9 results about "Electronics manufacturing" patented technology

A fixing carrier unit for selective wave soldering and a fixing carrier assembled therefrom are disclosed, belonging to the technical field of soldering carriers in the electronics manufacturing industry. The unit includes a wave soldering substrate, an FPCA device mounted on the substrate, a connector inserted into the FPCA device, and a pressure block covering the FPCA device and connector. The pressure block includes a working surface in contact with the FPCA device and connector, and an upper surface opposite to the working surface. A cavity is formed on the working surface, the cavity having a through portion and a sealing portion. The through portion accommodates the protrusion of the connector, and a resilient pin is disposed on the pressure block of the sealing portion. This provides a novel selective wave soldering fixing carrier solution that uses the pressure block to limit the misalignment of the pins and FPC pads.

This invention relates to the field of structural adhesives, and particularly to a one-component epoxy structural adhesive and its preparation method. The one-component epoxy structural adhesive comprises, as a raw material, epoxy resin, toughening agent, curing agent, accelerator, silane coupling agent, defoamer, reinforcing agent, and inorganic filler. The one-component epoxy structural adhesive obtained by this invention exhibits high and durable adhesive strength to engineering plastics such as PBT, PA, and LCP, as well as metal terminals. After curing, the adhesive layer possesses excellent flexibility and resistance to thermal shock, safely withstanding the high temperatures of reflow soldering processes. As a one-component product, it must also possess excellent room temperature storage stability and rapid curing characteristics to meet the dual requirements of modern electronics manufacturing for material performance and process efficiency.

This invention discloses a high-temperature heating structure, its preparation method, and its application, belonging to the field of electrothermal technology. The invention first prepares an insulating blank, then forms a heating core by combining a conductive film and electrodes. The heating core is then sandwiched between two insulating blanks and pressed into a preform. After debinding, high-temperature treatment, and precision dimensional machining, wires are connected to obtain the high-temperature heating structure. This invention has advantages such as being polymer-free, double-sidedly insulated, safe and heat-resistant, capable of achieving an integrated structure, containing high-temperature resistant fibers resulting in high strength and resistance to thermal stress, a large heating area, uniform heating, simple process, and ease of large-scale production. It has wide applications in the field of precision thermal equipment in semiconductor and electronics manufacturing.

COATED SOLDER PASTE STENCIL AND THE METHOD OF PRODUCING THEREOF Embodiments of the present invention relate to the field of electronics 5 manufacturing or surface mount technology (SMT) and, more specifically, to solder paste stencils (1) with coatings on at least one of its surfaces (3a, 3b) and aperture wall (51), as well as a manufacturing method (100) for producing them. The invention introduces a coating process with specialized materials, aimed at preventing solder paste adherence and 10 enhancing hydrophobicity. The resulting coated solder paste stencil (1) exhibits improved solder paste flow, reduced clogging, and ensures precise deposition, enhance solder paste release capability, marking a significant advancement in electronics manufacturing. (The most illustrative figure is FIG. 1-A) 20 24 27 84 32 16 D ec 2 02 4 2 2 A B S T R A C T 2 0 2 4 2 7 8 4 3 2 1 6 D e c 2 0 2 4 C O A T E D S O L D E R P A S T E S T E N C I L A N D T H E M E T H O D O F P R O D U C I N G T H E R E O F E m b o d i m e n t s o f t h e p r e s e n t i n v e n t i o n r e l a t e t o t h e f i e l d o f e l e c t r o n i c s 5 m a n u f a c t u r i n g o r s u r f a c e m o u n t t e c h n o l o g y ( S M T ) a n d , m o r e s p e c i f i c a l l y , t o s o l d e r p a s t e s t e n c i l s ( 1 ) w i t h c o a t i n g s o n a t l e a s t o n e o f i t s s u r f a c e s ( 3 a , 3 b ) a n d a p e r t u r e w a l l ( 5 1 ) , a s w e l l a s a m a n u f a c t u r i n g m e t h o d ( 1 0 0 ) f o r p r o d u c i n g t h e m . T h e i n v e n t i o n i n t r o d u c e s a c o a t i n g p r o c e s s w i t h s p e c i a l i z e d m a t e r i a l s , a i m e d a t p r e v e n t i n g s o l d e r p a s t e a d h e r e n c e a n d 1 0 e n h a n c i n g h y d r o p h o b i c i t y . T h e r e s u l t i n g c o a t e d s o l d e r p a s t e s t e n c i l ( 1 ) e x h i b i t s i m p r o v e d s o l d e r p a s t e f l o w , r e d u c e d c l o g g i n g , a n d e n s u r e s p r e c i s e d e p o s i t i o n , e n h a n c e s o l d e r p a s t e r e l e a s e c a p a b i l i t y , m a r k i n g a s i g n i f i c a n t a d v a n c e m e n t i n e l e c t r o n i c s m a n u f a c t u r i n g . ( T h e m o s t i l l u s t r a t i v e f i g u r e i s F I G . 1 - A ) 2 2 A B S T R A C T 2 0 2 4 2 7 8 4 3 2 1 6 D e c 2 0 2 4 P R O D U C I N G T H E R E O F 1 / 5 FIG. 1-A FIG. 1-B FIG. 1-C 1 1 3, 3b 3, 3a 5 51 3, 3a 7 7 9 9 1 / 5 1 9 3,3b 7 FIG. 1-A 1 9 7 3,3a FIG. 1-B 3,3a 5 51 FIG. 1-C 20 24 27 84 32 16 D ec 2 02 4 1 / 5 1 1 6 D e c 2 0 2 4 9 3 , 3 b 7 2 0 2 4 2 7 8 4 3 2 F I G . 1 - A 1 9 7 3 , 3 a F I G . 1 - B 3 , 3 a 5 5 1 4 9 9 6 1 9 9 6 1 9 9 6 9 9 9 9 9 9 9 6 F I G . 1 - C 1 1 6 D e c 2 0 2 4 7 2 0 2 4 2 7 8 4 3 2 1 9 7 F I G . 1 - B 5 5 1 4 9 9 6 1 9 9 6 1 9 9 6 9 9 9 9 9 9 9 6 F I G . 1 - C

This utility model belongs to the field of nanomaterial purification technology, and particularly relates to an environmentally friendly nanomaterial recycling device, including a base and a purification tank. A support frame is installed at the top of the base, a linear actuator is installed at the upper end of the support frame, a guide rod is fixed at the top of the support frame, and a lifting frame is installed outside the guide rod. The output end of the linear actuator is connected to the bottom end of the lifting frame. Through the rotary sleeve design and the quick locking mechanism of the positioning component, the material collection cylinder replacement time is shortened to a few seconds, significantly improving production continuity. Furthermore, by adopting a linkage design of pull handle and return spring, the material collection cylinder can be replaced without special tools, reducing manual operation intensity and minimizing the risk of misoperation. By adjusting the height of the lifting frame, the purification tank can be adapted to different specifications, making it compatible with various nanomaterial recycling processes and meeting the diverse needs of fields such as electronics manufacturing and catalyst production.

This invention relates to the field of dispensing system equipment technology, specifically to a servo parameter adjustment method, system, equipment, and medium for a five-axis dispensing system. It establishes a dual-channel communication architecture, separating motion control and parameter adjustment paths. By defining thresholds, deltaCorner, and overshoot values ​​to quantify accuracy indicators, and through initialization, inertia ratio acquisition, servo rigidity estimation, and single-axis coarse and fine-tuning of the X / Y axes, the servo parameters are automatically adjusted. The PC software collects encoder data in real time, calculates the indicator parameters, and dynamically optimizes the speed feedforward and torque feedforward gains based on accuracy requirements until the target is met. This invention solves the problems of traditional manual parameter adjustment, which relies on experience, is inefficient, and has subjective accuracy, improving debugging efficiency and dispensing accuracy. It is applicable to five-axis dispensing equipment in the fields of electronics manufacturing and medical device manufacturing.

A composition comprising at least the following components a), b), and c), wherein a) at least one N-substituted piperazine selected from the following: structure (1) described herein, structure (2) described herein, or a mixture thereof; b) at least one glycol ether selected from the following: structure (3) described herein, structure (4) described herein, or a mixture thereof; and c) water.

The present application belongs to the technical field of intelligent manufacturing, and specifically relates to an intelligent production scheduling method for automobile electronic manufacturing, comprising the following steps: step S100: constructing a production scheduling model based on automobile electronic multi-stage production; step S200: dividing multiple constraint conditions of automobile electronic production into different priorities, and constructing a target function based on the priorities; step S300: solving the model by adopting a step-by-step genetic algorithm; and step S400: outputting a final iteration-optimized production scheduling scheme; the present application, on one hand, establishes a unique mathematical model through deep understanding of an actual automobile production scene, and better reflects constraint requirements on order sequences in an actual automobile electronic manufacturing scene; on the other hand, through a step-by-step processing scheme, specific constraint priorities and actual production influences are satisfied one by one, and the solving speed and solving quality are greatly improved.

This utility model relates to the field of mechanical equipment technology and discloses a nickel sheet braiding and slitting machine with waste recycling. It includes a support frame, a fixing plate, a mounting platform, a waste recycling bin, auxiliary structures, and a slitting structure. The support frame is stepped, with a braiding installation structure at the bottom and a flattening structure, a tensioning structure, and a stepping control structure at the top. The waste recycling bin is mounted on the side. The braiding installation structure allows for simultaneous feeding of multiple sets of materials. The auxiliary structure guides the braiding to prevent tangling, the flattening structure eliminates wrinkles, the tensioning structure adjusts tension, and the stepping control structure achieves precise conveying. The slitting structure completes cutting through the cooperation of a sliding rod and a slitting blade. Waste is guided into the recycling bin via a fixing rod. This equipment solves the problems of poor waste recycling, low slitting accuracy, and insufficient automation in traditional equipment, improving resource utilization, processing quality, and production efficiency. It is suitable for fields such as electronics manufacturing and battery production.