reduced solder joint reliability
Therefore, the scope of application of low-Ag lead-free solder paste in the electronics manufacturing industry is gradually expanding, but it also has shortcomings such as high melting point, poor wettability, and poor mechanical properties of solder joints.

Method used

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  • Nanometer Ag3Sn particle reinforced composite lead-free soldering paste and preparation method thereof
  • Nanometer Ag3Sn particle reinforced composite lead-free soldering paste and preparation method thereof
  • Nanometer Ag3Sn particle reinforced composite lead-free soldering paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] (1) dissolving stannous octoate and silver nitrate in anhydrous methanol, the concentration of stannous octoate is 0.01mol / L, and the concentration of silver nitrate is 0.03mol / L to obtain solution a, add 1,10-phenanthroline, 1 , the concentration of 10-phenanthroline is 0.05mol / L, mix well to obtain solution b, wherein the reaction temperature is 40°C, and the reaction time is 1h;

[0044] (2) Add 5ml of oleic acid dropwise to 395ml of ammonia water, mix well to obtain solution c, dissolve sodium borohydride solid in solution c, the concentration of sodium borohydride is 0.5mol / L, mix well to obtain solution d;

[0045] (3) Add solution d dropwise to solution b, oscillate and mix evenly to make it fully react. min, get solid 1;

[0046] (4) Solid 1 was vacuum-dried for 8 hours to obtain a black powder, and an X-ray diffraction analyzer was used to carry out phase analysis of the black powder to obtain an X-ray diffraction spectrum, such as figure 1 ,Depend on figure...

Embodiment 2

[0053] (1) Dissolving stannous octoate and silver nitrate in anhydrous methanol, the concentration of stannous octoate is 5×10 -3 mol / L, the concentration of silver nitrate is 1.5×10 -2 mol / L, to obtain solution a, add 1,10-phenanthroline, the concentration of 1,10-phenanthroline is 1×10 -2 mol / L, mixed evenly to obtain solution b, the reaction temperature was 20°C, and the reaction time was 0.5h;

[0054] (2) Add 10ml of oleic acid dropwise into 390ml of ammonia water, mix uniformly to obtain solution c, dissolve sodium borohydride solid in solution c, the concentration of sodium borohydride is 0.1mol / L, mix uniformly to obtain solution d;

[0055] (3) Add solution d dropwise to solution b, oscillate and mix evenly to make it fully react, the reaction temperature is 20°C, the reaction time is 0.25h, then stand for 2h, centrifuge and wash 5 times, each time for 5min, the speed is 3000r / min, get solid 1;

[0056] (4) Solid 1 was vacuum-dried for 6 hours to obtain a black po...

Embodiment 3

[0063] (1) Dissolving stannous octoate and silver nitrate in anhydrous methanol, the concentration of stannous octoate is 5×10 -2 mol / L, the concentration of silver nitrate is 1.5×10 -1 mol / L, to obtain solution a, add 1,10-phenanthroline, the concentration of 1,10-phenanthroline is 1×10 -1 mol / L, mixed evenly to obtain solution b, the reaction temperature was 60°C, and the reaction time was 2h;

[0064] (2) Add 2ml of oleic acid dropwise to 398ml of ammonia water, mix well to obtain solution c, dissolve sodium borohydride solid in solution c, the concentration of sodium borohydride is 1mol / L, mix well to obtain solution d;

[0065] (3) Add solution d dropwise to solution b, oscillate and mix evenly to make it fully react, the reaction temperature is 60°C, the reaction time is 2h, then stand for 8h, centrifuge and wash 20 times, each time for 20min, the speed is 7000r / min , to obtain solid 1;

[0066] (4) Solid 1 was vacuum-dried for 20 hours to obtain a black powder, and a...

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Abstract

The invention discloses nanometer Ag3Sn particle reinforced composite lead-free soldering paste and a preparation method thereof, belonging to the technical field of welding materials for assembly of electronic devices. The nanometer Ag3Sn particle reinforced composite lead-free soldering paste is prepared from nanometer Ag3Sn particles and low-Ag lead-free soldering paste through long-time mechanical stirring, and the nanometer Ag3Sn particles are prepared by a chemical reduction method. The preparation method is simple and convenient to operate and has good repeatability. The composite lead-free soldering paste is superior to non-reinforced low-Ag lead-free soldering paste in the processing properties such as melting point, wettability and welding joint mechanical property, and can meet the technological requirements of low cost and high performance on soldering paste in the current electronics manufacturing industry to a great degree.

Description

technical field [0001] The present invention relates to a kind of nano Ag 3 The invention discloses a composite lead-free solder paste reinforced by Sn particles and a preparation method thereof, belonging to the technical field of soldering materials used for assembly of electronic components. Background technique [0002] At present, the most commonly used lead-free solder paste alloy composition is Sn-3.0Ag-0.5Cu. Because its Ag content is as high as 3.0%, there is a problem of high cost in the actual application process; at the same time, the addition of too much Ag element will lead to A large amount of coarse Ag appears in the solder joint 3 Sn intermetallic compounds (IMC), leading to reduced reliability of solder joints. Therefore, the scope of application of low-Ag lead-free solder paste in the electronics manufacturing industry is gradually expanding, but it also has disadvantages such as high melting point, poor wettability, and poor mechanical properties of sol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40
CPCB23K35/262B23K35/0244B23K35/025B23K35/40
Inventor 赵修臣汪源刘颖李红
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
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