Patents
Literature
Patsnap Eureka AI that helps you search prior art, draft patents, and assess FTO risks, powered by patent and scientific literature data.

3 results about "Plastic electronics" patented technology

Plastic electronics, also known as organic and printable electronics, is an emerging field, which some experts say will revolutionise the electronics industry. The terms describe electronic devices made from carbon-based, organic materials and components, using printing processes, rather than traditional silicon-based, inorganic materials.

A novel nut anti-loosening structure

This utility model discloses a novel nut anti-loosening structure, relating to the field of mechanical fastener technology, and applicable to plastic electronic products, home appliances, automotive parts, and other fields. The structure includes a plastic housing, a metal nut embedded within the housing, and an anti-loosening plastic hole located at the outlet end of the threaded hole of the metal nut, all three being coaxially arranged. The diameter of the anti-loosening plastic hole is smaller than the nominal diameter of the screw and is integrally formed with the plastic housing; the metal nut is injection-molded and embedded within the housing. After the screw passes through the threaded hole of the metal nut, it is screwed into the anti-loosening plastic hole. The elastic deformation of the plastic generates a continuous radial clamping force and axial frictional resistance, effectively preventing the screw from loosening under high-frequency vibration or temperature change environments. This structure requires no additional anti-loosening parts, is low-cost, simple to manufacture, compact in structure, provides long-lasting anti-loosening force, and has high reliability, solving the problems of easy loosening in traditional structures and high cost of existing solutions.
Owner:SHENZHEN RED ORANGE INNOVATION TECH CO LTD

Wireless charging modular plastic electronic device stand

This utility model relates to the field of modular wireless charging technology, specifically a modular plastic electronic device holder for wireless charging. The utility model includes a holder body, on which a wireless charging module body is fixedly installed on the lower inner wall of the wireless charging slot. This utility model uses a clamping adjustment component to clamp the electronic device from both sides, achieving stable clamping and adapting to electronic devices of different sizes and weights. It provides stable support and fixation for the electronic device, ensuring that the electronic device maintains optimal alignment with the wireless charging module body during charging. Compared to some traditional holders on the market that use magnets to attach the back of the electronic device for charging, this avoids the electronic device shifting during charging, compromising the alignment accuracy between the wireless charging coil and the device's receiver, and thus preventing wireless charging interruption.
Owner:KUNSHAN YIJIASHENG ELECTRONIC CO LTD

Packaging process for preventing packaging layering of power device

The invention belongs to the technical field of plastic electronic packaging, and particularly relates to a packaging process for preventing packaging layering of a power device. Comprising the following steps: welding a chip on a lead frame; carrying out plasma cleaning on the lead frame welded with the chip; uniformly mixing a silane coupling agent and a diluent to obtain a glue solution; debugging the height of a glue spraying head, a glue spraying path and a glue spraying speed, so that the silane coupling agent is uniformly sputtered on the surface of the chip; carrying out plasma cleaning on the lead frame after spraying is completed again; carrying out plastic package curing on the chip by using a plastic package material to obtain a plastic package piece; in the plastic package curing process, glue solution molecules and a plastic package material are subjected to chemical reaction to form firm chemical bonds. The problems that in the prior art, after a large chip power device is packaged, due to the fact that the bonding strength of a plastic packaging material and the surface of the chip is insufficient, the layering defect is prone to occurring, the reliability of the device is reduced, and the service life is shortened are solved.
Owner:ZHENGZHOU XINGHANG TECH CO LTD