38 results about "Electronics manufacturing" patented technology

A three-dimensional optical inspection system reconstructs a three-dimensional image of the shape of the surface of an at least partially specular object resident on a printed circuit board by capturing two or more two-dimensional images of the object under different illumination configurations. The diffuse reflection, as well as the specular reflection can be used to reconstruct the three-dimensional image using any reconstruction method, such as photometric stereo. The different illumination configurations can be achieved using an illumination source including light-emitting elements arranged in concentric circular arrays, in which each of the circular arrays is divided into sections. Each section is independently controlled to selectively activate the sections to illuminate the object in a pre-established illumination pattern.

The present invention generally relates to methods of treating a surface of a substrate, and to the use of the method and resulting films, coatings and devices formed therefrom in various applications including but not limited to electronics manufacturing, printed circuit board manufacturing, metal electroplating, the protection of surfaces against chemical attack, the manufacture of localized conductive coatings, the manufacture of chemical sensors, for example in the fields of chemistry and molecular biology, the manufacture of biomedical equipment, and the like. In another aspect, the present invention provides a printed circuit board, a printed circuit board, comprising: at least one metal layer; a layer of organic molecules attached to the at least one metal layer; and an epoxy layeratop said layer of organic molecules.

The embodiment of the invention provides a display device, and relates to the technical field of electronics manufacturing. The display device is used for improving user experience to image quality of an electronic product. The display device comprises a display panel and a curvature adjusting mechanism, wherein the display panel is made of elastic materials, the curvature adjusting mechanism is arranged on the back side of the display panel, and comprises a force application part and connecting pieces, one end of each connecting piece is connected with the display panel, the other end of each connecting piece is connected with the force application part, and the force application part can apply force on the connecting pieces so that the connecting pieces can pull or push the display panel to deform elastically. The display device can be applied to electronic devices with high requirements for the display effect.

The invention generally provides devices and methods for sampling, detecting and / or characterizing particles, for example, via collection, growth and analysis of viable biological particles such as microorganisms. Devices and methods of the invention include particle samplers and impactors for collecting and / or analyzing biological particles in manufacturing environments requiring low levels of particles, such as cleanroom environments for electronics manufacturing and aseptic environments for manufacturing pharmaceutical and biological products, such as sterile medicinal products. Devices and methods of the invention incorporate an integrated sampler and impact surface, such as the receiving surface of a growth media, in a manner to minimize, or entirely eliminate, risks associated with user handling, such as the occurrence of false positive determinations due to contamination of the impact surface during particle sampling, growth or analysis processes.

The invention provides devices and methods for sampling, detecting and / or characterizing particles. Devices and methods of the invention, including particle samplers, impactors and counters, include a filter component for removing particles in the exhaust flow of the device, for example, to eliminate or minimize the potential for the device itself to provide source of particles in an environment undergoing particle monitoring. This aspect of the present devices and methods is particularly useful for monitoring particles in manufacturing environments requiring low levels of particles, such as cleanroom environments for electronics manufacturing and aseptic environments for manufacturing pharmaceutical and biological products.

The invention relates to a grinding device, in particular to a wafer grinding device used in the manufacture of electronic products. The technical problem to be solved by the present invention is to provide a wafer grinding device for the manufacture of electronic products which is simple in operation, capable of simultaneously grinding wafers of different sizes, and high in grinding efficiency. In order to solve the above-mentioned technical problems, the present invention provides such a wafer grinding equipment used in the manufacture of electronic products, which includes a bottom plate, a left frame, a top plate, a grinding frame, a grinding sheet, an adjustment mechanism, etc.; The top of the left frame is connected with a top plate, the right side of the top of the bottom plate is equipped with a rotating mechanism, the rotating mechanism is connected with a grinding frame, the bottom of the grinding frame is connected with an adjustment mechanism, the middle of the bottom of the top plate is installed with a lifting mechanism, and the bottom of the lifting mechanism is connected with a grinding sheet. In the invention, different wafers can be placed in different adjustment mechanisms and then ground, thereby achieving the effects of simple operation and high grinding efficiency.

Certain spin-coatable liquids and application techniques are described, which can be used to form nanotube films or fabrics of controlled properties. A spin-coatable liquid containing nanotubes for use in an electronics fabrication process includes a solvent containing a plurality of nanotubes. The nanotubes are at a concentration of greater than 1 mg / L. The nanotubes are pretreated to reduce the level of metallic and particulate impurities to a preselected level, and the preselected metal and particulate impurities levels are selected to be compatible with an electronics manufacturing process. The solvent also is selected for compatibility with an electronics manufacturing process.

The invention discloses nanometer Ag3Sn particle reinforced composite lead-free soldering paste and a preparation method thereof, belonging to the technical field of welding materials for assembly of electronic devices. The nanometer Ag3Sn particle reinforced composite lead-free soldering paste is prepared from nanometer Ag3Sn particles and low-Ag lead-free soldering paste through long-time mechanical stirring, and the nanometer Ag3Sn particles are prepared by a chemical reduction method. The preparation method is simple and convenient to operate and has good repeatability. The composite lead-free soldering paste is superior to non-reinforced low-Ag lead-free soldering paste in the processing properties such as melting point, wettability and welding joint mechanical property, and can meet the technological requirements of low cost and high performance on soldering paste in the current electronics manufacturing industry to a great degree.

The invention provides an ultra-high-temperature chemical-resisting label tape which has special chemical substances on the coating of a printing surface. The temperature-resisting coating composition of the label tape has very good adherence performance to the substrate, can resist heat and weather, and has good ink-absorbing performance when printed. The ultra-high-temperature chemical-resisting label tape is attached with a heat-resisting acrylic adhesive coating on the upper surface of a release paper layer; and a biaxial tensile polyimide film coating is attached on the upper surface of the heat-resisting acrylic adhesive coating, and a polyurethane and epoxy resin copolymer coating is attached on the upper surface of the biaxial tensile polyimide film coating. The tape has excellent extreme high temperature resistance and chemical resistance and welding resistance, can achieve non-scorching, non-brittle and non-cracking, be applicable to the object processing flow of all the high-temperature projects, can save materials and reduce pollution in the processing of workpieces, and can be widely applied to the electronics manufacturing filed.

The invention generally provides devices and methods for particle detection for minimizing human-caused contamination in manufacturing environments requiring low levels of microbes, such as cleanroom environments for electronics manufacturing and aseptic environments for manufacturing pharmaceutical and biological products, such as sterile medicinal products. Methods of the invention may incorporate wirelessly transmitting an alarm signal from a particle detector to a remote device, replicating a graphical user interface of the particle detector on an electronic display of the remote device, and passing one or more user instructions from the remote device to the particle detector via the replicate graphical interface of the remote device.

The invention generally provides devices and methods for particle detection for minimizing human-caused contamination in manufacturing environments requiring low levels of microbes, such as cleanroom environments for electronics manufacturing and aseptic environments for manufacturing pharmaceutical and biological products, such as sterile medicinal products. Methods of the invention may incorporate wirelessly transmitting an alarm signal from a particle detector to a remote device, replicating a graphical user interface of the particle detector on an electronic display of the remote device, and passing one or more user instructions from the remote device to the particle detector via the replicate graphical interface of the remote device.

The invention discloses a cross-platform integrated power grid intelligent program-controlled error-preventing system. The system comprises an electronics manufacturing service (EMS) system and a systems applications and products in data processing (SAP) system, wherein the EMS system comprises subsystems, such as a supervisory control and data acquisition (SCADA) subsystem, an intelligent operation order generating subsystem and the like; the SAP system further comprises a 'two orders' management subsystem; the intelligent operation order generating subsystem generates an operation order andtransmits the generated operation order to the SAP system through a communication interface module; after reading the operation order generated by the EMS system to the SAP system, the 'two orders' management subsystem of the SAP system is associated with the corresponding examine and repair form, working order and the like generated by the SAP system, determines the latching relation according to a corresponding operation logic and only sequentially activates the current only correct operation.

The invention generally provides systems and methods for particle detection for minimizing microbial growth and cross-contamination in manufacturing environments requiring low levels of microbes, such as cleanroom environments for electronics manufacturing and aseptic environments for manufacturing pharmaceutical and biological products, such as sterile medicinal products. In some embodiments, systems of the invention incorporate a housing having an outer surface being a first antimicrobial surface and a touchscreen being a second antimicrobial surface. In some embodiments, substantially all of the outer surfaces of the system are antimicrobial surfaces. In some embodiments, the first antimicrobial surface may comprise an Active Screen Plasma alloyed layer. In some embodiments, the housing may comprise a molded polymer substrate and a metal coating layer bonded to the molded polymer substrate such that at least some exterior surfaces of the housing are metal coated surfaces.

The invention discloses a method for manufacturing a shell of an electronic product. The method comprises the following steps of A, generating of 3D (Three-Dimensional) drawing file design of an injection mold: reserving an antenna groove by the injection mold when a mold opening 3D drawing file design is generated; B, injection mold processing: carrying out shape processing on the antenna groove when a mold core is processed so as to ensure the integrated forming of an antenna and the shell of the product when the antenna is subsequently processed, and enabling the shell of the product not to be subjected to poor appearance when surface processing is carried out; C, injection molding machine molding: completing the injection molding of the product by utilizing the injection mold, which is already designed and processed in a mold, of the antenna groove; D, mobile phone antenna processing: directly processing a mobile phone antenna in the antenna groove on the surface or the inner wall of a mobile phone plastic piece; E, mobile phone surface processing and coating. According to the method disclosed by the invention, the bottlenecks of a surface decoration technology that the surface of the product is rugged when the mobile phone antenna is assembled or printed on the surface of the product, and the surface of the product needs to be sanded when the mobile phone antenna is produced can be broken through, highly-textured appearance on the surface of the product can be generated, the manufacturing cost can be reduced, and the yield of the product can be increased.

The invention relates to the field of micro-electronics manufacturing, in particular to high-temperature oxidization equipment. The high-temperature oxidization equipment comprises a vertical barrel-shaped wafer boat, wherein a plurality of frustum-shaped supporting rings for placing wafers are arranged in the wafer boat, and the radiuses of the frustum-shaped supporting rings are gradually increased from top to bottom; and the slope of each supporting ring and the inner wall of the wafer boat form an inclination angle alpha. When a high-temperature oxidization technology is performed, reaction gas is fed into the wafer boat; the supporting rings are provided with the slopes, so that the reaction gas can be more easily fed into the center positions of the wafer surfaces, and the gas reaction concentration difference between the edge position and the center position on the upper surface of each wafer is reduced; and therefore, a layer of oxidized film with more uniform thickness grows on the surface of each wafer, and the performance of a device and the production technology are improved simultaneously.