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Wafer grinding equipment for electronic product manufacturing

A technology of electronic products and equipment, applied in grinding/polishing equipment, manufacturing tools, grinding devices, etc., can solve the problems of complex operation and low grinding efficiency, and achieve the effect of simple operation and improved grinding efficiency

Inactive Publication Date: 2017-07-11
苍南博雅科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the disadvantages that the current grinding equipment for grinding wafers cannot grind wafers of different sizes, the operation is complicated, and the grinding efficiency is not high, the technical problem to be solved by the invention is to provide a simple operation that can grind different sizes at the same time. Wafer, wafer grinding equipment for electronics manufacturing with high grinding efficiency

Method used

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  • Wafer grinding equipment for electronic product manufacturing
  • Wafer grinding equipment for electronic product manufacturing
  • Wafer grinding equipment for electronic product manufacturing

Examples

Experimental program
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Effect test

Embodiment 1

[0031] A wafer grinding equipment used in the manufacture of electronic products such as Figure 1-7 As shown, it includes a bottom plate 1, a left frame 2, a top plate 3, a grinding frame 4, a grinding sheet 5, an adjustment mechanism 6, a lifting mechanism 7, and a rotation mechanism 8. The left frame 2 is installed on the left side of the top of the bottom plate 1, and the top of the left frame 2 The top plate 3 is connected, the top right side of the bottom plate 1 is equipped with a rotating mechanism 8, the grinding frame 4 is connected to the rotating mechanism 8, the adjustment mechanism 6 is connected to the bottom of the grinding frame 4, the lifting mechanism 7 is installed in the middle of the bottom of the top plate 3, and the bottom of the lifting mechanism 7 A grinding sheet 5 is connected.

Embodiment 2

[0033] A wafer grinding equipment used in the manufacture of electronic products such as Figure 1-7As shown, it includes a bottom plate 1, a left frame 2, a top plate 3, a grinding frame 4, a grinding sheet 5, an adjustment mechanism 6, a lifting mechanism 7, and a rotation mechanism 8. The left frame 2 is installed on the left side of the top of the bottom plate 1, and the top of the left frame 2 The top plate 3 is connected, the top right side of the bottom plate 1 is equipped with a rotating mechanism 8, the grinding frame 4 is connected to the rotating mechanism 8, the adjustment mechanism 6 is connected to the bottom of the grinding frame 4, the lifting mechanism 7 is installed in the middle of the bottom of the top plate 3, and the bottom of the lifting mechanism 7 A grinding sheet 5 is connected.

[0034] The adjustment mechanism 6 includes a first slide block 61, a grinding disc 62, a fixed block 64, a first latch 65, a second latch 66 and a first slide rail 67. The b...

Embodiment 3

[0036] A wafer grinding equipment used in the manufacture of electronic products such as Figure 1-7 As shown, it includes a bottom plate 1, a left frame 2, a top plate 3, a grinding frame 4, a grinding sheet 5, an adjustment mechanism 6, a lifting mechanism 7, and a rotation mechanism 8. The left frame 2 is installed on the left side of the top of the bottom plate 1, and the top of the left frame 2 The top plate 3 is connected, the top right side of the bottom plate 1 is equipped with a rotating mechanism 8, the grinding frame 4 is connected to the rotating mechanism 8, the adjustment mechanism 6 is connected to the bottom of the grinding frame 4, the lifting mechanism 7 is installed in the middle of the bottom of the top plate 3, and the bottom of the lifting mechanism 7 A grinding sheet 5 is connected.

[0037] The adjustment mechanism 6 includes a first slide block 61, a grinding disc 62, a fixed block 64, a first latch 65, a second latch 66 and a first slide rail 67. The ...

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Abstract

The invention relates to a grinding device, in particular to a wafer grinding device used in the manufacture of electronic products. The technical problem to be solved by the present invention is to provide a wafer grinding device for the manufacture of electronic products which is simple in operation, capable of simultaneously grinding wafers of different sizes, and high in grinding efficiency. In order to solve the above-mentioned technical problems, the present invention provides such a wafer grinding equipment used in the manufacture of electronic products, which includes a bottom plate, a left frame, a top plate, a grinding frame, a grinding sheet, an adjustment mechanism, etc.; The top of the left frame is connected with a top plate, the right side of the top of the bottom plate is equipped with a rotating mechanism, the rotating mechanism is connected with a grinding frame, the bottom of the grinding frame is connected with an adjustment mechanism, the middle of the bottom of the top plate is installed with a lifting mechanism, and the bottom of the lifting mechanism is connected with a grinding sheet. In the invention, different wafers can be placed in different adjustment mechanisms and then ground, thereby achieving the effects of simple operation and high grinding efficiency.

Description

technical field [0001] The invention relates to a grinding device, in particular to a wafer grinding device used in the manufacture of electronic products. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. It can be processed into various circuit element structures on silicon wafers, and become IC products with specific electrical functions. The raw material of the wafer is silicon, and the surface of the earth's crust has an inexhaustible amount of silicon dioxide. Silica ore is refined by electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polysilicon, with a purity as high as 99.999999999%. [0003] The surface of the wafer needs to be ground. At present, the grinding equipment for grinding wafers cannot grind wafers of different sizes. The operation is complicated and the grinding efficiency i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/10B24B37/30B24B37/34B24B47/12
CPCB24B37/107B24B37/30B24B37/34B24B47/12
Inventor 杨连数
Owner 苍南博雅科技有限公司
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