Transfer tool and transfer method

A transfer method and tool technology, applied in the direction of semiconductor devices, electrical components, conveyor objects, etc., can solve the problems of increasing process cost and time, lack of selectivity, etc.

Active Publication Date: 2021-08-10
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method lacks selectivity and all LEDs that the substrate touches will be transferred
When there are damaged LEDs or defective LEDs on the source substrate, these non-compliant LEDs will also be transferred to the target substrate, resulting in subsequent repair or replacement of the LEDs on the target substrate, which greatly increases the cost of the process and time

Method used

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  • Transfer tool and transfer method
  • Transfer tool and transfer method
  • Transfer tool and transfer method

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0078] refer to Figure 1A and Figure 1B , Figure 1A shows a top view of a transfer tool according to an embodiment of the invention, Figure 1B show Figure 1A The transfer tool shown is a cross-section along the line AA'. exist Figure 1A and Figure 1B In the example, the transfer tool 100 includes a substrate 101 , an array of active heating elements 102 and a pickup 103 . The active heating element array 102 includes a plurality of heating units 102H, and these heating units 102H are arranged in an array on the substrate 101, and each heating unit 102H includes a driving circuit and a heating element (not shown in the figure) connected to the driving circuit. Figure 1A and Figure 1B ). The pickup 103 is disposed on the active heating element array 102 and includes a pickup surface 103S. Such as Figure 1B As shown, different regions of the pick-up surface 103S correspond to different heating units 102H, so that different regions of the pick-up surface 103S can ha...

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Abstract

The invention discloses a transfer tool and a transfer method. The transfer tool comprises a substrate, an active heating element array and a pick-up piece. The active heating element array comprises a plurality of heating units, the heating units are arranged on the substrate in an array mode, and each heating unit comprises a driving circuit and a heating piece connected with the driving circuit. The pick-up piece is disposed on the active heating element array and includes a pick-up surface. The pick-up surface has a unique pick-up force and a modulated pick-up force smaller than the unique pick-up force in response to the operation of the plurality of heating elements.

Description

technical field [0001] The invention relates to a transfer tool and a transfer method. Background technique [0002] During the process, it is often necessary to use transfer technology to transfer the workpiece to the target position or target substrate. For example, in the manufacturing process of LED display devices, it is necessary to mass transfer a plurality of LEDs from a source substrate to a target substrate. In some processes, polydimethylsiloxane (PDMS) is used as a carrier for transferring light-emitting diodes, and the light-emitting diodes are transferred to a target substrate by using van der Waals force between the carrier and the light-emitting diodes. However, this method lacks selectivity, as all LEDs that the substrate touches are transferred. When there are damaged LEDs or defective LEDs on the source substrate, these non-compliant LEDs will also be transferred to the target substrate, resulting in subsequent repair or replacement of the LEDs on the ta...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H01L21/67H01L21/677H01L21/683H01L33/48H01L25/075H01L27/15
CPCH01L21/67144H01L21/67721H01L21/67736H01L21/683H01L33/48H01L25/0753H01L27/156H01L2933/0033
Inventor萧博唐
OwnerAU OPTRONICS CORP