Grinding machine for preparing conductive silver adhesive for electronic product manufacturing

A technology of conductive silver glue and electronic products, which is applied in the field of grinding machines and can solve the problems of manual grinding and low grinding efficiency

Inactive Publication Date: 2017-07-21
苍南博雅科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

In this design described in this patents, two parts - one consisting of a machine's main body (a support), another component called a chuck assembly, including a pivot arm, bush holder, guide linkage, crank lever, linear actuator, cam member, sprinkler system, etc., can be attached together at different locations within their own components such as the housing, braking circuitry, power supply unit, electric motors, battery packs, and other related equipment. These designs allow for easy handling during use without having any hands involved while working with materials like conductor paste solder. Additionally, these systems have automatic adjustment features where they automatically control the movement between the various components based upon predetermined criteria. Overall, these technical improvements improve the performance and convenience associated with current methods for crushing electrically conductive pasty greens.

Problems solved by technology

This patented technical problem addressed by me relates to improving the quality control (QC) process during the fabricating or assembly processes used in producing electrical products such as integrated circuit chips due to poorly controlled conditions caused by insufficient contact between metal surfaces when manually polishing them without any tools.

Method used

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  • Grinding machine for preparing conductive silver adhesive for electronic product manufacturing
  • Grinding machine for preparing conductive silver adhesive for electronic product manufacturing
  • Grinding machine for preparing conductive silver adhesive for electronic product manufacturing

Examples

Experimental program
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Effect test

Embodiment 1

[0029] A grinder for the preparation of conductive silver glue for electronic product manufacturing, such as Figure 1-5 As shown, it includes a bottom plate 1, a left frame 2, a right frame 3, a top plate 4, a mounting plate 5, a grinding mechanism 6, a driving mechanism 7, and a sliding mechanism 8. The left frame 2 is installed on the top left end of the bottom plate 1, and the right end of the top plate 1 is installed. There is a right frame 3, a top plate 4 is installed on the top of the left frame 2, a mounting plate 5 is provided at the bottom of the top plate 4, a driving mechanism 7 is provided on the front side of the mounting plate 5, a sliding mechanism 8 is installed in the middle of the top of the bottom plate 1, and the upper part of the sliding mechanism 8 is connected with Grinding mechanism6.

Embodiment 2

[0031] A grinder for the preparation of conductive silver glue for electronic product manufacturing, such as Figure 1-5 As shown, it includes a bottom plate 1, a left frame 2, a right frame 3, a top plate 4, a mounting plate 5, a grinding mechanism 6, a driving mechanism 7, and a sliding mechanism 8. The left frame 2 is installed on the top left end of the bottom plate 1, and the right end of the top plate 1 is installed. There is a right frame 3, a top plate 4 is installed on the top of the left frame 2, a mounting plate 5 is provided at the bottom of the top plate 4, a driving mechanism 7 is provided on the front side of the mounting plate 5, a sliding mechanism 8 is installed in the middle of the top of the bottom plate 1, and the upper part of the sliding mechanism 8 is connected with Grinding mechanism6.

[0032]The grinding mechanism 6 includes a first bearing seat 61, a first rotating shaft 62, a grinding roller 63, a first connecting rod 64, a second connecting rod 65...

Embodiment 3

[0034] A grinder for the preparation of conductive silver glue for electronic product manufacturing, such as Figure 1-5 As shown, it includes a bottom plate 1, a left frame 2, a right frame 3, a top plate 4, a mounting plate 5, a grinding mechanism 6, a driving mechanism 7, and a sliding mechanism 8. The left frame 2 is installed on the top left end of the bottom plate 1, and the right end of the top plate 1 is installed. There is a right frame 3, a top plate 4 is installed on the top of the left frame 2, a mounting plate 5 is provided at the bottom of the top plate 4, a driving mechanism 7 is provided on the front side of the mounting plate 5, a sliding mechanism 8 is installed in the middle of the top of the bottom plate 1, and the upper part of the sliding mechanism 8 is connected with Grinding mechanism6.

[0035] The grinding mechanism 6 includes a first bearing seat 61, a first rotating shaft 62, a grinding roller 63, a first connecting rod 64, a second connecting rod 6...

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Abstract

The invention relates to a grinder, in particular to a grinder for preparing conductive silver glue for electronic product manufacturing. The technical problem to be solved by the present invention is to provide a grinding machine for preparing conductive silver glue for electronic product manufacturing without manual grinding, with high grinding efficiency and simple grinding operation. In order to solve the above technical problems, the present invention provides such a grinding machine for the preparation of conductive silver glue for electronic product manufacturing, which includes a bottom plate, a left frame, a right frame, a top plate, a mounting plate, a grinding mechanism, etc.; The right frame is installed at the right end of the bottom plate top, the top plate is installed at the top of the left frame, the mounting plate is provided at the bottom of the top plate, the driving mechanism is provided at the front side of the mounting plate, the sliding mechanism is installed in the middle of the top of the bottom plate, and the grinding mechanism is connected to the upper part of the sliding mechanism. The invention achieves the effects of no manual grinding, simple operation process and high grinding efficiency.

Description

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Claims

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Application Information

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Owner 苍南博雅科技有限公司
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