Plastic electronic tray

Abstract

The invention discloses a plastic electronic tray. The plastic electronic tray comprises a tray body; the front surface of the tray body is divided into multiple electronic chip placing platforms, uniformly distributed, by multiple forward projections uniformly distributed; the back surface of the tray body is divided into multiple electronic chip placing platforms, uniformly distributed, by multiple reverse projections uniformly distributed; an overlapped concave groove is formed in an outer ring of the tray body; the electronic chip placing platforms on the front and reverse surfaces of thetray body are corresponding one to one; the forward projections are uniformly distributed on four edges of the electronic chip placing platforms; and the reverse projections are uniformly distributedat four corners of the electronic chip placing platforms. Electronic chips can be placed on the front and reverse surfaces of the device; the front and reverse surfaces can be quickly operated in a precision range of a mechanical arm; the loaded electronic chips can be quickly overturned between upper and lower plastic electronic trays to realize quick overturning of whole stacks so as to greatlyimprove the production efficiency; and in the transportation process, the electronic chips are not easy to scatter, so that the vacuumizing process is reduced.

Description

technical field [0001] The invention relates to a tray, in particular to a plastic electronic tray, which belongs to the technical field of electronics. Background technique [0002] Traditional electronic chip packaging and transportation trays can only be used on one side, and cannot be placed on both sides and quickly turned over. The operation efficiency on the electronic chip assembly line is not high. Contents of the invention [0003] The technical problem to be solved by the present invention is to overcome the defects that the traditional electronic chip packaging and transportation tray can only realize the function of single-sided use, cannot satisfy the functions of both the front and back sides can be placed and quickly flipped, and the operation efficiency is not high on the electronic chip assembly line, and provides A plastic electronic tray. [0004] In order to solve the problems of the technologies described above, the present invention provides the fol...

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to overcome the defects that the traditional electronic chip packaging and transportation tray can only realize the function of single-sided use, cannot satisfy the functions of both the front and back sides can be placed and quickly flipped, and the operation efficiency is not high on the electronic chip assembly line, and provides A plastic electronic tray

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