32 results about "Electronics manufacturing" patented technology

The invention relates to the technical field of intelligent detection in the electronic manufacturing industry, in particular to a PCB warping degree intelligent evaluation system integrating visual positioning and multi-modal sensing, which comprises a multi-modal sensing unit, a visual positioning unit, an intelligent evaluation engine and a closed-loop control unit, the multi-modal sensing unit integrates laser displacement, infrared thermal imaging and strain sensors to acquire three-dimensional deformation, temperature and stress data; the visual positioning unit realizes sub-pixel-level positioning by using a high-resolution industrial camera and a feature point matching algorithm, and compensates vibration errors; the intelligent evaluation engine fuses data based on a time-space synchronization protocol, predicts a thermal deformation trend through an improved multi-modal convolutional neural network, and dynamically adjusts a qualified threshold value; and the closed-loop control unit executes sorting and rechecking according to an evaluation result, and optimizes warping and leveling parameters. According to the system, multi-dimensional accurate detection and intelligent control are realized, the PCB warping degree detection accuracy is effectively improved, the process can be dynamically optimized according to the production working condition, and the equipment fault risk is reduced.

The invention relates to the technical field of image processing, and discloses a glue smearing defect detection method and system based on image processing. The method comprises the following steps: carrying out illumination imaging on a glue coating area of the PCB through a narrow-band blue-light LED to obtain original data; utilizing a self-adaptive color separation channel to select and identify different glues to obtain feature data; performing three-dimensional glue path modeling analysis according to the characteristic data to form a glue three-dimensional model; based on the three-dimensional model, performing multi-level tolerance evaluation on different functional areas to generate regional defect data; performing feature enhancement analysis on the defects by using a specific illumination technology to form a feature map; and dynamically adjusting a parameter output result through a temperature and humidity compensation algorithm. The method can adapt to requirements of different glue types, different PCB backgrounds and different functional areas, can consider environmental factors and material batch differences, improves the accuracy and reliability of detection, and meets the requirements of high-quality production in the electronic manufacturing industry.

The invention discloses an electronic manufacturing industry production line UPH intelligent prediction method, system, device and medium, and the method can learn a deep interaction relationship between a line body and a product through adversarial training through a generator of a collaborative filtering generative adversarial network, so that even if a new product lacks enough historical data, the production line can be predicted more accurately. The generator can also find a mode similar to other line bodies in a potential space and generate a relatively reasonable UPH, and for an old product with a theoretical UPH and an actual UPH, the relatively reasonable UPH can be generated only by correspondingly inputting a current line body feature vector and the theoretical UPH of the product in the corresponding line body; according to the method, the difficulty that in the initial production stage of a new product, due to lack of reference bases, UPH can be generally formulated only according to the same industry standard or the average yield per hour of the production line can be solved; and meanwhile, the problem of UPH updating hysteresis caused by personnel or equipment can be solved.

The utility model belongs to the technical field of circuit board processing, and discloses a circuit board tin immersion processing device which comprises a tin immersion tank, a lifting assembly and a hanging assembly, the lifting assembly is fixedly connected to the top of the tin immersion tank and used for achieving movement in the vertical direction, and the hanging assembly is fixedly connected with the output end of the lifting assembly. The carrier is used for carrying a circuit board for immersion tin treatment; wherein the hanging assembly comprises a cross rod, the outer surface of the cross rod is sleeved with a fixing sleeve, the bottom of the fixing sleeve is fixedly connected with a supporting rod, the bottom of the supporting rod is fixedly connected with a plurality of clamping pieces in the length direction, and the circuit board is fixed in the clamping pieces. According to the utility model, the lifting assembly can drive the suspension assembly to move up and down, a plurality of circuit boards can be fixed through the suspension assembly, batch processing of the circuit boards can be realized, and meanwhile, the processing effect and the safety are ensured, so that the requirements of the electronic manufacturing industry on the tin immersion processing technology of the circuit boards are met.

A fixing carrier unit for selective wave soldering and a fixing carrier assembled therefrom are disclosed, belonging to the technical field of soldering carriers in the electronics manufacturing industry. The unit includes a wave soldering substrate, an FPCA device mounted on the substrate, a connector inserted into the FPCA device, and a pressure block covering the FPCA device and connector. The pressure block includes a working surface in contact with the FPCA device and connector, and an upper surface opposite to the working surface. A cavity is formed on the working surface, the cavity having a through portion and a sealing portion. The through portion accommodates the protrusion of the connector, and a resilient pin is disposed on the pressure block of the sealing portion. This provides a novel selective wave soldering fixing carrier solution that uses the pressure block to limit the misalignment of the pins and FPC pads.

The invention relates to the technical field of chip mounter feeders, and discloses a chip mounter feeder system with waste storage and high-foot material beating, which comprises a shell, a control assembly, a first transmission assembly, a second transmission assembly and a waste bin, and is characterized in that the control assembly, the first transmission assembly, the second transmission assembly and the waste bin are mounted in the shell; the control assembly is used for controlling the first transmission assembly and the second transmission rod assembly, the control assembly is used for adjusting the speed, starting and pausing of the equipment, and the waste bin is used for collecting adhesive films on material strips. The device has the advantages of orderly waste collection, accurate and efficient transmission, adaptability to high-foot material mounting, convenience in operation and control, optimized adhesive film waste treatment and the like, can improve the production efficiency and the product quality, and is suitable for surface mounting production operation in the electronic manufacturing industry.

The invention discloses a wearable ultrasonic patch applied to intraoperative bleeding monitoring and a signal processing method, and relates to the field of wearable electronic manufacturing, the patch comprises a piezoelectric layer, a backing layer, a matching layer and an acoustic lens layer; the piezoelectric layer is used for generating mechanical vibration and receiving an ultrasonic echo signal; the mechanical vibration is simultaneously propagated in the forward direction and the backward direction in the form of ultrasonic waves through a coupling medium; the backing layer is positioned behind the piezoelectric layer and is used for absorbing ultrasonic waves which are propagated in the back direction; the matching layer is located between the piezoelectric layer and the acoustic lens layer and used for adjusting the ultrasonic waves propagating in the forward direction to obtain the adjusted ultrasonic waves; and the acoustic lens layer is in contact with human tissues, and is used for focusing the adjusted ultrasonic waves, injecting the focused ultrasonic waves into the human tissues, and injecting ultrasonic echo signals into the piezoelectric layer through the matching layer. The system can continuously monitor blood flow parameters in real time, and is suitable for clinical requirements of intraoperative bleeding monitoring.

To provide a mineral-filled thermoplastic polyamide molding compound with suitable mechanical properties for both automotive and electronics manufacturing, while imparting a deep black impression.SOLUTION: Provided is a mineral-filled thermoplastic polyamide molding compound comprising: (A) 20 to 89.9 wt% of at least one polyamide; (B) a mineral filler accounting for 10 to 55 wt%, composed of a mixture that includes 45 to 70 wt% (cryptocrystalline) silic acid B1, 5 to 15 wt% amorphous silic acid B2, and 20 to 40 wt% calcined kaolin B3, relative to 100 wt% of (B), the component (B) containing 5 to 20 wt% aluminum oxide and 80 to 95 wt% silicon oxide, relative to 100% of (B); (C) 0 to 15 wt% of glass and / or carbon fiber; (D) 0.1 to 5.0 wt% black colorant; and (E) 0 to 5.0 wt% additive.SELECTED DRAWING: None

This invention relates to the field of structural adhesives, and particularly to a one-component epoxy structural adhesive and its preparation method. The one-component epoxy structural adhesive comprises, as a raw material, epoxy resin, toughening agent, curing agent, accelerator, silane coupling agent, defoamer, reinforcing agent, and inorganic filler. The one-component epoxy structural adhesive obtained by this invention exhibits high and durable adhesive strength to engineering plastics such as PBT, PA, and LCP, as well as metal terminals. After curing, the adhesive layer possesses excellent flexibility and resistance to thermal shock, safely withstanding the high temperatures of reflow soldering processes. As a one-component product, it must also possess excellent room temperature storage stability and rapid curing characteristics to meet the dual requirements of modern electronics manufacturing for material performance and process efficiency.

The invention belongs to the technical field of information, and particularly relates to a multi-dimensional perception and intelligent cooperation industrial robot manufacturing system. The system comprises a sensing layer, a data processing layer, a decision-making layer, an execution layer and an application layer. Various advanced algorithms and systems are adopted, such as a component recognition and capture algorithm based on multi-dimensional perception and deep learning, a welding assembly quality regulation and control algorithm based on self-adaptive control and the like. The device has the beneficial effects of improving the component identifying and grabbing precision, ensuring the welding and assembling quality, enhancing the defect detecting capacity, improving the production efficiency, facilitating production management and tracing and the like, and the high-precision, high-efficiency and high-quality production requirements of modern electronic manufacturing are met.

Systems and methods are provided for electronic manufacturing, including use of a rigid tile-in-polymer film panel. Rigid tiles can be molded with a thin polymer composite to form the rigid tile-in-polymer film panel. The rigid panel can be made of silicon, glass, ceramic ribbon, or traditional glass fiber-reinforced laminates depending on the target product segment.

This application relates to the field of material management technology in the electronics manufacturing industry, providing a method, production method, and equipment for merging material station lists for multi-pattern surface mount products. For surface mount orders with small quantities and numerous pattern types, in response to a surface mount product query operation, an initial material station list for different pattern types of surface mount products to be produced is obtained. To reduce the changeover process for different pattern types of surface mount products, in response to a merging operation of multiple initial material station lists, materials with the same location column value but different material column values ​​in two material station lists are merged into one material station list. This ensures that the merged material station list guarantees that the placement head accurately picks up materials for multiple pattern types of surface mount products. This enables continuous production of multiple pattern types of surface mount products in one go, effectively reducing changeover times and improving production efficiency. Furthermore, the placement machine's station position is determined based on the movement path of the placement head picking up materials; minimizing the movement path further improves surface mount production efficiency.

The invention discloses a product information acquisition method and device, and relates to the field of electronic manufacturing. The method comprises the following steps: labeling a product according to the type of the product, and determining a tray corresponding to the product; placing the labeled product in a tray corresponding to the product; detecting specification information of the tray; determining the type of the product placed in the tray according to the specification information of the tray; determining a target script from the N scripts according to the type of the product placed in the tray; and controlling image acquisition equipment to acquire label information on the product placed in the tray according to the target script. The technical problem that in the prior art, when product information is input, a code scanning gun is used for carrying out information input on products one by one, and consequently the information input efficiency is low is solved.

The present invention belongs to the field of electronic manufacturing technology, and specifically relates to a method for detecting chip paths in integrated circuit packages. The present invention introduces innovative measures such as multi-dimensional non-contact scanning, building a three-dimensional mapping diagram based on real-time data, and intelligently planning probe access sequences. This method can dynamically adapt to chips of various sizes and pin layouts, thereby achieving efficient and high-precision detection results. In addition, through the real-time analysis of response parameters and the application of a feedback mechanism, the present invention can also automatically adjust the probe operation strategy, further optimize the test process, and improve detection efficiency and accuracy. Ultimately, this method not only improves the flexibility and adaptability of detection, but also significantly reduces detection time and cost, bringing important technological advancements to the electronics manufacturing industry.

The utility model relates to an electronic grade hydrogen peroxide reverse osmosis production device which can effectively remove organic matters, zwitterion impurities and particulate matters in hydrogen peroxide through multi-stage treatment steps such as cooling, filtering, reverse osmosis and ion exchange. The device comprises a cooler, a super filter, a reverse osmosis device, a cation exchange tower and an anion exchange tower. After being cooled and filtered, industrial-grade hydrogen peroxide firstly enters a primary reverse osmosis device for primary impurity removal, then is finely filtered through secondary reverse osmosis, and finally passes through a cation exchange tower and an anion exchange tower to remove trace ion impurities, so that G3 or G5-grade high-purity hydrogen peroxide is obtained. According to the design of the device, the traditional resin regeneration process is simplified, the generation of pollutants is reduced, and the production safety and efficiency are improved. The method is suitable for application scenes with strict requirements on high-purity hydrogen peroxide, such as semiconductor and electronic manufacturing.

This invention discloses a high-temperature heating structure, its preparation method, and its application, belonging to the field of electrothermal technology. The invention first prepares an insulating blank, then forms a heating core by combining a conductive film and electrodes. The heating core is then sandwiched between two insulating blanks and pressed into a preform. After debinding, high-temperature treatment, and precision dimensional machining, wires are connected to obtain the high-temperature heating structure. This invention has advantages such as being polymer-free, double-sidedly insulated, safe and heat-resistant, capable of achieving an integrated structure, containing high-temperature resistant fibers resulting in high strength and resistance to thermal stress, a large heating area, uniform heating, simple process, and ease of large-scale production. It has wide applications in the field of precision thermal equipment in semiconductor and electronics manufacturing.

1. Name of the design product: X-ray detection equipment. 2. Use of the design product: non-destructive testing of products in the electronics manufacturing industry, automotive industry, aerospace, medical equipment, food industry, etc. 3. Design points of the design product: in shape. 4. Picture or photo that best indicates the design points: perspective view.

COATED SOLDER PASTE STENCIL AND THE METHOD OF PRODUCING THEREOF Embodiments of the present invention relate to the field of electronics 5 manufacturing or surface mount technology (SMT) and, more specifically, to solder paste stencils (1) with coatings on at least one of its surfaces (3a, 3b) and aperture wall (51), as well as a manufacturing method (100) for producing them. The invention introduces a coating process with specialized materials, aimed at preventing solder paste adherence and 10 enhancing hydrophobicity. The resulting coated solder paste stencil (1) exhibits improved solder paste flow, reduced clogging, and ensures precise deposition, enhance solder paste release capability, marking a significant advancement in electronics manufacturing. (The most illustrative figure is FIG. 1-A) 20 24 27 84 32 16 D ec 2 02 4 2 2 A B S T R A C T 2 0 2 4 2 7 8 4 3 2 1 6 D e c 2 0 2 4 C O A T E D S O L D E R P A S T E S T E N C I L A N D T H E M E T H O D O F P R O D U C I N G T H E R E O F E m b o d i m e n t s o f t h e p r e s e n t i n v e n t i o n r e l a t e t o t h e f i e l d o f e l e c t r o n i c s 5 m a n u f a c t u r i n g o r s u r f a c e m o u n t t e c h n o l o g y ( S M T ) a n d , m o r e s p e c i f i c a l l y , t o s o l d e r p a s t e s t e n c i l s ( 1 ) w i t h c o a t i n g s o n a t l e a s t o n e o f i t s s u r f a c e s ( 3 a , 3 b ) a n d a p e r t u r e w a l l ( 5 1 ) , a s w e l l a s a m a n u f a c t u r i n g m e t h o d ( 1 0 0 ) f o r p r o d u c i n g t h e m . T h e i n v e n t i o n i n t r o d u c e s a c o a t i n g p r o c e s s w i t h s p e c i a l i z e d m a t e r i a l s , a i m e d a t p r e v e n t i n g s o l d e r p a s t e a d h e r e n c e a n d 1 0 e n h a n c i n g h y d r o p h o b i c i t y . T h e r e s u l t i n g c o a t e d s o l d e r p a s t e s t e n c i l ( 1 ) e x h i b i t s i m p r o v e d s o l d e r p a s t e f l o w , r e d u c e d c l o g g i n g , a n d e n s u r e s p r e c i s e d e p o s i t i o n , e n h a n c e s o l d e r p a s t e r e l e a s e c a p a b i l i t y , m a r k i n g a s i g n i f i c a n t a d v a n c e m e n t i n e l e c t r o n i c s m a n u f a c t u r i n g . ( T h e m o s t i l l u s t r a t i v e f i g u r e i s F I G . 1 - A ) 2 2 A B S T R A C T 2 0 2 4 2 7 8 4 3 2 1 6 D e c 2 0 2 4 P R O D U C I N G T H E R E O F 1 / 5 FIG. 1-A FIG. 1-B FIG. 1-C 1 1 3, 3b 3, 3a 5 51 3, 3a 7 7 9 9 1 / 5 1 9 3,3b 7 FIG. 1-A 1 9 7 3,3a FIG. 1-B 3,3a 5 51 FIG. 1-C 20 24 27 84 32 16 D ec 2 02 4 1 / 5 1 1 6 D e c 2 0 2 4 9 3 , 3 b 7 2 0 2 4 2 7 8 4 3 2 F I G . 1 - A 1 9 7 3 , 3 a F I G . 1 - B 3 , 3 a 5 5 1 4 9 9 6 1 9 9 6 1 9 9 6 9 9 9 9 9 9 9 6 F I G . 1 - C 1 1 6 D e c 2 0 2 4 7 2 0 2 4 2 7 8 4 3 2 1 9 7 F I G . 1 - B 5 5 1 4 9 9 6 1 9 9 6 1 9 9 6 9 9 9 9 9 9 9 6 F I G . 1 - C

1. The name of the design product: inkjet printer (Mini). 2. The use of the design product: in the food, medicine, electronics manufacturing industry, for printing production date, model and other key information; in the logistics and warehousing scene, for printing logistics number, etc.; also can be used for construction record. 3. The design points of the design product: in shape. 4. The picture or photo that can best show the design points: perspective view 1.

The utility model relates to a transfer device, in particular to a ceramic DBC substrate production transfer device. The ceramic DBC substrate production transfer device comprises a frame, baffles, universal wheels, brake pads, inclined plates, damping cylinders and the like, the baffles are symmetrically arranged on the front side and the rear side of the lower portion in the frame, the universal wheels are rotationally arranged on the front side and the rear side of the bottom of the frame in a bilateral symmetry mode, the brake pads are arranged on the two adjacent universal wheels on the right side, and the inclined plates are arranged on the damping cylinders. A plurality of inclined plates are transversely arranged on the lower portion in the frame and located between the baffles, damping cylinders are arranged on the front side and the rear side of the upper portion of the frame in a bilateral symmetry mode, and the damping cylinders are filled with damping oil. By adding the baffle, the anti-collision soft strip, the elastic piece and other components, the stability in the transferring process can be effectively guaranteed when the ground is uneven or collision occurs carelessly, the production efficiency can be improved, the quality of the DBC substrate is guaranteed, and the standard requirement of the modern electronic manufacturing industry is met.

1. The name of the design product: handheld inkjet printer. 2. The use of the design product: in the food, medicine, electronics manufacturing industry, for printing production date, model and other key information; in the logistics and warehousing scene, for printing logistics number, etc.; also can be used for construction record. 3. The design points of the design product: in shape. 4. The picture or photo that can best show the design points: perspective view 1.

This application relates to the field of image processing technology, and discloses a method and system for detecting adhesive application defects based on image processing. The method includes: acquiring raw data by imaging the adhesive application area of ​​a PCB board using a narrow-band blue LED; selecting and identifying different adhesives using an adaptive color separation channel to obtain feature data; performing three-dimensional adhesive path modeling analysis based on the feature data to form a three-dimensional adhesive model; generating regional defect data by performing multi-level tolerance assessment on different functional areas based on the three-dimensional model; performing feature enhancement analysis on the defects using specific lighting techniques to form a feature map; and dynamically adjusting the output results using a temperature and humidity compensation algorithm. This application can adapt to different adhesive types, different PCB backgrounds, and different functional area requirements, and can consider environmental factors and batch differences in materials, improving the accuracy and reliability of detection and meeting the needs of high-quality production in the electronics manufacturing industry.

The invention relates to the field of composite nano materials and flexible electronic devices, and discloses a high-electric-transmission material for electronic manufacturing and a preparation method thereof.The preparation method comprises the steps that a biological template is adopted to induce spiral growth of copper nanowires, and nanowire array orientation regulation and control are achieved through a multi-field coupling assembly technology; constructing a porous transition layer on the surface of the nanowire, and preparing a gradient boron-nitrogen doped graphene shell layer in combination with ionic liquid assisted vapor deposition; and polydopamine is used for coating to form a rigid-flexible composite interface. The conductivity, bending fatigue resistance and environmental stability of the material are remarkably improved, the technical bottlenecks of efficient assembly and precise doping of nano materials are broken through, and the method is suitable for batch manufacturing of devices such as flexible circuits and sensors.

The invention relates to the technical field of high polymer materials, and discloses a packaging material applied to an ultra-dry reagent and a preparation method of the packaging material, the packaging material sequentially comprises a base material layer, a barrier enhancement layer and a heat sealing layer from outside to inside, each layer has specific component matching, and the barrier enhancement layer contains functional components such as modified vanillin and epoxy nano silicon dioxide. The preparation process comprises the steps of pretreatment and mixing of raw materials of all layers, extrusion and tape casting of membranes, co-extrusion compounding, cooling and shaping and the like. Through the synergistic effect of the layered structure and the components, the material has high water and oxygen barrier property, good mechanical property and chemical compatibility, can effectively prevent an ultra-dry reagent from absorbing water and going bad or being polluted, and is suitable for the fields of electronic manufacturing, biomedicine and the like.

This utility model belongs to the field of nanomaterial purification technology, and particularly relates to an environmentally friendly nanomaterial recycling device, including a base and a purification tank. A support frame is installed at the top of the base, a linear actuator is installed at the upper end of the support frame, a guide rod is fixed at the top of the support frame, and a lifting frame is installed outside the guide rod. The output end of the linear actuator is connected to the bottom end of the lifting frame. Through the rotary sleeve design and the quick locking mechanism of the positioning component, the material collection cylinder replacement time is shortened to a few seconds, significantly improving production continuity. Furthermore, by adopting a linkage design of pull handle and return spring, the material collection cylinder can be replaced without special tools, reducing manual operation intensity and minimizing the risk of misoperation. By adjusting the height of the lifting frame, the purification tank can be adapted to different specifications, making it compatible with various nanomaterial recycling processes and meeting the diverse needs of fields such as electronics manufacturing and catalyst production.

Methods and systems for integrating multiple, vertically oriented laser diode emitters into a low cost package suitable for high volume manufacturing are presented herein. Multiple laser diode based emitters are assembled on a mounting structure, which, in turn, is fixed to an insulated metal substrate. Each of the multiple laser diode based emitters are oriented such that the light output generated by each laser diode based emitter is aligned with a direction perpendicular to a mounting surface of the insulated metal substrate. In a further aspect, the insulated metal substrate includes electrically conductive layers disposed on the topside and backside of the thermally conductive metal core layer. Portions of the topside and backside electrical layers are electrically coupled such that the laser diode based illumination device is configured as a surface mount device amenable to low cost, surface mount, electronics manufacturing assembly processes.

This invention relates to the field of dispensing system equipment technology, specifically to a servo parameter adjustment method, system, equipment, and medium for a five-axis dispensing system. It establishes a dual-channel communication architecture, separating motion control and parameter adjustment paths. By defining thresholds, deltaCorner, and overshoot values ​​to quantify accuracy indicators, and through initialization, inertia ratio acquisition, servo rigidity estimation, and single-axis coarse and fine-tuning of the X / Y axes, the servo parameters are automatically adjusted. The PC software collects encoder data in real time, calculates the indicator parameters, and dynamically optimizes the speed feedforward and torque feedforward gains based on accuracy requirements until the target is met. This invention solves the problems of traditional manual parameter adjustment, which relies on experience, is inefficient, and has subjective accuracy, improving debugging efficiency and dispensing accuracy. It is applicable to five-axis dispensing equipment in the fields of electronics manufacturing and medical device manufacturing.

A composition comprising at least the following components a), b), and c), wherein a) at least one N-substituted piperazine selected from the following: structure (1) described herein, structure (2) described herein, or a mixture thereof; b) at least one glycol ether selected from the following: structure (3) described herein, structure (4) described herein, or a mixture thereof; and c) water.

The present application belongs to the technical field of intelligent manufacturing, and specifically relates to an intelligent production scheduling method for automobile electronic manufacturing, comprising the following steps: step S100: constructing a production scheduling model based on automobile electronic multi-stage production; step S200: dividing multiple constraint conditions of automobile electronic production into different priorities, and constructing a target function based on the priorities; step S300: solving the model by adopting a step-by-step genetic algorithm; and step S400: outputting a final iteration-optimized production scheduling scheme; the present application, on one hand, establishes a unique mathematical model through deep understanding of an actual automobile production scene, and better reflects constraint requirements on order sequences in an actual automobile electronic manufacturing scene; on the other hand, through a step-by-step processing scheme, specific constraint priorities and actual production influences are satisfied one by one, and the solving speed and solving quality are greatly improved.

Systems and methods are provided for electronic manufacturing, including use of a rigid tile-in-polymer film panel. Rigid tiles can be molded with a thin polymer composite to form the rigid tile-in-polymer film panel. The rigid panel can be made of silicon, glass, ceramic ribbon, or traditional glass fiber-reinforced laminates depending on the target product segment.