Lead-free superfine glass powder and synthetic method thereof

Abstract

The invention discloses lead-free superfine glass powder and a synthetic method thereof. The lead-free superfine glass powder comprises the following components in percentage by weight: 35-55% of Bi2O3, 5-30% of SiO2, 5-25% of B2O3, 2-10% of ZnO and 1-5% of Al2O3 and is synthesized by respectively taking bismuth nitrate, ethyl orthosilicate, boracic acid, zinc acetate or zinc nitrate and aluminum isopropoxide or aluminum nitrate as the precursors of Bi2O3, SiO2, B2O3, ZnO and Al2O3, respectively taking deionized water, anhydrous ethanol, citric acid and nitric acid as a solvent, a complexing agent and a catalyst and adopting a sol-gel method. The lead-free superfine glass powder disclosed by the invention has the advantages of no lead, environment friendliness, high chemical stability, small powder particle size and high sintering activity, can be used as the inorganic binder of various ceramics and glass substrates and also be used as an inorganic binder phase and added to electronic paste, is easy to improve the printing and sintering property of the electronic paste through a screen mesh due to small particle size and has a wide application prospect in the fields of electronics and electrical appliances.

Description

technical field [0001] The invention belongs to the field of electronic materials, in particular to a lead-free ultrafine glass powder and a synthesis method thereof. Background technique [0002] In recent years, with the development of microelectronics technology, electronic display, and optoelectronic technology, electronic glass, as the basic material in the electronic field, is widely used in the sealing between ceramics, metals and glass to achieve vacuum sealing and ensure the stability of electronic components and reliability purposes; at the same time, electronic glass powder can also be mixed with metal powder and organic solvents to make electronic paste, which is widely used in the production of conductive electrodes on silicon solar cells, integrated circuits, automobiles, and electric heaters, as a sintering flux , has achieved the purpose of promoting metallurgical bonding between metal powder and substrate materials such as silicon wafers. [0003] The tra...

AI Technical Summary

Problems solved by technology

However, these patents all use the melting-quenching method to prepare glass frit, and then crush it into powder by ball milling. Undoubtedly, the melting and quenching method consumes a lot of energy to synthesize glass, and the powder is difficult to refine. The particle size is generally 1-10 μm Even in the coarser range, the sintering activity is low, and there are disadvantages such as component volatilization and local difficulty in uniformity of the melt when melting at high temperature.

Images